EP3996134 - CHIP AND MEMORY [Right-click to bookmark this link] | Status | The patent has been granted Status updated on 03.05.2024 Database last updated on 24.08.2024 | |
Former | Grant of patent is intended Status updated on 04.02.2024 | ||
Former | Examination is in progress Status updated on 02.03.2023 | ||
Former | Request for examination was made Status updated on 08.04.2022 | ||
Former | The international publication has been made Status updated on 23.03.2022 | ||
Former | unknown Status updated on 24.09.2021 | Most recent event Tooltip | 06.06.2024 | Deletion: Renewal fee paid | Applicant(s) | For all designated states Changxin Memory Technologies, Inc. No. 388, Xingye Avenue Airport Industrial Park Economic and Technological Development Area Hefei City, Anhui 230000 / CN | [2024/23] |
Former [2022/19] | For all designated states Changxin Memory Technologies, Inc. No. 388, Xingye Avenue Airport Industrial Park Economic and Technological Development Area 230000 Hefei City, Anhui / CN | Inventor(s) | 01 /
CHANG, Chih-Wei Hefei Anhui 230000 / CN | [2022/19] | Representative(s) | Lavoix Bayerstraße 83 80335 München / DE | [2022/19] | Application number, filing date | 21769871.1 | 08.06.2021 | [2022/19] | WO2021CN98839 | Priority number, date | CN202010950123 | 09.09.2020 Original published format: CN202010950123 | [2022/19] | Filing language | ZH | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | WO2022052531 | Date: | 17.03.2022 | Language: | ZH | [2022/11] | Type: | A1 Application with search report | No.: | EP3996134 | Date: | 11.05.2022 | Language: | EN | [2022/19] | Type: | B1 Patent specification | No.: | EP3996134 | Date: | 05.06.2024 | Language: | EN | [2024/23] | Search report(s) | International search report - published on: | CN | 17.03.2022 | (Supplementary) European search report - dispatched on: | EP | 09.06.2022 | Classification | IPC: | H01L23/48, H01L23/58, H01L21/764, // H01L21/768, H01L25/065 | [2024/08] | CPC: |
H01L21/764 (EP,US);
H01L23/562 (EP,US);
H01L21/76224 (EP);
H01L23/481 (EP,US);
H01L25/0657 (EP,US);
H01L29/0649 (US);
|
Former IPC [2022/27] | H01L23/48, H01L21/764, // H01L21/768 | ||
Former IPC [2022/19] | H01L23/528 | Designated contracting states | AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR [2022/19] | Extension states | BA | Not yet paid | ME | Not yet paid | Validation states | KH | Not yet paid | MA | Not yet paid | MD | Not yet paid | TN | Not yet paid | Title | German: | CHIP UND SPEICHER | [2022/19] | English: | CHIP AND MEMORY | [2022/19] | French: | PUCE ET MÉMOIRE | [2022/19] | Entry into regional phase | 23.09.2021 | Translation filed | 23.09.2021 | National basic fee paid | 23.09.2021 | Search fee paid | 23.09.2021 | Designation fee(s) paid | 23.09.2021 | Examination fee paid | Examination procedure | 23.09.2021 | Examination requested [2022/19] | 02.12.2022 | Amendment by applicant (claims and/or description) | 02.12.2022 | Date on which the examining division has become responsible | 01.03.2023 | Despatch of a communication from the examining division (Time limit: M04) | 07.06.2023 | Reply to a communication from the examining division | 05.02.2024 | Communication of intention to grant the patent | 25.04.2024 | Fee for grant paid | 25.04.2024 | Fee for publishing/printing paid | 25.04.2024 | Receipt of the translation of the claim(s) | Fees paid | Renewal fee | 31.03.2023 | Renewal fee patent year 03 |
Opt-out from the exclusive Tooltip competence of the Unified Patent Court | See the Register of the Unified Patent Court for opt-out data | ||
Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [XY]US2012292746 (LEE DOSUN [KR], et al); | [XYI]US2013140680 (HARADA YOSHINAO [JP], et al); | [A]CN103367318B | International search | [X]EP2408006 (IMEC [BE]); | [A]CN103021935 (SH INTEGRATED CIRCUIT RES & DE); | [X]CN104078414 (SEMICONDUCTOR MFG INT CORP); | [X]CN104253082 (SEMICONDUCTOR MFG INT SHANGHAI) |