-
EP4020548
European procedure
- EP About this file
- EP Legal status
- EP Federated register
- EP Event history
- EP Citations
- EP Patent family
- EP All documents
Extract from the Register of European Patents
EP About this file: EP4020548
| EP4020548 - MULTI-STEP ISOTROPIC ETCH PATTERNING OF THICK COPPER LAYERS FOR FORMING HIGH ASPECT-RATIO CONDUCTORS [Right-click to bookmark this link] | Status | Request for examination was made Status updated on 28.10.2022 Database last updated on 12.11.2024 | |
| Former | The application has been published Status updated on 27.05.2022 | Most recent event Tooltip | 30.08.2024 | New entry: Renewal fee paid | Applicant(s) | For all designated states INTEL Corporation 2200 Mission College Blvd. Santa Clara, CA 95054 / US | [2022/26] | Inventor(s) | 01 /
Fadayomi, Oladeji Chandler, 85226 / US | 02 /
Ecton, Jeremy Gilbert, 85298 / US | 03 /
Ojeda, Oscar Chandler, 85248 / US | [2022/26] | Representative(s) | Goddar, Heinz J. Boehmert & Boehmert Anwaltspartnerschaft mbB Pettenkoferstrasse 22 80336 München / DE | [2022/26] | Application number, filing date | 21196207.1 | 13.09.2021 | [2022/26] | Priority number, date | US202017132282 | 23.12.2020 Original published format: US202017132282 | [2022/26] | Filing language | EN | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | EP4020548 | Date: | 29.06.2022 | Language: | EN | [2022/26] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 05.04.2022 | Classification | IPC: | H01L23/498, H01L21/48 | [2022/26] | CPC: |
H01L23/49822 (EP);
H01L21/32139 (CN);
H01L21/4846 (US);
H01L21/0274 (CN);
H01L21/32134 (CN);
H01L21/4857 (EP);
| Designated contracting states | AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR [2022/48] |
| Former [2022/26] | AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR | Extension states | BA | Not yet paid | ME | Not yet paid | Validation states | KH | Not yet paid | MA | Not yet paid | MD | Not yet paid | TN | Not yet paid | Title | German: | MEHRSTUFIGES ISOTROPES ÄTZEN VON DICKEN KUPFERSCHICHTEN ZUR HERSTELLUNG VON LEITERN MIT HOHEM ASPEKTVERHÄLTNIS | [2022/26] | English: | MULTI-STEP ISOTROPIC ETCH PATTERNING OF THICK COPPER LAYERS FOR FORMING HIGH ASPECT-RATIO CONDUCTORS | [2022/26] | French: | FORMATION DE MOTIFS DE GRAVURE ISOTROPE EN PLUSIEURS ÉTAPES DE COUCHES DE CUIVRE ÉPAISSES POUR FORMER DES CONDUCTEURS À HAUT RAPPORT D'ASPECT | [2022/26] | Examination procedure | 25.10.2022 | Amendment by applicant (claims and/or description) | 25.10.2022 | Examination requested [2022/48] | 25.10.2022 | Date on which the examining division has become responsible | Fees paid | Renewal fee | 29.08.2023 | Renewal fee patent year 03 | 29.08.2024 | Renewal fee patent year 04 |
| Opt-out from the exclusive Tooltip competence of the Unified Patent Court | See the Register of the Unified Patent Court for opt-out data | ||
| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [X]US5118385 (KUMAR NALIN [US], et al) [X] 1,5,6,9,10,12* column 2, line 4 - column 3, line 59; figure 9 *; | [X]US2010263923 (KODANI KOTARO [JP], et al) [X] 1,5,6,9,10,12,15 * paragraph [0155]; figure 40 *; | [XI]US2012222894 (KANEKO KENTARO [JP], et al) [X] 1,2,5,6,9,10,12,15 * paragraphs [0137] - [0140]; figure 19A * [I] 3,4,7,8,11,13,14 |