Extract from the Register of European Patents

EP About this file: EP4016642

EP4016642 - FABRICATION OF THIN FILM FIN TRANSISTOR STRUCTURE [Right-click to bookmark this link]
StatusExamination is in progress
Status updated on  05.07.2024
Database last updated on 11.04.2026
FormerRequest for examination was made
Status updated on  30.12.2022
FormerThe application has been published
Status updated on  20.05.2022
Most recent event   Tooltip29.08.2025New entry: Renewal fee paid 
Applicant(s)For all designated states
Intel Corporation
2200 Mission College Boulevard
Santa Clara, CA 95054 / US
[2022/25]
Inventor(s)01 / SATO, Noriyuki
Hillsboro, 97124 / US
02 / ATANASOV, Sarah
Beaverton, 97003 / US
03 / SHARMA, Abhishek Anil
Portland, 97229 / US
04 / SELL, Bernhard
Portland, 97229 / US
05 / KU, Chieh-Jen
HILLSBORO, 97124 / US
06 / TAN, Elliot
Portland, 97201 / US
07 / YOO, Hui Jae
Hillsboro, 97124 / US
08 / LAJOIE, Travis
Forest Grove, 97116 / US
09 / LE, Van
Beaverton, 97007 / US
10 / WANG, Pei-Hua
Beaverton, 97006 / US
11 / PECK, Jason
Hillsboro, 97124 / US
12 / BROWN-HEFT, Tobias
Portland, 97201 / US
 [2022/25]
Representative(s)2SPL Patentanwälte PartG mbB
Landaubogen 3
81373 München / DE
[2022/25]
Application number, filing date21198468.723.09.2021
[2022/25]
Priority number, dateUS20201712986721.12.2020         Original published format: US202017129867
[2022/25]
Filing languageEN
Procedural languageEN
PublicationType: A1 Application with search report 
No.:EP4016642
Date:22.06.2022
Language:EN
[2022/25]
Search report(s)(Supplementary) European search report - dispatched on:EP02.03.2022
ClassificationIPC:H01L29/66, H01L29/78
[2022/25]
CPC:
H10D30/62 (EP,CN,KR); H10D30/024 (EP,CN,KR,US); H10D30/026 (EP);
H10D30/611 (CN); H10D84/0158 (US); H10D84/038 (US);
H10D84/853 (US); H10W90/00 (KR) (-)
Designated contracting statesAL,   AT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HR,   HU,   IE,   IS,   IT,   LI,   LT,   LU,   LV,   MC,   MK,   MT,   NL,   NO,   PL,   PT,   RO,   RS,   SE,   SI,   SK,   SM,   TR [2023/05]
Former [2022/25]AL,  AT,  BE,  BG,  CH,  CY,  CZ,  DE,  DK,  EE,  ES,  FI,  FR,  GB,  GR,  HR,  HU,  IE,  IS,  IT,  LI,  LT,  LU,  LV,  MC,  MK,  MT,  NL,  NO,  PL,  PT,  RO,  RS,  SE,  SI,  SK,  SM,  TR 
Extension statesBANot yet paid
MENot yet paid
Validation statesKHNot yet paid
MANot yet paid
MDNot yet paid
TNNot yet paid
TitleGerman:HERSTELLUNG EINER DÜNNFILMTRANSISTORSTRUKTUR[2022/25]
English:FABRICATION OF THIN FILM FIN TRANSISTOR STRUCTURE[2022/25]
French:FABRICATION D'UNE STRUCTURE DE TRANSISTOR À AILETTES À FILM MINCE[2022/25]
Examination procedure21.12.2022Amendment by applicant (claims and/or description)
22.12.2022Examination requested  [2023/05]
22.12.2022Date on which the examining division has become responsible
04.07.2024Despatch of a communication from the examining division (Time limit: M04)
15.10.2024Reply to a communication from the examining division
Fees paidRenewal fee
29.08.2023Renewal fee patent year 03
29.08.2024Renewal fee patent year 04
28.08.2025Renewal fee patent year 05
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Documents cited:Search[XI] US5607865  (CHOI JONG M et al.) [X] 1,2,4-9,11-15 * the whole document *[I] 3,10
 [XA] US6069390  (HSU LOUIS LU-CHEN et al.) [X] 9-15 * column 3, line 16 - column 4, line 51; figures 1-3 *[A] 5
 [XI] US5309010  (KITAJIMA HIROSHI et al.) [X] 1,2,4,6-9,11-13,15 * column 7, line 15 - column 8, line 56; figures 3-7B *[I] 3,10
 [X] US2015303299  (CHANG HUNG-CHIH et al.) [X] 1-4,6,9,10,13,15 * paragraph [0045] - paragraph [0057]; figures 6A-11B *
 [X] US2015364592  (VAN DAL MARK et al.) [X] 1-4,6,9,13,15 * paragraph [0071] - paragraph [0072]; figures 25-29 * * paragraph [0037] * * paragraph [0041] *
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