-
EP3951870
European procedure
- EP About this file
- EP Legal status
- EP Federated register
- EP Event history
- EP Citations
- EP Patent family
- EP All documents
Extract from the Register of European Patents
EP About this file: EP3951870
| EP3951870 - METHOD FOR FORMING A FAN-OUT PACKAGE STRUCTURE [Right-click to bookmark this link] | Status | Examination is in progress Status updated on 29.03.2024 Database last updated on 18.11.2024 | |
| Former | Request for examination was made Status updated on 05.08.2022 | ||
| Former | The application has been published Status updated on 07.01.2022 | Most recent event Tooltip | 25.08.2024 | New entry: Date of oral proceedings | Applicant(s) | For all designated states MEDIATEK Inc. No. 1, Dusing Road 1st Science-Based Industrial Park Hsin-Chu 300 / TW | [2022/06] | Inventor(s) | 01 /
LIN, Tzu-Hung 302 Zhubei City / TW | 02 /
PENG, I-Hsuan 300 Hsinchu City / TW | 03 /
HSIAO, Ching-Wen 300 Hsinchu City / TW | 04 /
LIU, Nai-Wei 830 Kaohsiung City / TW | 05 /
HUANG, Wei-Che 310 Hsinchu County / TW | [2022/06] | Representative(s) | Goddar, Heinz J. Boehmert & Boehmert Anwaltspartnerschaft mbB Pettenkoferstrasse 22 80336 München / DE | [2022/06] | Application number, filing date | 21195647.9 | 10.02.2017 | [2022/06] | Priority number, date | US201662297995P | 22.02.2016 Original published format: US 201662297995 P | US201715418896 | 30.01.2017 Original published format: US201715418896 | [2022/06] | Filing language | EN | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | EP3951870 | Date: | 09.02.2022 | Language: | EN | [2022/06] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 09.12.2021 | Classification | IPC: | H01L25/16, H01L25/10, H01L23/498, // H01L23/31, H01L21/56 | [2022/06] | CPC: |
H01L23/3128 (EP,CN,US);
H01L24/14 (CN);
H01L23/5389 (EP,US);
H01L21/4853 (US);
H01L21/4857 (US);
H01L21/486 (EP,US);
H01L21/565 (US);
H01L23/3114 (US);
H01L23/49811 (EP,US);
H01L23/5383 (EP,US);
H01L23/5384 (EP,US);
H01L23/5386 (US);
H01L24/11 (CN);
H01L25/0657 (EP,US);
H01L25/105 (EP,US);
H01L25/16 (EP,US);
H01L25/50 (EP,US);
H01L28/10 (EP,US);
H01L28/20 (EP,US);
H01L28/40 (EP,US);
H01L21/568 (EP,US);
H01L2224/0401 (EP,US);
H01L2224/1401 (CN);
H01L2224/141 (CN);
H01L2224/16238 (EP,US);
H01L2224/32145 (EP,US);
H01L2224/32225 (EP,US);
H01L2224/48091 (EP,US);
H01L2224/48227 (EP,US);
H01L2224/73265 (EP,US);
H01L2224/81005 (EP,US);
H01L2225/0651 (EP,US);
H01L2225/06568 (EP,US);
H01L2225/06582 (US);
H01L2225/1023 (EP,US);
H01L2225/1035 (US);
H01L2225/1058 (EP,US);
H01L2225/1088 (EP,US);
H01L24/16 (EP,US);
H01L24/32 (EP,US);
H01L24/48 (EP,US);
H01L24/73 (EP,US);
H01L24/81 (EP,US);
H01L2924/00014 (EP,US);
H01L2924/1431 (EP,US);
H01L2924/1432 (EP,US);
H01L2924/1436 (EP,US);
H01L2924/15192 (EP,US);
H01L2924/15311 (EP,US);
H01L2924/15331 (EP,US);
H01L2924/1815 (EP);
H01L2924/18161 (EP,US);
H01L2924/19041 (EP,US);
H01L2924/19042 (EP,US);
H01L2924/19043 (EP,US);
H01L2924/19105 (EP,US);
H01L2924/19106 (EP,US);
H01L2924/37001 (EP,US)
(-)
| C-Set: |
H01L2224/48091, H01L2924/00014 (US,EP);
H01L2224/73265, H01L2224/32145, H01L2224/48227, H01L2924/00012 (US,EP);
H01L2224/73265, H01L2224/32225, H01L2224/48227, H01L2924/00012 (EP,US);
H01L2924/00014, H01L2224/45099 (US,EP); | Designated contracting states | AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR [2022/36] |
| Former [2022/06] | AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR | Title | German: | VERFAHREN ZUR HERSTELLUNG EINER FAN-OUT-VERPACKUNGSSTRUKTUR | [2022/06] | English: | METHOD FOR FORMING A FAN-OUT PACKAGE STRUCTURE | [2022/06] | French: | PROCÉDÉ DE FABRICATION UNE STRUCTURE BOÎTIER DE SORTANCE | [2022/06] | Examination procedure | 03.08.2022 | Amendment by applicant (claims and/or description) | 03.08.2022 | Examination requested [2022/36] | 03.08.2022 | Date on which the examining division has become responsible | 02.04.2024 | Despatch of a communication from the examining division (Time limit: M04) | 09.07.2024 | Reply to a communication from the examining division | 20.03.2025 | Date of oral proceedings | Parent application(s) Tooltip | EP17155522.0 / EP3208848 | Fees paid | Renewal fee | 09.09.2021 | Renewal fee patent year 03 | 09.09.2021 | Renewal fee patent year 04 | 09.09.2021 | Renewal fee patent year 05 | 02.03.2022 | Renewal fee patent year 06 | 15.02.2023 | Renewal fee patent year 07 | 15.02.2024 | Renewal fee patent year 08 | Penalty fee | Additional fee for renewal fee | 28.02.2022 | 06 M06 Fee paid on 14.03.2022 |
| Opt-out from the exclusive Tooltip competence of the Unified Patent Court | See the Register of the Unified Patent Court for opt-out data | ||
| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [Y]US2010265682 (MARTINEZ LIANE [CA], et al); | [Y]US2012049338 (CHEN KUANG-HSIUNG [TW], et al); | [AD]CN102709260 (ADVANCED SEMICONDUCTOR ENG); | [Y]US2014084416 (KANG TAE-HO [KR]) | Examination | KR20150003507 | US9543242 | by applicant | US2012211885 | CN102709260 | US2015041987 | US2015125999 | EP2937900 |