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EP4187591
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Extract from the Register of European Patents
EP About this file: EP4187591
| EP4187591 - BASEPLATE AND METHOD FOR MANUFACTURING A BASEPLATE FOR A POWER MODULE AND SEMICONDUCTOR DEVICE [Right-click to bookmark this link] | Status | Grant of patent is intended Status updated on 12.09.2024 Database last updated on 02.11.2024 | |
| Former | Examination is in progress Status updated on 01.12.2023 | ||
| Former | Request for examination was made Status updated on 15.09.2023 | ||
| Former | The application has been published Status updated on 28.04.2023 | Most recent event Tooltip | 12.09.2024 | New entry: Communication of intention to grant a patent | Applicant(s) | For all designated states Hitachi Energy Ltd Brown-Boveri-Strasse 5 8050 Zürich / CH | [2023/50] |
| Former [2023/22] | For all designated states Hitachi Energy Switzerland AG Bruggerstrasse 72 5400 Baden / CH | Inventor(s) | 01 /
FISCHER, Fabian 5400 Baden / CH | 02 /
BEYER, Harald 5600 Lenzburg / CH | 03 /
SANTOLARIA, Lluis 4600 Olten / CH | 04 /
MALEKI, Milad 5417 Untersiggenthal / CH | 05 /
GUILLON, David 8857 Vorderthal / CH | [2023/22] | Representative(s) | Epping - Hermann - Fischer Patentanwaltsgesellschaft mbH Schloßschmidstraße 5 80639 München / DE | [2023/22] | Application number, filing date | 21210720.5 | 26.11.2021 | [2023/22] | Filing language | EN | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | EP4187591 | Date: | 31.05.2023 | Language: | EN | [2023/22] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 30.05.2022 | Classification | IPC: | H01L23/367, H01L23/473, F28F3/04, F28F13/18 | [2023/22] | CPC: |
H01L23/367 (EP);
F28F13/185 (EP);
F28F3/048 (EP);
H01L23/473 (EP);
F28D2021/0029 (EP);
F28F2215/10 (EP)
| Designated contracting states | AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR [2023/42] |
| Former [2023/22] | AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR | Extension states | BA | Not yet paid | ME | Not yet paid | Validation states | KH | Not yet paid | MA | Not yet paid | MD | Not yet paid | TN | Not yet paid | Title | German: | GRUNDPLATTE UND VERFAHREN ZUR HERSTELLUNG EINER GRUNDPLATTE FÜR EIN LEISTUNGSMODUL UND HALBLEITERBAUELEMENT | [2023/22] | English: | BASEPLATE AND METHOD FOR MANUFACTURING A BASEPLATE FOR A POWER MODULE AND SEMICONDUCTOR DEVICE | [2023/22] | French: | PLAQUE DE BASE ET PROCÉDÉ DE FABRICATION D'UNE PLAQUE DE BASE POUR UN MODULE DE PUISSANCE ET DISPOSITIF SEMI-CONDUCTEUR | [2023/22] | Examination procedure | 07.09.2023 | Amendment by applicant (claims and/or description) | 07.09.2023 | Examination requested [2023/42] | 07.09.2023 | Date on which the examining division has become responsible | 05.12.2023 | Despatch of a communication from the examining division (Time limit: M04) | 26.02.2024 | Reply to a communication from the examining division | 09.04.2024 | Despatch of a communication from the examining division (Time limit: M04) | 14.06.2024 | Reply to a communication from the examining division | 13.09.2024 | Communication of intention to grant the patent | Fees paid | Renewal fee | 24.11.2023 | Renewal fee patent year 03 |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [Y]US6729383 (CANNELL MICHAEL J [US], et al); | [Y]US2005092007 (GUTFELD ROBERT J V [US], et al); | [Y]US2007069373 (ROTH ARTI P [US]); | [Y]WO2013184210 (MASSACHUSETTS INST TECHNOLOGY [US]); | [Y]WO2014064450 (OXFORD NANOSYSTEMS [GB]); | [Y]US2015008574 (GOHARA HIROMICHI [JP], et al); | [XY]WO2020196331 (HITACHI CHEMICAL CO LTD [JP]) |