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EP4219059
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EP About this file: EP4219059
| EP4219059 - BONDING STRUCTURE AND SEMICONDUCTOR DEVICE HAVING SAID BONDING STRUCTURE [Right-click to bookmark this link] | Status | Request for examination was made Status updated on 30.06.2023 Database last updated on 01.01.2025 | |
| Former | The international publication has been made Status updated on 07.05.2022 | Most recent event Tooltip | 26.10.2024 | New entry: Renewal fee paid | Applicant(s) | For all designated states Tanaka Kikinzoku Kogyo K.K. 7-3, Marunouchi 2-chome Chiyoda-ku Tokyo 100-6422 / JP | [2023/31] | Inventor(s) | 01 /
KISHIMOTO, Takaomi Tomioka-shi, Gunma 370-2452 / JP | 02 /
TAKEUCHI, Junichi Oshu-shi, Iwate 023-1101 / JP | 03 /
TORINOUMI, Hiraku Oshu-shi, Iwate 023-1101 / JP | [2023/31] | Representative(s) | Hoffmann Eitle Patent- und Rechtsanwälte PartmbB Arabellastraße 30 81925 München / DE | [2023/31] | Application number, filing date | 21886106.0 | 25.10.2021 | [2023/31] | WO2021JP39202 | Priority number, date | JP20200181568 | 29.10.2020 Original published format: JP 2020181568 | [2023/31] | Filing language | JA | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | WO2022091988 | Date: | 05.05.2022 | Language: | JA | [2022/18] | Type: | A1 Application with search report | No.: | EP4219059 | Date: | 02.08.2023 | Language: | EN | [2023/31] | Search report(s) | International search report - published on: | JP | 05.05.2022 | (Supplementary) European search report - dispatched on: | EP | 22.09.2023 | Classification | IPC: | B23K35/30, B23K35/02, B23K20/00, C22C5/06, B22F3/24, // H01L23/00 | [2023/43] | CPC: |
B23K35/3006 (EP,KR);
H01L24/32 (EP,KR,US);
H01L24/29 (US);
B22F1/052 (EP);
B22F1/09 (EP);
B22F3/24 (EP);
B22F7/008 (EP);
B22F7/064 (EP);
B23K20/02 (EP);
B23K35/0244 (EP);
C22C5/06 (EP);
B23K2101/40 (EP);
B23K2103/56 (EP);
H01L2224/29111 (US);
H01L2224/29139 (US);
H01L2224/29564 (US);
H01L2224/32151 (EP,KR);
H01L2224/32245 (US);
H01L2224/32501 (EP,KR);
H01L2924/01047 (EP,KR);
H01L2924/0105 (EP,KR);
H01L2924/01327 (US)
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| Former IPC [2023/31] | B23K20/00, C22C5/06, H01L21/52, B22F3/24 | Designated contracting states | AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR [2023/31] | Title | German: | VERBINDUNGSSTRUKTUR UND HALBLEITERBAUELEMENT MIT DIESER VERBINDUNGSSTRUKTUR | [2023/31] | English: | BONDING STRUCTURE AND SEMICONDUCTOR DEVICE HAVING SAID BONDING STRUCTURE | [2023/31] | French: | STRUCTURE DE LIAISON, ET DISPOSITIF À SEMI-CONDUCTEUR COMPORTANT LADITE STRUCTURE DE LIAISON | [2023/31] | Entry into regional phase | 26.04.2023 | Translation filed | 26.04.2023 | National basic fee paid | 26.04.2023 | Search fee paid | 26.04.2023 | Designation fee(s) paid | 26.04.2023 | Examination fee paid | Examination procedure | 26.04.2023 | Examination requested [2023/31] | 11.04.2024 | Amendment by applicant (claims and/or description) | 11.04.2024 | Date on which the examining division has become responsible | Fees paid | Renewal fee | 24.10.2023 | Renewal fee patent year 03 | 25.10.2024 | Renewal fee patent year 04 |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [A]US2006061974 (SOGA TASAO [JP], et al) [A] 1-5 * the whole document *; | [XI]JP2006289474 (HITACHI METALS LTD) [X] 1-4 * abstract * [I] 5; | [A]JP2014193474 (MITSUBISHI MATERIALS CORP) [A] 1-5* the whole document * | International search | [YX]JP2006289474 (HITACHI METALS LTD) [Y] 2, 5 [X] 1, 3, 4; | [Y]JP2009060101 (HITACHI LTD) [Y] 2, 5* paragraphs [0025]-[0027], [0038], [0039], [0054] * | by applicant | JP2018098265 |