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Extract from the Register of European Patents

EP About this file: EP4158684

EP4158684 - IC DEVICE WITH CHIP TO PACKAGE INTERCONNECTS FROM A COPPER METAL INTERCONNECT LEVEL [Right-click to bookmark this link]
StatusRequest for examination was made
Status updated on  03.03.2023
Database last updated on 18.11.2024
FormerThe international publication has been made
Status updated on  10.12.2021
Most recent event   Tooltip17.07.2024The date on which the examining division becomes responsible, has been established 
17.07.2024Amendment by applicant 
Applicant(s)For all designated states
Texas Instruments Incorporated
P.O. Box 655474
Mail Station 3999
Dallas, TX 75265 / US
[2023/14]
Inventor(s)01 / JAIN, Manoj Kumar
Plano, TX 75025 / US
 [2023/14]
Representative(s)Zeller, Andreas
Texas Instruments Deutschland GmbH
EMEA Patent Department
Haggertystraße 1
85356 Freising / DE
[2023/14]
Application number, filing date21818641.902.06.2021
[2023/14]
WO2021US35341
Priority number, dateUS202063033247P02.06.2020         Original published format: US 202063033247 P
US20211733192127.05.2021         Original published format: US202117331921
[2023/14]
Filing languageEN
Procedural languageEN
PublicationType: A1 Application with search report
No.:WO2021247633
Date:09.12.2021
Language:EN
[2021/49]
Type: A1 Application with search report 
No.:EP4158684
Date:05.04.2023
Language:EN
The application published by WIPO in one of the EPO official languages on 09.12.2021 takes the place of the publication of the European patent application.
[2023/14]
Search report(s)International search report - published on:RU09.12.2021
(Supplementary) European search report - dispatched on:EP08.01.2024
ClassificationIPC:H01L21/768, H01L21/66, H01L23/31, H01L23/00
[2024/06]
CPC:
H01L24/05 (EP); H01L23/5226 (KR); H01L24/20 (US);
H01L21/4821 (KR); H01L21/565 (KR,US); H01L21/76877 (KR,US);
H01L21/78 (KR); H01L22/32 (EP,KR); H01L23/291 (KR);
H01L23/3171 (KR); H01L23/49575 (KR); H01L23/5283 (KR);
H01L23/53228 (US); H01L23/53266 (KR); H01L24/02 (EP);
H01L24/04 (KR); H01L24/11 (EP,KR,US); H01L24/12 (KR);
H01L24/13 (EP,US); H01L24/19 (US); H01L24/82 (US);
H01L24/94 (US); H01L2224/02331 (EP); H01L2224/0239 (EP);
H01L2224/03616 (EP); H01L2224/0401 (EP,KR); H01L2224/04042 (EP);
H01L2224/05016 (EP); H01L2224/05023 (EP); H01L2224/05026 (EP);
H01L2224/0508 (EP); H01L2224/05083 (EP); H01L2224/05084 (EP);
H01L2224/05094 (EP); H01L2224/05096 (EP); H01L2224/05147 (EP);
H01L2224/05155 (EP); H01L2224/05164 (EP); H01L2224/05166 (EP);
H01L2224/05181 (EP); H01L2224/05186 (EP); H01L2224/05548 (EP);
H01L2224/05558 (EP); H01L2224/05568 (EP); H01L2224/05569 (EP);
H01L2224/05644 (EP); H01L2224/05666 (EP); H01L2224/11462 (EP);
H01L2224/1147 (EP); H01L2224/13022 (EP); H01L2224/13024 (EP);
H01L2224/13026 (KR); H01L2224/131 (EP); H01L2224/13147 (EP,KR,US);
H01L2224/13655 (US); H01L2224/13664 (US); H01L2224/14505 (US);
H01L2224/16145 (EP); H01L2224/2101 (US); H01L2224/215 (US);
H01L2224/45099 (EP); H01L23/3107 (EP); H01L23/3192 (EP);
H01L24/03 (EP); H01L24/16 (EP); H01L2924/181 (EP) (-)
C-Set:
H01L2224/0239, H01L2924/01022, H01L2924/01074 (EP);
H01L2224/0239, H01L2924/01047, H01L2924/00014 (EP);
H01L2224/05016, H01L2924/00012 (EP);
H01L2224/05147, H01L2924/00014 (EP);
H01L2224/05155, H01L2924/00014 (EP);
H01L2224/05164, H01L2924/00014 (EP);
H01L2224/05166, H01L2924/01074 (EP);
H01L2224/05181, H01L2924/00014 (EP);
H01L2224/05186, H01L2924/04941 (EP);
H01L2224/05186, H01L2924/04953 (EP);
H01L2224/05558, H01L2924/00014 (EP);
H01L2224/05644, H01L2924/00014 (EP);
H01L2224/05666, H01L2924/01074 (EP);
H01L2224/11462, H01L2924/00014 (EP);
H01L2224/1147, H01L2924/00014 (EP);
H01L2224/13147, H01L2924/00014 (EP);
H01L2224/131, H01L2924/014, H01L2924/00014 (EP);
H01L2224/45099, H01L2924/00014 (EP)
(-)
Former IPC [2023/14]H01L21/768
Designated contracting statesAL,   AT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HR,   HU,   IE,   IS,   IT,   LI,   LT,   LU,   LV,   MC,   MK,   MT,   NL,   NO,   PL,   PT,   RO,   RS,   SE,   SI,   SK,   SM,   TR [2023/14]
TitleGerman:IC-VORRICHTUNG MIT CHIP-ZU-PAKET-VERBINDUNGEN VON EINER KUPFERMETALL-VERBINDUNGSEBENE[2023/14]
English:IC DEVICE WITH CHIP TO PACKAGE INTERCONNECTS FROM A COPPER METAL INTERCONNECT LEVEL[2023/14]
French:DISPOSITIF DE CIRCUIT INTÉGRÉ À INTERCONNEXIONS PUCE À BOÎTIER À PARTIR D'UN NIVEAU D'INTERCONNEXION MÉTALLIQUE EN CUIVRE[2023/14]
Entry into regional phase02.01.2023National basic fee paid 
02.01.2023Search fee paid 
02.01.2023Designation fee(s) paid 
02.01.2023Examination fee paid 
Examination procedure02.01.2023Examination requested  [2023/14]
16.07.2024Amendment by applicant (claims and/or description)
16.07.2024Date on which the examining division has become responsible
Fees paidRenewal fee
30.06.2023Renewal fee patent year 03
01.07.2024Renewal fee patent year 04
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Patent Court		 See the Register of the Unified Patent Court for opt-out data
Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Documents cited:Search[A]DE10311368  (INFINEON TECHNOLOGIES AG [DE]);
 [Y]US2003232496  (KOO KYUNG-BUM [KR]);
 [A]US2005260842  (KALTALIOGLU ERDEM [US], et al);
 [YA]US2006014320  (YAMANO TAKAHARU [JP], et al);
 [YA]US2009115058  (YU HSIU-MEI [TW], et al);
 [Y]TW201017848  (INTEL CORP [US]);
 [A]CN102420107B  (SHANGHAI HUALI MICROELECT CORP);
 [Y]US2015001712  (DAUBENSPECK TIMOTHY H [US], et al);
 [A]US9196529  (CHEN JIE [TW], et al);
 [A]US9716066  (LEE KEVIN J [US], et al)
International search[A]US2006076678  (KIM SARAH E [US], et al);
 [A]US7439170  (DAUBENSPECK TIMOTHY HARRISON [US], et al);
 [A]US2011204510  (LIN MOU-SHIUNG [TW], et al);
 [A]US2015262866  (MEYER THORSTEN [DE], et al)
by applicantTW201017848
 US9196529
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.