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EP4075928
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EP About this file: EP4075928
| EP4075928 - ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT [Right-click to bookmark this link] | Status | The patent has been granted Status updated on 11.10.2024 Database last updated on 30.10.2024 | |
| Former | Grant of patent is intended Status updated on 14.07.2024 | ||
| Former | Request for examination was made Status updated on 16.09.2022 | ||
| Former | The international publication has been made Status updated on 20.08.2021 | Most recent event Tooltip | 11.10.2024 | (Expected) grant | published on 13.11.2024 [2024/46] | Applicant(s) | For all designated states Daikin Industries, Ltd. Osaka Umeda Twin Towers South, 1-13-1 Umeda, Kita-ku Osaka-shi, Osaka 530-0001 / JP | [2023/03] |
| Former [2022/42] | For all designated states Daikin Industries, Ltd. Umeda Center Building 4-12, Nakazaki-Nishi 2-chome Kita-ku Osaka-shi, Osaka 530-8323 / JP | Inventor(s) | 01 /
TANAKA, Mitsuhiro c/o DAIKIN INDUSTRIES, LTD., Umeda Center Building, 4-12, Nakazaki-nishi 2-chome, Kita-ku Osaka-shi, Osaka 530-8323 / JP | [2022/42] | Representative(s) | Hoffmann Eitle Patent- und Rechtsanwälte PartmbB Arabellastraße 30 81925 München / DE | [2022/42] | Application number, filing date | 21754365.1 | 10.02.2021 | [2022/42] | WO2021JP04989 | Priority number, date | JP20200020633 | 10.02.2020 Original published format: JP 2020020633 | [2022/42] | Filing language | JA | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | WO2021162044 | Date: | 19.08.2021 | Language: | JA | [2021/33] | Type: | A1 Application with search report | No.: | EP4075928 | Date: | 19.10.2022 | Language: | EN | [2022/42] | Type: | B1 Patent specification | No.: | EP4075928 | Date: | 13.11.2024 | Language: | EN | [2024/46] | Search report(s) | International search report - published on: | JP | 19.08.2021 | (Supplementary) European search report - dispatched on: | EP | 29.11.2023 | Classification | IPC: | H05K3/28 | [2022/42] | CPC: |
H05K3/284 (EP);
H05K1/181 (US);
H05K3/107 (US);
H05K3/28 (US);
H05K7/2039 (US);
H05K2201/09072 (EP);
H05K2201/09909 (EP);
H05K2201/10409 (EP);
H05K2201/10977 (EP);
| Designated contracting states | AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR [2022/42] | Extension states | BA | Not yet paid | ME | Not yet paid | Validation states | KH | Not yet paid | MA | Not yet paid | MD | Not yet paid | TN | Not yet paid | Title | German: | ELEKTRONISCHE KOMPONENTE UND VERFAHREN ZUR HERSTELLUNG EINER ELEKTRONISCHEN KOMPONENTE | [2022/42] | English: | ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT | [2022/42] | French: | COMPOSANT ÉLECTRONIQUE ET PROCÉDÉ DE FABRICATION DE COMPOSANT ÉLECTRONIQUE | [2022/42] | Entry into regional phase | 12.07.2022 | Translation filed | 12.07.2022 | National basic fee paid | 12.07.2022 | Search fee paid | 12.07.2022 | Designation fee(s) paid | 12.07.2022 | Examination fee paid | Examination procedure | 12.07.2022 | Examination requested [2022/42] | 08.04.2024 | Amendment by applicant (claims and/or description) | 08.04.2024 | Date on which the examining division has become responsible | 15.07.2024 | Communication of intention to grant the patent | 04.10.2024 | Fee for grant paid | 04.10.2024 | Fee for publishing/printing paid | 04.10.2024 | Receipt of the translation of the claim(s) | Fees paid | Renewal fee | 09.02.2023 | Renewal fee patent year 03 | 16.02.2024 | Renewal fee patent year 04 |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [XAI]JP2000004075 (SHARP KK) | International search | [Y]JPS5678185 (ALPS ELECTRIC CO LTD); | [Y]JPH1117318 (ISUZU CERAMICS RES INST); | [Y]JP2001044333 (CITIZEN ELECTRONICS); | [XY]WO2008075401 (MATSUSHITA ELECTRIC IND CO LTD [JP], et al) | by applicant | JP2003254809 |