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Extract from the Register of European Patents

EP About this file: EP4174198

EP4174198 - COPPER ALLOY, COPPER ALLOY PLASTIC WORKING MATERIAL, COMPONENT FOR ELECTRONIC/ELECTRICAL DEVICE, TERMINAL, BUS BAR, LEAD FRAME, AND HEAT DISSIPATION SUBSTRATE [Right-click to bookmark this link]
StatusRequest for examination was made
Status updated on  31.03.2023
Database last updated on 06.11.2024
FormerThe international publication has been made
Status updated on  07.01.2022
Most recent event   Tooltip20.06.2024New entry: Renewal fee paid 
Applicant(s)For all designated states
Mitsubishi Materials Corporation
2-3, Marunouchi 3-chome
Chiyoda-ku
Tokyo 100-8117 / JP
[2023/18]
Inventor(s)01 / MATSUNAGA, Hirotaka
Kitamoto-shi, Saitama 364-0028 / JP
02 / FUKUOKA, Kosei
Kitamoto-shi, Saitama 364-0028 / JP
03 / MAKI, Kazunari
Kitamoto-shi, Saitama 364-0028 / JP
04 / MORIKAWA, Kenji
Aizuwakamatsu-shi, Fukushima 965-8522 / JP
05 / FUNAKI, Shinichi
Aizuwakamatsu-shi, Fukushima 965-8522 / JP
06 / MORI, Hiroyuki
Sakai-shi, Osaka 590-0906 / JP
 [2023/18]
Representative(s)Hoffmann Eitle
Patent- und Rechtsanwälte PartmbB
Arabellastraße 30
81925 München / DE
[2023/18]
Application number, filing date21833037.130.06.2021
[2023/18]
WO2021JP24723
Priority number, dateJP2020011269530.06.2020         Original published format: JP 2020112695
JP2020011292730.06.2020         Original published format: JP 2020112927
JP2020018173629.10.2020         Original published format: JP 2020181736
[2023/18]
Filing languageJA
Procedural languageEN
PublicationType: A1 Application with search report
No.:WO2022004779
Date:06.01.2022
Language:JA
[2022/01]
Type: A1 Application with search report 
No.:EP4174198
Date:03.05.2023
Language:EN
[2023/18]
Search report(s)International search report - published on:JP06.01.2022
ClassificationIPC:C22C9/00, C22F1/00, C22F1/08, H01B1/02, H01B5/02
[2023/18]
CPC:
H01B1/026 (EP); C22C9/00 (EP,KR,US); C22F1/08 (EP,KR,US);
H01B1/02 (KR,US); H01B5/02 (KR,US); H05K7/2039 (US)
Designated contracting statesAL,   AT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HR,   HU,   IE,   IS,   IT,   LI,   LT,   LU,   LV,   MC,   MK,   MT,   NL,   NO,   PL,   PT,   RO,   RS,   SE,   SI,   SK,   SM,   TR [2023/18]
TitleGerman:KUPFERLEGIERUNG, KUPFERLEGIERUNGSKUNSTSTOFFARBEITSMATERIAL, KOMPONENTE FÜR ELEKTRONISCHE/ELEKTRISCHE VORRICHTUNG, KLEMME, SAMMELSCHIENE, LEITERRAHMEN UND WÄRMEABLEITSUBSTRAT[2023/18]
English:COPPER ALLOY, COPPER ALLOY PLASTIC WORKING MATERIAL, COMPONENT FOR ELECTRONIC/ELECTRICAL DEVICE, TERMINAL, BUS BAR, LEAD FRAME, AND HEAT DISSIPATION SUBSTRATE[2023/18]
French:ALLIAGE DE CUIVRE, MATÉRIAU EN ALLIAGE DE CUIVRE TRAVAILLÉ PLASTIQUEMENT, COMPOSANT POUR APPAREIL ÉLECTRONIQUE OU ÉLECTRIQUE, BORNE, BARRE OMNIBUS, GRILLE DE CONNEXION ET SUBSTRAT DE DISSIPATION DE CHALEUR[2023/18]
Entry into regional phase22.12.2022Translation filed 
22.12.2022National basic fee paid 
22.12.2022Search fee paid 
22.12.2022Designation fee(s) paid 
22.12.2022Examination fee paid 
Examination procedure22.12.2022Examination requested  [2023/18]
Fees paidRenewal fee
20.06.2023Renewal fee patent year 03
20.06.2024Renewal fee patent year 04
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Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Cited inInternational search[A]JPH0372041  (FURUKAWA ELECTRIC CO LTD) [A] 1-12;
 [A]JPH04280935  (FURUKAWA ELECTRIC CO LTD)[A] 1-12;
 [A]JP2001152267  (KOBE STEEL LTD) [A] 1-12;
 [A]JP2008255416  (HITACHI CABLE) [A] 1-12;
 [A]JP2016056414  (MITSUBISHI MATERIALS CORP) [A] 1-12;
 [A]JP2017186623  (MITSUBISHI MATERIALS CORP) [A] 1-12
by applicantJP2016056414
 JP2020112695
 JP2020112927
 JP2020181736
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.