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Extract from the Register of European Patents

EP About this file: EP4123697

EP4123697 - INSULATED CIRCUIT BOARD [Right-click to bookmark this link]
StatusRequest for examination was made
Status updated on  23.12.2022
Database last updated on 14.09.2024
FormerThe international publication has been made
Status updated on  07.06.2022
Most recent event   Tooltip03.06.2024The date on which the examining division becomes responsible, has been established 
03.06.2024Amendment by applicant 
Applicant(s)For all designated states
Mitsubishi Materials Corporation
2-3, Marunouchi 3-chome
Chiyoda-ku
Tokyo 100-8117 / JP
[2023/04]
Inventor(s)01 / SAKURAI, Akira
c/o MITSUBISHI MATERIALS CORPORATION,
Central Research Institute
600, Kitabukuro-cho 1-chome
Omiya-ku
Saitama-shi, Saitama 330-8508 / JP
02 / TERASAKI, Nobuyuki
c/o MITSUBISHI MATERIALS CORPORATION,
Central Research Institute
600, Kitabukuro-cho 1-chome
Omiya-ku
Saitama-shi, Saitama 330-8508 / JP
 [2023/04]
Representative(s)Hoffmann Eitle
Patent- und Rechtsanwälte PartmbB
Arabellastraße 30
81925 München / DE
[2023/04]
Application number, filing date21772541.516.03.2021
[2023/04]
WO2021JP10548
Priority number, dateJP2020004795618.03.2020         Original published format: JP 2020047956
JP2021004043512.03.2021         Original published format: JP 2021040435
[2023/04]
Filing languageJA
Procedural languageEN
PublicationType: A1 Application with search report
No.:WO2021187464
Date:23.09.2021
Language:JA
[2021/38]
Type: A1 Application with search report 
No.:EP4123697
Date:25.01.2023
Language:EN
[2023/04]
Search report(s)International search report - published on:JP23.09.2021
(Supplementary) European search report - dispatched on:EP22.03.2024
ClassificationIPC:C04B37/02, H01L23/13, H01L23/12, H01L23/36, H01L23/373
[2024/17]
CPC:
C04B37/026 (EP); H01L23/49838 (KR); H05K3/0061 (US);
H01L23/15 (EP,KR); H01L23/36 (KR); H01L23/49805 (KR);
H01L23/49866 (EP,KR); H05K1/0204 (US); C04B2237/124 (EP);
C04B2237/343 (EP); C04B2237/366 (EP); C04B2237/368 (EP);
C04B2237/402 (EP); C04B2237/58 (EP); C04B2237/60 (EP);
H01L23/3735 (EP); H05K2201/032 (US); H05K2203/1194 (US) (-)
Former IPC [2023/04]H01L23/13, H01L23/12, H01L23/36, H01L23/373
Designated contracting statesAL,   AT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HR,   HU,   IE,   IS,   IT,   LI,   LT,   LU,   LV,   MC,   MK,   MT,   NL,   NO,   PL,   PT,   RO,   RS,   SE,   SI,   SK,   SM,   TR [2023/04]
TitleGerman:ISOLIERTE LEITERPLATTE[2023/04]
English:INSULATED CIRCUIT BOARD[2023/04]
French:CARTE DE CIRCUIT ISOLÉE[2023/04]
Entry into regional phase21.07.2022Translation filed 
21.07.2022National basic fee paid 
21.07.2022Search fee paid 
21.07.2022Designation fee(s) paid 
21.07.2022Examination fee paid 
Examination procedure21.07.2022Examination requested  [2023/04]
03.06.2024Amendment by applicant (claims and/or description)
03.06.2024Date on which the examining division has become responsible
Fees paidRenewal fee
15.03.2023Renewal fee patent year 03
07.03.2024Renewal fee patent year 04
Opt-out from the exclusive  Tooltip
competence of the Unified
Patent Court		 See the Register of the Unified Patent Court for opt-out data
Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Documents cited:Search[A]EP2296177  (MITSUBISHI MATERIALS CORP [JP]);
 [X]WO2013024813  (MITSUBISHI MATERIALS CORP [JP], et al);
 [X]US2014192486  (KUROMITSU YOSHIROU [JP], et al);
 [A]US9735085  (TERASAKI NOBUYUKI [JP], et al)
International search[XA]JP2012059836  (MITSUBISHI MATERIALS CORP);
 [XA]WO2013024813  (MITSUBISHI MATERIALS CORP [JP], et al);
 [A]WO2019146464  (MITSUBISHI MATERIALS CORP [JP])
by applicantJP3171234B
 JP5359953B
 JP2020047956
 JP2021040435
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.