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Extract from the Register of European Patents

EP About this file: EP4104206

EP4104206 - A PRESSURE REGULATED SEMICONDUCTOR WAFER COOLING APPARATUS AND METHOD AND A PRESSURE REGULATING APPARATUS [Right-click to bookmark this link]
StatusNo opposition filed within time limit
Status updated on  07.02.2025
Database last updated on 26.04.2025
FormerThe patent has been granted
Status updated on  01.03.2024
FormerGrant of patent is intended
Status updated on  02.11.2023
FormerRequest for examination was made
Status updated on  18.11.2022
FormerThe international publication has been made
Status updated on  20.08.2021
Formerunknown
Status updated on  25.02.2021
Most recent event   Tooltip25.04.2025Lapse of the patent in a contracting state
New state(s): SI		published on 28.05.2025 [2025/22]
Applicant(s)For all designated states
Edwards Vacuum LLC
6416, Inducon Drive West
Sanborn, NY 14132 / US
[2022/51]
Inventor(s)01 / KALE, Kaustubh
Edwards Vacuum LLC 11 Elizabeth Drive
Chelmsford, Massachusetts MA 01801 / US
 [2022/51]
Representative(s)Norton, Ian Andrew
Edwards Limited
Innovation Drive
Burgess Hill, West Sussex RH15 9TW / GB
[2024/14]
Former [2022/51]Norton, Ian Andrew
Edwards Limited
Innovation Drive
Burgess Hill
West Sussex RH15 9TW / GB
Application number, filing date21705614.210.02.2021
[2022/51]
WO2021IB51067
Priority number, dateGB2020000189412.02.2020         Original published format: GB 202001894
[2022/51]
Filing languageEN
Procedural languageEN
PublicationType: A1 Application with search report
No.:WO2021161181
Date:19.08.2021
Language:EN
[2021/33]
Type: A1 Application with search report 
No.:EP4104206
Date:21.12.2022
Language:EN
The application published by WIPO in one of the EPO official languages on 19.08.2021 takes the place of the publication of the European patent application.
[2022/51]
Type: B1 Patent specification 
No.:EP4104206
Date:03.04.2024
Language:EN
[2024/14]
Search report(s)International search report - published on:EP19.08.2021
ClassificationIPC:H01L21/67
[2022/51]
CPC:
H01L21/67103 (EP,IL,KR,US); H01L21/67109 (EP,IL,KR); C23C16/463 (GB);
F25B49/02 (US); C23C14/541 (GB); F25B41/20 (US);
F25B41/40 (US); H01J37/32724 (GB); H01L21/6715 (EP,IL,KR);
H01L21/67248 (EP,IL,KR); H01L21/68714 (GB,US); F25B2500/07 (US);
F25B2600/2501 (US); F25B2700/197 (US) (-)
Designated contracting statesAL,   AT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HR,   HU,   IE,   IS,   IT,   LI,   LT,   LU,   LV,   MC,   MK,   MT,   NL,   NO,   PL,   PT,   RO,   RS,   SE,   SI,   SK,   SM,   TR [2022/51]
Extension statesBANot yet paid
MENot yet paid
Validation statesKHNot yet paid
MANot yet paid
MDNot yet paid
TNNot yet paid
TitleGerman:VORRICHTUNG UND VERFAHREN ZUR DRUCKGEREGELTEN HALBLEITERWAFERKÜHLUNG UND DRUCKREGELVORRICHTUNG[2022/51]
English:A PRESSURE REGULATED SEMICONDUCTOR WAFER COOLING APPARATUS AND METHOD AND A PRESSURE REGULATING APPARATUS[2022/51]
French:APPAREIL ET PROCÉDÉ DE REFROIDISSEMENT DE TRANCHE SEMI-CONDUCTRICE À PRESSION RÉGULÉE ET APPAREIL DE RÉGULATION DE PRESSION[2022/51]
Entry into regional phase23.08.2022National basic fee paid 
23.08.2022Designation fee(s) paid 
23.08.2022Examination fee paid 
Examination procedure23.08.2022Examination requested  [2022/51]
23.08.2022Date on which the examining division has become responsible
10.03.2023Amendment by applicant (claims and/or description)
03.11.2023Communication of intention to grant the patent
25.01.2024Fee for grant paid
25.01.2024Fee for publishing/printing paid
25.01.2024Receipt of the translation of the claim(s)
Opposition(s)06.01.2025No opposition filed within time limit [2025/11]
Fees paidRenewal fee
27.02.2023Renewal fee patent year 03
27.02.2024Renewal fee patent year 04
Opt-out from the exclusive  Tooltip
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Patent Court		 See the Register of the Unified Patent Court for opt-out data
Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Lapses during opposition  TooltipAT03.04.2024
BG03.04.2024
CZ03.04.2024
DK03.04.2024
EE03.04.2024
ES03.04.2024
FI03.04.2024
HR03.04.2024
LV03.04.2024
PL03.04.2024
RO03.04.2024
SI03.04.2024
SK03.04.2024
SM03.04.2024
NO03.07.2024
RS03.07.2024
GR04.07.2024
IS03.08.2024
PT05.08.2024
[2025/22]
Former [2025/11]AT03.04.2024
BG03.04.2024
CZ03.04.2024
DK03.04.2024
EE03.04.2024
ES03.04.2024
FI03.04.2024
HR03.04.2024
LV03.04.2024
PL03.04.2024
RO03.04.2024
SK03.04.2024
SM03.04.2024
NO03.07.2024
RS03.07.2024
GR04.07.2024
IS03.08.2024
PT05.08.2024
Former [2025/09]AT03.04.2024
BG03.04.2024
CZ03.04.2024
DK03.04.2024
EE03.04.2024
ES03.04.2024
FI03.04.2024
HR03.04.2024
LV03.04.2024
PL03.04.2024
NO03.07.2024
RS03.07.2024
GR04.07.2024
IS03.08.2024
PT05.08.2024
Former [2025/08]AT03.04.2024
BG03.04.2024
CZ03.04.2024
DK03.04.2024
ES03.04.2024
FI03.04.2024
HR03.04.2024
LV03.04.2024
PL03.04.2024
NO03.07.2024
RS03.07.2024
GR04.07.2024
IS03.08.2024
PT05.08.2024
Former [2024/50]AT03.04.2024
BG03.04.2024
CZ03.04.2024
ES03.04.2024
FI03.04.2024
HR03.04.2024
LV03.04.2024
PL03.04.2024
NO03.07.2024
RS03.07.2024
GR04.07.2024
IS03.08.2024
PT05.08.2024
Former [2024/48]AT03.04.2024
BG03.04.2024
CZ03.04.2024
ES03.04.2024
FI03.04.2024
HR03.04.2024
NO03.07.2024
GR04.07.2024
IS03.08.2024
PT05.08.2024
Former [2024/47]BG03.04.2024
FI03.04.2024
HR03.04.2024
NO03.07.2024
GR04.07.2024
IS03.08.2024
PT05.08.2024
Cited inInternational search[A]US2001016427  (UEDA ISSEI [JP]);
 [A]US2009250202  (EIBL MARKUS [DE]);
 [A]US2018067395  (ZHOU WEN-ZHAN [TW], et al)
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.