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EP4009368
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EP About this file: EP4009368
| EP4009368 - SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME [Right-click to bookmark this link] | Status | Request for examination was made Status updated on 24.02.2023 Database last updated on 19.07.2024 | |
| Former | The application has been published Status updated on 06.05.2022 | Most recent event Tooltip | 24.11.2023 | New entry: Renewal fee paid | Applicant(s) | For all designated states Renesas Electronics Corporation 2-24, Toyosu 3-chome Koto-ku Tokyo 135-0061 / JP | [2022/23] | Inventor(s) | 01 /
MARUYAMA, Takahiro Tokyo 135-0061 / JP | [2022/23] | Representative(s) | Betten & Resch Patent- und Rechtsanwälte PartGmbB Maximiliansplatz 14 80333 München / DE | [2022/23] | Application number, filing date | 21207618.6 | 10.11.2021 | [2022/23] | Priority number, date | JP20200188455 | 12.11.2020 Original published format: JP 2020188455 | [2022/23] | Filing language | EN | Procedural language | EN | Publication | Type: | A2 Application without search report | No.: | EP4009368 | Date: | 08.06.2022 | Language: | EN | [2022/23] | Type: | A3 Search report | No.: | EP4009368 | Date: | 17.08.2022 | Language: | EN | [2022/33] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 13.07.2022 | Classification | IPC: | H01L27/1159, H01L27/11597, H01L29/51, H01L29/66, H01L29/78 | [2022/23] | CPC: |
H01L29/6684 (EP,KR,US);
H10B51/30 (EP,CN,KR,US);
H01L29/78391 (EP,KR,US);
H01L29/40111 (CN,KR);
H01L29/516 (CN,KR);
H01L29/66795 (US);
H01L29/7851 (US)
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| Designated contracting states | AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR [2023/13] |
| Former [2022/23] | AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR | Extension states | BA | Not yet paid | ME | Not yet paid | Validation states | KH | Not yet paid | MA | Not yet paid | MD | Not yet paid | TN | Not yet paid | Title | German: | HALBLEITERBAUELEMENT UND VERFAHREN ZUR HERSTELLUNG DAVON | [2022/23] | English: | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | [2022/23] | French: | DISPOSITIF À SEMICONDUCTEURS ET SON PROCÉDÉ DE FABRICATION | [2022/23] | Examination procedure | 17.02.2023 | Amendment by applicant (claims and/or description) | 17.02.2023 | Examination requested [2023/13] | 17.02.2023 | Date on which the examining division has become responsible | Fees paid | Renewal fee | 24.11.2023 | Renewal fee patent year 03 |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [Y]US2007272959 (HIDAKA OSAMU [JP], et al); | [X]US2014070289 (TANAKA MASAYUKI [JP], et al); | [XY]US2015179657 (INUMIYA SEIJI [JP]); | [XAY]US9853150 (COLINGE JEAN-PIERRE [TW], et al) |