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Extract from the Register of European Patents

EP About this file: EP4033603

EP4033603 - METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEMICONDUCTOR DEVICE [Right-click to bookmark this link]
StatusGrant of patent is intended
Status updated on  06.01.2025
Database last updated on 18.01.2025
FormerRequest for examination was made
Status updated on  20.01.2023
FormerThe application has been published
Status updated on  24.06.2022
Most recent event   Tooltip06.01.2025New entry: Communication of intention to grant a patent 
Applicant(s)For all designated states
STMicroelectronics S.r.l.
Via C. Olivetti, 2
20864 Agrate Brianza (MB) / IT
[2022/30]
Inventor(s)01 / GRAZIOSI, Giovanni
I-20871 Vimercate (Monza Brianza) / IT
02 / SANNA, Aurora
I-20132 Milano / IT
03 / VILLA, Riccardo
I-20126 Milano / IT
 [2022/30]
Representative(s)Buzzi, Notaro & Antonielli d'Oulx S.p.A.
Corso Vittorio Emanuele II, 6
10123 Torino / IT
[N/P]
Former [2022/30]Bosotti, Luciano
Buzzi, Notaro & Antonielli d'Oulx S.p.A.
Corso Vittorio Emanuele ll, 6
10123 Torino / IT
Application number, filing date22151920.018.01.2022
[2022/30]
Priority number, dateIT2021000130125.01.2021         Original published format: IT202100001301
[2022/30]
Filing languageEN
Procedural languageEN
PublicationType: A1 Application with search report 
No.:EP4033603
Date:27.07.2022
Language:EN
[2022/30]
Search report(s)(Supplementary) European search report - dispatched on:EP03.06.2022
ClassificationIPC:H01Q1/22, H01Q9/32, H01Q1/40, H01L23/66, H01L23/00
[2025/02]
CPC:
H01Q1/2283 (EP,US); H01L23/3114 (US); H01L23/5389 (US);
H01L23/66 (EP,US); H01L24/19 (EP); H01Q1/40 (EP);
H01Q9/32 (EP); H01L2223/6677 (EP,US); H01L2224/04105 (EP);
H01L2224/12105 (EP); H01L2224/16245 (EP); H01L2224/32245 (EP);
H01L2224/48247 (EP); H01L2224/73265 (EP); H01L2924/19107 (EP) (-)
C-Set:
H01L2224/73265, H01L2224/32245, H01L2224/48247, H01L2924/00012 (EP)
Former IPC [2022/30]H01Q1/22, H01Q9/32, H01Q1/40
Designated contracting statesAL,   AT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HR,   HU,   IE,   IS,   IT,   LI,   LT,   LU,   LV,   MC,   MK,   MT,   NL,   NO,   PL,   PT,   RO,   RS,   SE,   SI,   SK,   SM,   TR [2023/08]
Former [2022/30]AL,  AT,  BE,  BG,  CH,  CY,  CZ,  DE,  DK,  EE,  ES,  FI,  FR,  GB,  GR,  HR,  HU,  IE,  IS,  IT,  LI,  LT,  LU,  LV,  MC,  MK,  MT,  NL,  NO,  PL,  PT,  RO,  RS,  SE,  SI,  SK,  SM,  TR 
Extension statesBANot yet paid
MENot yet paid
Validation statesKHNot yet paid
MANot yet paid
MDNot yet paid
TNNot yet paid
TitleGerman:VERFAHREN ZUR HERSTELLUNG VON HALBLEITERBAUELEMENTEN UND ENTSPRECHENDES HALBLEITERBAUELEMENT[2022/30]
English:METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEMICONDUCTOR DEVICE[2022/30]
French:PROCÉDÉ DE FABRICATION DE DISPOSITIFS SEMI-CONDUCTEURS ET DISPOSITIF SEMI-CONDUCTEUR CORRESPONDANT[2022/30]
Examination procedure18.01.2023Amendment by applicant (claims and/or description)
18.01.2023Examination requested  [2023/08]
18.01.2023Date on which the examining division has become responsible
07.01.2025Communication of intention to grant the patent
Fees paidRenewal fee
23.01.2024Renewal fee patent year 03
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Documents cited:Search[IA]US2009009405  (ROFOUGARAN AHMADREZA REZA [US]);
 [A]US2009272714  (WESTE NEIL H E [AU]);
 [XAI]US2015145747  (CHUNG HSIN-LUNG [TW], et al)
by applicantUS2009009405
 US2009272714
 US8087155
 US2018342453
 US2020203264
 US2020321274
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.