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EP4231339
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EP About this file: EP4231339
| EP4231339 - BONDING SYSTEM AND BONDING METHOD [Right-click to bookmark this link] | Status | Request for examination was made Status updated on 21.07.2023 Database last updated on 29.10.2024 | |
| Former | The international publication has been made Status updated on 01.07.2023 | ||
| Former | unknown Status updated on 26.12.2022 | Most recent event Tooltip | 14.08.2024 | The date on which the examining division becomes responsible, has been established | 14.08.2024 | Amendment by applicant | Applicant(s) | For all designated states HUBEI 3D SEMICONDUCTOR INTEGRATED INNOVATION CENTER CO., LTD. 2-OS6, Xinxin Production Line Plant and Supporting Facilities 18 Gaoxin 4th Road, East Lake High-Tech Development Zone Wuhan, Hubei 430000 / CN | For all designated states Hubei Yangtze Memory Laboratories 2-OS6, 18 Gaoxin 4th Road East Lake High-Tech Development Zone Wuhan, Hubei 430000 / CN | [2024/13] |
| Former [2023/34] | For all designated states HUBEI 3D SEMICONDUCTOR INTEGRATED INNOVATION CENTER CO., LTD. 2-OS6, Xinxin Production Line Plant and Supporting Facilities 18 Gaoxin 4th Road, East Lake High-Tech Development Zone Wuhan, Hubei 430000 / CN | Inventor(s) | 01 /
TIAN, Yingchao Wuhan, Hubei 430000 / CN | 02 /
LIU, Tianjian Wuhan, Hubei 430000 / CN | 03 /
CAO, Ruixia Wuhan, Hubei 430000 / CN | 04 /
ZHANG, Wei Wuhan, Hubei 430000 / CN | [2023/34] | Representative(s) | Gevers Patents De Kleetlaan 7A 1831 Diegem / BE | [N/P] |
| Former [2023/34] | Gevers Patents Intellectual Property House Holidaystraat 5 1831 Diegem / BE | Application number, filing date | 21946243.9 | 28.12.2021 | [2023/34] | WO2021CN142073 | Priority number, date | CN202111594630 | 24.12.2021 Original published format: CN202111594630 | [2023/34] | Filing language | ZH | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | WO2023115614 | Date: | 29.06.2023 | Language: | ZH | [2023/26] | Type: | A1 Application with search report | No.: | EP4231339 | Date: | 23.08.2023 | Language: | EN | [2023/34] | Type: | A8 Corrected patent application | No.: | EP4231339 | Date: | 27.03.2024 | [2024/13] | Search report(s) | International search report - published on: | CN | 29.06.2023 | (Supplementary) European search report - dispatched on: | EP | 05.02.2024 | Classification | IPC: | H01L21/68, H01L21/67, // H01L23/00 | [2024/10] | CPC: |
H01L24/74 (EP,CN);
H01L21/681 (EP,CN);
H01L24/80 (EP,CN);
H01L21/67144 (EP);
H01L2224/74 (CN);
H01L2224/80 (CN)
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| Former IPC [2023/34] | H01L21/68 | Designated contracting states | AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR [2023/34] | Extension states | BA | Not yet paid | ME | Not yet paid | Validation states | KH | Not yet paid | MA | Not yet paid | MD | Not yet paid | TN | Not yet paid | Title | German: | VERBINDUNGSSYSTEM UND VERBINDUNGSVERFAHREN | [2023/34] | English: | BONDING SYSTEM AND BONDING METHOD | [2023/34] | French: | SYSTÈME DE LIAISON ET PROCÉDÉ DE LIAISON | [2023/34] | Entry into regional phase | 26.02.2022 | Translation filed | 26.12.2022 | National basic fee paid | 26.12.2022 | Search fee paid | 26.12.2022 | Designation fee(s) paid | 26.12.2022 | Examination fee paid | Examination procedure | 26.12.2022 | Examination requested [2023/34] | 14.08.2024 | Amendment by applicant (claims and/or description) | 14.08.2024 | Date on which the examining division has become responsible | Fees paid | Renewal fee | 28.12.2023 | Renewal fee patent year 03 |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [A]JP2000012623 (SHARP KK) [A] 9-12* paragraph [0007]; figures 1,7 *; | [Y]US2007134904 (WAN MING Y L [HK], et al) [Y] 1,8 * paragraphs [0011] - [0013] - [0 20] - [0025]; figure 2 *; | [A]KR20070090670 (SAMSUNG TECHWIN CO LTD [KR]) [A] 1-12 * paragraphs [0004] - [0007] - [0 31]; figure 1 *; | [A]JP2008244255 (CASIO COMPUTER CO LTD) [A] 1-12 * paragraphs [0021] , [0022]; figure 2 *; | [A]JP2013235907 (SHIBUYA KOGYO CO LTD) [A] 2 * paragraph [0004]; figure 20 *; | [Y]US2020219850 (GUO SHUAI [CN]) [Y] 1,8 * paragraphs [0004] - [0021]; figure 1D *; | [A]US2021272925 (AEBISCHER MARKUS [CH]) [A] 8-12 * paragraph [0024] * |