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EP3968367
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EP About this file: EP3968367
| EP3968367 - OPTIMAL SIGNAL ROUTING PERFORMANCE THROUGH DIELECTRIC MATERIAL CONFIGURATION DESIGNS IN PACKAGE SUBSTRATE [Right-click to bookmark this link] | Status | Request for examination was made Status updated on 23.09.2022 Database last updated on 02.11.2024 | |
| Former | The application has been published Status updated on 11.02.2022 | Most recent event Tooltip | 12.01.2024 | New entry: Renewal fee paid | Applicant(s) | For all designated states INTEL Corporation 2200 Mission College Blvd. Santa Clara, CA 95054 / US | [2022/11] | Inventor(s) | 01 /
QIAN, Zhiguo Chandler, 85249 / US | 02 /
DUAN, Gang Chandler, 85248 / US | 03 /
AYGÜN, Kemal Tempe, 85284 / US | 04 /
KONG, Jieying Chandler, 85248 / US | [2022/11] | Representative(s) | 2SPL Patentanwälte PartG mbB Landaubogen 3 81373 München / DE | [2022/11] | Application number, filing date | 21196285.7 | 18.03.2020 | [2022/11] | Priority number, date | US201916392171 | 23.04.2019 Original published format: US201916392171 | [2022/11] | Filing language | EN | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | EP3968367 | Date: | 16.03.2022 | Language: | EN | [2022/11] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 10.02.2022 | Classification | IPC: | H01L23/14, H01L23/498, H01L23/538 | [2022/11] | CPC: |
H01L23/145 (EP);
H01L23/49822 (EP,CN,US);
H01L23/49894 (EP,CN,US);
H01L21/481 (US);
H01L21/4857 (CN,US);
H01L21/486 (US);
H01L23/49838 (CN,US);
H01L23/5383 (EP);
H01L23/66 (US);
H01L2224/16225 (EP)
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| Designated contracting states | AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR [2022/43] |
| Former [2022/11] | AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR | Title | German: | OPTIMALES SIGNALROUTING DURCH KONFIGURATION DIELEKTRISCHER SUBSTRATMATERIALIEN | [2022/11] | English: | OPTIMAL SIGNAL ROUTING PERFORMANCE THROUGH DIELECTRIC MATERIAL CONFIGURATION DESIGNS IN PACKAGE SUBSTRATE | [2022/11] | French: | PERFORMANCE OPTIMALE DE ROUTAGE DE SIGNAUX PAR CONFIGURATION DE MATÉRIAUX DIÉLECTRIQUES DANS UN SUBSTRAT D'EMBALLAGE | [2022/11] | Examination procedure | 05.08.2022 | Amendment by applicant (claims and/or description) | 16.09.2022 | Examination requested [2022/43] | 16.09.2022 | Date on which the examining division has become responsible | Parent application(s) Tooltip | EP20164003.4 / EP3731266 | Fees paid | Renewal fee | 01.03.2022 | Renewal fee patent year 03 | 27.02.2023 | Renewal fee patent year 04 | 11.01.2024 | Renewal fee patent year 05 |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [A]EP0502614 (FUJITSU LTD [JP]) [A] 1-11* column 3, line 16 - column 5, line 51; figures 1-7, 19-25 *; | [A]JP2002093903 (MATSUSHITA ELECTRIC IND CO LTD) [A] 1-11 * paragraphs [0103] - [0110]; figure 5 *; | [A]US2006285273 (CHANG CHIH-HAO [TW], et al) [A] 1-11 * paragraphs [0036] - [0042]; figure 3A *; | [XA]US2007102806 (HORN KEVIN [US], et al) [X] 1,11 * paragraph [0021]; figure 5 * [A] 2-10; | [A]US2018376594 (HANAO MASAAKI [JP], et al) [A] 1-11 * paragraphs [0101] - [0115]; figures 9, 10 * |