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Extract from the Register of European Patents

EP About this file: EP3944322

EP3944322 - METHOD FOR MANUFACTURING A MICROELECTRONIC DEVICE [Right-click to bookmark this link]
StatusNo opposition filed within time limit
Status updated on  28.03.2025
Database last updated on 10.05.2025
FormerThe patent has been granted
Status updated on  19.04.2024
FormerGrant of patent is intended
Status updated on  18.12.2023
FormerRequest for examination was made
Status updated on  24.12.2021
Most recent event   Tooltip25.04.2025Lapse of the patent in a contracting state
New state(s): BE, CH, SI		published on 28.05.2025 [2025/22]
Applicant(s)For all designated states
Commissariat à l'Energie Atomique et aux Energies Alternatives
25 Rue Leblanc
Bat Le Ponant
75015 Paris / FR
[2024/44]
Former [2024/03]For all designated states
Commissariat à l'énergie atomique et aux énergies alternatives
Bat le Ponant
25 rue Leblanc
75015 Paris / FR
Former [2022/04]For all designated states
Commissariat à l'énergie atomique et aux énergies alternatives
Bâtiment "Le Ponant D"
25 rue Leblanc
75015 Paris / FR
Inventor(s)01 / NIEBOJEWSKI, Heimanu
38054 GRENOBLE CEDEX 09 / FR
02 / ANDRIEU, François
38054 GRENOBLE CEDEX 09 / FR
03 / FENOUILLET-BERANGER, Claire
38054 GRENOBLE CEDEX 09 / FR
 [2022/04]
Representative(s)Brevalex
Tour Trinity
1 B Place de la Défense
92400 Courbevoie / FR
[2024/21]
Former [2022/04]Brevalex
95, rue d'Amsterdam
75378 Paris Cedex 8 / FR
Application number, filing date21186804.720.07.2021
[2022/04]
Priority number, dateFR2020000768422.07.2020         Original published format: FR 2007684
[2022/04]
Filing languageFR
Procedural languageFR
PublicationType: A1 Application with search report 
No.:EP3944322
Date:26.01.2022
Language:FR
[2022/04]
Type: B1 Patent specification 
No.:EP3944322
Date:22.05.2024
Language:FR
[2024/21]
Search report(s)(Supplementary) European search report - dispatched on:EP23.11.2021
ClassificationIPC:H01L27/13, H01L21/84, H01L21/762
[2023/52]
CPC:
H10D86/80 (EP,US); H01L21/76224 (US); H01L21/76232 (EP);
H01L21/76283 (EP,US); H10D62/10 (US); H10D64/01 (US);
H10D86/01 (EP); H10D1/20 (EP) (-)
Former IPC [2022/04]H01L27/13, H01L21/84, H01L21/762, H01L49/02
Designated contracting statesAL,   AT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HR,   HU,   IE,   IS,   IT,   LI,   LT,   LU,   LV,   MC,   MK,   MT,   NL,   NO,   PL,   PT,   RO,   RS,   SE,   SI,   SK,   SM,   TR [2022/04]
TitleGerman:VERFAHREN ZUR HERSTELLUNG EINER MIKROELEKTRONISCHEN VORRICHTUNG[2022/04]
English:METHOD FOR MANUFACTURING A MICROELECTRONIC DEVICE[2022/04]
French:PROCÉDÉ DE FABRICATION D'UN DISPOSITIF MICROÉLECTRONIQUE[2022/04]
Examination procedure20.07.2021Examination requested  [2022/04]
07.02.2022Amendment by applicant (claims and/or description)
19.12.2023Communication of intention to grant the patent
12.04.2024Fee for grant paid
12.04.2024Fee for publishing/printing paid
12.04.2024Receipt of the translation of the claim(s)
Opposition(s)25.02.2025No opposition filed within time limit [2025/18]
Fees paidRenewal fee
21.07.2023Renewal fee patent year 03
Opt-out from the exclusive  Tooltip
competence of the Unified
Patent Court		 See the Register of the Unified Patent Court for opt-out data
Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Lapses during opposition  TooltipAT22.05.2024
BG22.05.2024
CZ22.05.2024
DK22.05.2024
EE22.05.2024
ES22.05.2024
FI22.05.2024
HR22.05.2024
IT22.05.2024
LV22.05.2024
MC22.05.2024
NL22.05.2024
PL22.05.2024
RO22.05.2024
SI22.05.2024
SK22.05.2024
LU20.07.2024
BE31.07.2024
CH31.07.2024
NO22.08.2024
RS22.08.2024
GR23.08.2024
IS22.09.2024
PT23.09.2024
[2025/22]
Former [2025/17]AT22.05.2024
BG22.05.2024
CZ22.05.2024
DK22.05.2024
EE22.05.2024
ES22.05.2024
FI22.05.2024
HR22.05.2024
IT22.05.2024
LV22.05.2024
MC22.05.2024
NL22.05.2024
PL22.05.2024
RO22.05.2024
SK22.05.2024
LU20.07.2024
NO22.08.2024
RS22.08.2024
GR23.08.2024
IS22.09.2024
PT23.09.2024
Former [2025/11]AT22.05.2024
BG22.05.2024
CZ22.05.2024
DK22.05.2024
EE22.05.2024
ES22.05.2024
FI22.05.2024
HR22.05.2024
IT22.05.2024
LV22.05.2024
MC22.05.2024
NL22.05.2024
PL22.05.2024
RO22.05.2024
SK22.05.2024
NO22.08.2024
RS22.08.2024
GR23.08.2024
IS22.09.2024
PT23.09.2024
Former [2025/10]AT22.05.2024
BG22.05.2024
CZ22.05.2024
DK22.05.2024
EE22.05.2024
ES22.05.2024
FI22.05.2024
HR22.05.2024
LV22.05.2024
NL22.05.2024
PL22.05.2024
RO22.05.2024
SK22.05.2024
NO22.08.2024
RS22.08.2024
GR23.08.2024
IS22.09.2024
PT23.09.2024
Former [2025/09]AT22.05.2024
BG22.05.2024
DK22.05.2024
EE22.05.2024
ES22.05.2024
FI22.05.2024
HR22.05.2024
LV22.05.2024
NL22.05.2024
PL22.05.2024
NO22.08.2024
RS22.08.2024
GR23.08.2024
IS22.09.2024
PT23.09.2024
Former [2025/08]AT22.05.2024
BG22.05.2024
DK22.05.2024
ES22.05.2024
FI22.05.2024
HR22.05.2024
LV22.05.2024
NL22.05.2024
PL22.05.2024
NO22.08.2024
RS22.08.2024
GR23.08.2024
IS22.09.2024
PT23.09.2024
Former [2024/49]AT22.05.2024
BG22.05.2024
ES22.05.2024
FI22.05.2024
HR22.05.2024
LV22.05.2024
NL22.05.2024
PL22.05.2024
NO22.08.2024
RS22.08.2024
GR23.08.2024
IS22.09.2024
PT23.09.2024
Former [2024/48]AT22.05.2024
BG22.05.2024
ES22.05.2024
FI22.05.2024
HR22.05.2024
NL22.05.2024
NO22.08.2024
GR23.08.2024
IS22.09.2024
PT23.09.2024
Former [2024/47]BG22.05.2024
FI22.05.2024
HR22.05.2024
NL22.05.2024
NO22.08.2024
GR23.08.2024
IS22.09.2024
PT23.09.2024
Documents cited:Search[IA]US2002079537  (HOUSTON THEODORE W [US]);
 [IA]US2002171120  (MAEDA SHIGENOBU [JP], et al);
 [IA]US2012025345  (BOTULA ALAN B [US], et al);
 [IA]US2014084412  (CHOU ANTHONY I [US], et al);
 [IA]WO2017142849  (SUNEDISON SEMICONDUCTOR LTD [SG]);
 [A]EP3531444  (ST MICROELECTRONICS CROLLES 2 SAS [FR]);
 [IA]FR3091004  (SOITEC SILICON ON INSULATOR [FR]);
 [IA]US2020219760  (KANTAROVSKY JOHNATAN A [US], et al)
by applicantUS5773151
 US2018069079
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.