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EP4151356
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EP About this file: EP4151356
| EP4151356 - METHOD OF BONDING THERMOPLASTIC RESIN AND METAL [Right-click to bookmark this link] | Status | Request for examination was made Status updated on 17.02.2023 Database last updated on 02.11.2024 | |
| Former | The international publication has been made Status updated on 19.11.2021 | Most recent event Tooltip | 14.06.2024 | The date on which the examining division becomes responsible, has been established | 14.06.2024 | Amendment by applicant | Applicant(s) | For all designated states Hirotec Corporation 2-1, Ishiuchiminami 5-chome, Saeki-ku Hiroshima-shi, Hiroshima 731-5197 / JP | [2023/12] | Inventor(s) | 01 /
WASHIKA, Kiminori Hiroshima-shi Hiroshima 731-5197 / JP | 02 /
KAWAFUCHI, Tatsumi Hiroshima-shi Hiroshima 731-5197 / JP | [2023/12] | Representative(s) | Mewburn Ellis LLP Aurora Building Counterslip Bristol BS1 6BX / GB | [2023/12] | Application number, filing date | 21804600.1 | 21.04.2021 | [2023/12] | WO2021JP16120 | Priority number, date | JP20200084660 | 13.05.2020 Original published format: JP 2020084660 | JP20210021122 | 12.02.2021 Original published format: JP 2021021122 | [2023/12] | Filing language | JA | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | WO2021230025 | Date: | 18.11.2021 | Language: | JA | [2021/46] | Type: | A1 Application with search report | No.: | EP4151356 | Date: | 22.03.2023 | Language: | EN | [2023/12] | Search report(s) | International search report - published on: | JP | 18.11.2021 | (Supplementary) European search report - dispatched on: | EP | 25.01.2024 | Classification | IPC: | B23K26/324, B29C65/00, B29C65/16, B23K26/06, B23K26/24, B23K26/32, B23K26/34, B29C65/82, B29C65/44 | [2024/09] | CPC: |
B23K26/0006 (EP);
B29C65/16 (US);
B23K26/0622 (EP);
B23K26/244 (EP);
B23K26/323 (EP);
B23K26/324 (EP,US);
B23K26/34 (EP);
B23K26/60 (EP);
B29C65/1629 (EP);
B29C65/1635 (EP);
B29C65/44 (EP);
B29C65/8215 (EP);
B29C65/8253 (EP);
B29C66/00143 (EP);
B29C66/02 (EP);
B29C66/0246 (EP);
B29C66/026 (EP);
B29C66/028 (EP);
B29C66/1122 (EP);
B29C66/43 (EP);
B29C66/71 (EP,US);
B29C66/7212 (EP);
B29C66/7392 (EP);
B29C66/742 (EP);
B29C66/7422 (EP,US);
B29C66/74281 (EP,US);
B29C66/74283 (EP);
B29C66/91221 (EP);
B29C66/919 (EP);
B29C66/91951 (EP);
B29C66/9592 (EP);
B23K2103/04 (EP);
B23K2103/08 (EP);
B23K2103/18 (EP);
B23K2103/42 (EP);
B29C2791/009 (EP);
B29C65/1654 (EP);
B29C66/73115 (EP);
B29C66/7428 (EP);
B29C66/929 (EP)
(-)
| C-Set: |
B29C66/71, B29K2023/12 (EP);
B29C66/71, B29K2027/18 (EP);
B29C66/71, B29K2059/00 (EP);
B29C66/71, B29K2067/003 (EP);
B29C66/71, B29K2069/00 (EP);
B29C66/71, B29K2077/00 (EP);
B29C66/7212, B29K2307/04 (EP);
B29C66/7212, B29K2309/08 (EP); |
| Former IPC [2023/12] | B23K26/324, B29C65/00, B29C65/16 | Designated contracting states | AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR [2023/12] | Title | German: | VERFAHREN ZUM VERBINDEN VON THERMOPLASTISCHEM HARZ UND METALL | [2023/12] | English: | METHOD OF BONDING THERMOPLASTIC RESIN AND METAL | [2023/12] | French: | PROCÉDÉ DE LIAISON DE RÉSINE THERMOPLASTIQUE ET DE MÉTAL | [2023/12] | Entry into regional phase | 26.09.2022 | Translation filed | 26.09.2022 | National basic fee paid | 26.09.2022 | Search fee paid | 26.09.2022 | Designation fee(s) paid | 26.09.2022 | Examination fee paid | Examination procedure | 26.09.2022 | Examination requested [2023/12] | 12.06.2024 | Amendment by applicant (claims and/or description) | 12.06.2024 | Date on which the examining division has become responsible | Fees paid | Renewal fee | 24.03.2023 | Renewal fee patent year 03 | 22.03.2024 | Renewal fee patent year 04 |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [IA]CN106393705 (SHANGHAI AEROSPACE EQUIPMENT MFG GENERAL FACTORY) [I] 1-3,5-14 * Description of the drawings;; figures 1-4; claims 1,2 *[A] 4; | [IA]WO2020067022 (HIROTEC CORP [JP], et al) [I] 1-3,6,7,10-14 * Translated version.; paragraph [0028] - paragraph [0060]; figures 1-4; claims 1-9 * * paragraph [0074] - paragraph [0077] * [A] 4,5,8,9 | International search | [A]JP2016043561 (OMRON TATEISI ELECTRONICS CO) [A] 1-14* entire text, all drawings *; | [A]JP2017164986 (FUJI ELECTRIC CO LTD) [A] 1-14 * entire text, all drawings * | by applicant | JP2005104132 | JP2016056363 | JP2019123153 |