EP4067999 - NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATION FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT [Right-click to bookmark this link] | Status | The patent has been granted Status updated on 01.09.2023 Database last updated on 29.06.2024 | |
Former | Grant of patent is intended Status updated on 18.05.2023 | ||
Former | Request for examination was made Status updated on 18.11.2022 | ||
Former | The application has been published Status updated on 02.09.2022 | Most recent event Tooltip | 31.05.2024 | Lapse of the patent in a contracting state New state(s): HR, LV, NO, PL, RS, SE | published on 03.07.2024 [2024/27] | Applicant(s) | For all designated states Shin-Etsu Chemical Co., Ltd. 4-1, Marunouchi 1-chome Chiyoda-ku Tokyo 100-0005 / JP | [2022/40] | Inventor(s) | 01 /
Iio, Masashi Niigata / JP | 02 /
Urano, Hiroyuki Niigata / JP | 03 /
Watanabe, Osamu Niigata / JP | 04 /
Takemura, Katsuya Niigata / JP | [2022/40] | Representative(s) | Sonnenhauser, Thomas Martin Wuesthoff & Wuesthoff Patentanwälte und Rechtsanwalt PartG mbB Schweigerstraße 2 81541 München / DE | [N/P] |
Former [2022/40] | Sonnenhauser, Thomas Martin Wuesthoff & Wuesthoff Patentanwälte PartG mbB Schweigerstraße 2 81541 München / DE | Application number, filing date | 22159629.9 | 02.03.2022 | [2022/40] | Priority number, date | JP20210049177 | 23.03.2021 Original published format: JP 2021049177 | [2022/40] | Filing language | EN | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | EP4067999 | Date: | 05.10.2022 | Language: | EN | [2022/40] | Type: | B1 Patent specification | No.: | EP4067999 | Date: | 04.10.2023 | Language: | EN | [2023/40] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 02.09.2022 | Classification | IPC: | G03F7/038 | [2022/40] | CPC: |
G03F7/038 (EP);
G03F7/0384 (KR);
G03F7/0387 (EP,CN,US);
C08F220/281 (US);
C08G73/1042 (US);
C08G73/14 (US);
C08K5/0025 (KR);
G03F1/78 (CN);
G03F7/0045 (KR);
G03F7/0382 (EP);
G03F7/162 (KR);
G03F7/168 (KR);
| Designated contracting states | AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR [2022/51] |
Former [2022/40] | AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR | Title | German: | NEGATIVE LICHTEMPFINDLICHE HARZZUSAMMENSETZUNG, STRUKTURIERUNGSVERFAHREN, VERFAHREN ZUR BILDUNG EINES GEHÄRTETEN FILMS, EINES ZWISCHENSCHICHTISOLIERFILMS, EINES OBERFLÄCHENSCHUTZFILMS UND EINER ELEKTRONISCHEN KOMPONENTE | [2022/40] | English: | NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATION FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT | [2022/40] | French: | COMPOSITION DE RÉSINE PHOTOSENSIBLE NÉGATIVE, PROCÉDÉ DE FORMATION DE MOTIFS, PROCÉDÉ DE FORMATION D'UN FILM DURCI, FILM D'ISOLATION INTERCOUCHE, FILM PROTECTEUR DE SURFACE ET COMPOSANT ÉLECTRONIQUE | [2022/40] | Examination procedure | 15.11.2022 | Amendment by applicant (claims and/or description) | 15.11.2022 | Examination requested [2022/51] | 15.11.2022 | Date on which the examining division has become responsible | 19.05.2023 | Communication of intention to grant the patent | 29.08.2023 | Fee for grant paid | 29.08.2023 | Fee for publishing/printing paid | 29.08.2023 | Receipt of the translation of the claim(s) |
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Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Lapses during opposition Tooltip | AT | 04.10.2023 | ES | 04.10.2023 | HR | 04.10.2023 | LT | 04.10.2023 | LV | 04.10.2023 | NL | 04.10.2023 | PL | 04.10.2023 | RS | 04.10.2023 | SE | 04.10.2023 | BG | 04.01.2024 | NO | 04.01.2024 | GR | 05.01.2024 | IS | 04.02.2024 | PT | 05.02.2024 | [2024/27] |
Former [2024/23] | AT | 04.10.2023 | |
ES | 04.10.2023 | ||
LT | 04.10.2023 | ||
NL | 04.10.2023 | ||
BG | 04.01.2024 | ||
GR | 05.01.2024 | ||
IS | 04.02.2024 | ||
PT | 05.02.2024 | ||
Former [2024/21] | LT | 04.10.2023 | |
NL | 04.10.2023 | ||
BG | 04.01.2024 | ||
GR | 05.01.2024 | ||
IS | 04.02.2024 | ||
Former [2024/20] | NL | 04.10.2023 | |
GR | 05.01.2024 | ||
IS | 04.02.2024 | ||
Former [2024/17] | NL | 04.10.2023 | Documents cited: | Search | [A]US2003194645 (HARADA YUJI [JP], et al) [A] 1-14 * paragraphs [0001] , [00 2] , [00 8] - [0013] - [0 56] - [0074] - [ 118] - [0122]; claims 1-8 *; | [A]EP1772468 (ASAHI GLASS CO LTD [JP]) [A] 1-14 * paragraphs [0001] , [0 10] , [0 85]; examples 1-82; claims 1-16 *; | [A]JP2015102612 (FUJIFILM CORP) [A] 1-14* paragraphs [0001] , [0006] , [ 111] , [ 112] , [ 176]; claims 1-16 *; | [A]KR101807630B (FUJIFILM CORP [JP]) [A] 1-14 * paragraphs [0063] - [0212] - [ 306] - [0371] - [ 537] , [ 541]; examples 1-207; claims 1-15 *; | [A]US2018305552 (MATSUMURA TOKIHIKO [JP], et al) [A] 1-14 * composition 1; paragraphs [0002] , [ 731] , [ 778] - [0779] - [ 787] , [ 863] , [ 869]; examples 1-22; claims 1-20 *; | [A]WO2019026549 (FUJIFILM CORP [JP]) [A] 1-14 * polymers A-1 to A-20; paragraphs [0001] , [00 2] , [0 93] - [0253]; examples 1-17; claims 1-12 *; | [A]WO2021006315 (TORAY INDUSTRIES [JP]) [A] 1-14 * paragraphs [0001] - [0003] - [0 10] - [0013] - [ 202] , [ 254]; examples 1-73; claims 1-20 * | by applicant | JPS6315204B | JPH0114060B | JPH0260941 | JPH0299537 | JPH02115238 | JPH031628B | JPH11100378 | JP2001310937 | JP2003055362 | JP2003231860 | WO2004074242 | JP2005008847 | JP2005018012 | JP2005146038 | JP2005290052 | JP2006199790 | JP3824286B | JP2006273748 | JP2006313237 | JP2006348252 | JP2007199653 | JP2008024920 | JP4530284B | JP2015129791 | JP2015200819 | JP5884837B | JP5987984B | WO2016140024 | JP2017044964 | WO2017188153 | JP2019045622 | JP6694230B | JP2020170103 |