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Extract from the Register of European Patents

EP About this file: EP4213187

EP4213187 - ELECTRONIC PACKAGE AND METHOD FOR MANUFACTURING THE SAME [Right-click to bookmark this link]
StatusRequest for examination was made
Status updated on  29.12.2023
Database last updated on 25.09.2024
FormerThe application has been published
Status updated on  16.06.2023
Most recent event   Tooltip26.01.2024New entry: Renewal fee paid 
Applicant(s)For all designated states
Nexperia B.V.
Jonkerbosplein 52
6534 AB Nijmegen / NL
[2023/29]
Inventor(s)01 / Tang, Qingyuan
Dongguan, 523750 / CN
02 / Zhao, YuJun
Dongguan, 523750 / CN
 [2023/29]
Representative(s)Pjanovic, Ilija
Nexperia B.V.
Legal & IP
Jonkerbosplein 52
6534 AB Nijmegen / NL
[2023/29]
Application number, filing date22151143.912.01.2022
[2023/29]
Filing languageEN
Procedural languageEN
PublicationType: A1 Application with search report 
No.:EP4213187
Date:19.07.2023
Language:EN
[2023/29]
Search report(s)(Supplementary) European search report - dispatched on:EP18.10.2022
ClassificationIPC:H01L21/56, H01L21/683, H01L23/00, H01L23/31, // H01L23/544, H01L23/64, H01L23/538
[2023/29]
CPC:
H01L21/561 (EP,US); H01L21/50 (CN); H01L24/95 (US);
H01L21/568 (EP,CN,US); H01L21/6835 (EP); H01L23/3107 (EP,CN,US);
H01L23/48 (CN); H01L23/544 (EP); H01L24/13 (US);
H01L24/19 (EP); H01L24/20 (EP); H01L24/29 (US);
H01L24/73 (EP,US); H01L24/96 (EP); H01L2221/68359 (EP);
H01L2223/5446 (EP); H01L2223/54486 (EP); H01L2224/04105 (EP);
H01L2224/0603 (EP); H01L2224/06181 (EP); H01L2224/13 (US);
H01L2224/16227 (EP); H01L2224/2518 (EP); H01L2224/29111 (US);
H01L2224/29124 (US); H01L2224/29139 (US); H01L2224/29144 (US);
H01L2224/29147 (US); H01L2224/73153 (US); H01L2224/73259 (EP);
H01L2224/81005 (EP); H01L2224/82039 (EP); H01L2224/92224 (EP);
H01L2224/95001 (US); H01L2224/96 (US); H01L2224/97 (EP);
H01L23/5389 (EP); H01L23/642 (EP); H01L24/16 (EP);
H01L24/92 (EP); H01L24/97 (EP); H01L2924/1305 (EP);
H01L2924/1306 (EP); H01L2924/15192 (EP); H01L2924/1815 (EP) (-)
C-Set:
H01L2224/97, H01L2224/81 (EP)
Designated contracting statesAL,   AT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HR,   HU,   IE,   IS,   IT,   LI,   LT,   LU,   LV,   MC,   MK,   MT,   NL,   NO,   PL,   PT,   RO,   RS,   SE,   SI,   SK,   SM,   TR [2024/05]
Former [2023/29]AL,  AT,  BE,  BG,  CH,  CY,  CZ,  DE,  DK,  EE,  ES,  FI,  FR,  GB,  GR,  HR,  HU,  IE,  IS,  IT,  LI,  LT,  LU,  LV,  MC,  MK,  MT,  NL,  NO,  PL,  PT,  RO,  RS,  SE,  SI,  SK,  SM,  TR 
Extension statesBANot yet paid
MENot yet paid
Validation statesKHNot yet paid
MANot yet paid
MDNot yet paid
TNNot yet paid
TitleGerman:ELEKTRONISCHES PAKET UND VERFAHREN ZUR HERSTELLUNG DAVON[2023/29]
English:ELECTRONIC PACKAGE AND METHOD FOR MANUFACTURING THE SAME[2023/29]
French:BOÎTIER ÉLECTRONIQUE ET SON PROCÉDÉ DE FABRICATION[2023/29]
Examination procedure22.12.2023Amendment by applicant (claims and/or description)
22.12.2023Examination requested  [2024/05]
22.12.2023Date on which the examining division has become responsible
Fees paidRenewal fee
25.01.2024Renewal fee patent year 03
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Documents cited:Search[XAY]US2012086129  (TIMME HANS-JOERG [DE], et al) [X] 1-5,8-15 * paragraphs [0023] - [0060]; figures 3A-4 * [A] 6 [Y] 7;
 [A]US2019326255  (OLSON TIMOTHY L [US], et al) [A] 6* paragraph [0045]; figures 2A-2F *;
 [Y]US2020176412  (KESSLER ANGELA [DE], et al) [Y] 7 * paragraphs [0117] , [0129]; figures 6-10 *
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.