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Extract from the Register of European Patents

EP About this file: EP4067999

EP4067999 - NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATION FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT [Right-click to bookmark this link]
StatusThe patent has been granted
Status updated on  01.09.2023
Database last updated on 29.06.2024
FormerGrant of patent is intended
Status updated on  18.05.2023
FormerRequest for examination was made
Status updated on  18.11.2022
FormerThe application has been published
Status updated on  02.09.2022
Most recent event   Tooltip31.05.2024Lapse of the patent in a contracting state
New state(s): HR, LV, NO, PL, RS, SE
published on 03.07.2024 [2024/27]
Applicant(s)For all designated states
Shin-Etsu Chemical Co., Ltd.
4-1, Marunouchi 1-chome
Chiyoda-ku
Tokyo 100-0005 / JP
[2022/40]
Inventor(s)01 / Iio, Masashi
Niigata / JP
02 / Urano, Hiroyuki
Niigata / JP
03 / Watanabe, Osamu
Niigata / JP
04 / Takemura, Katsuya
Niigata / JP
 [2022/40]
Representative(s)Sonnenhauser, Thomas Martin
Wuesthoff & Wuesthoff
Patentanwälte und Rechtsanwalt PartG mbB
Schweigerstraße 2
81541 München / DE
[N/P]
Former [2022/40]Sonnenhauser, Thomas Martin
Wuesthoff & Wuesthoff
Patentanwälte PartG mbB
Schweigerstraße 2
81541 München / DE
Application number, filing date22159629.902.03.2022
[2022/40]
Priority number, dateJP2021004917723.03.2021         Original published format: JP 2021049177
[2022/40]
Filing languageEN
Procedural languageEN
PublicationType: A1 Application with search report 
No.:EP4067999
Date:05.10.2022
Language:EN
[2022/40]
Type: B1 Patent specification 
No.:EP4067999
Date:04.10.2023
Language:EN
[2023/40]
Search report(s)(Supplementary) European search report - dispatched on:EP02.09.2022
ClassificationIPC:G03F7/038
[2022/40]
CPC:
G03F7/038 (EP); G03F7/0384 (KR); G03F7/0387 (EP,CN,US);
C08F220/281 (US); C08G73/1042 (US); C08G73/14 (US);
C08K5/0025 (KR); G03F1/78 (CN); G03F7/0045 (KR);
G03F7/0382 (EP); G03F7/162 (KR); G03F7/168 (KR);
G03F7/2004 (KR); G03F7/32 (KR) (-)
Designated contracting statesAL,   AT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HR,   HU,   IE,   IS,   IT,   LI,   LT,   LU,   LV,   MC,   MK,   MT,   NL,   NO,   PL,   PT,   RO,   RS,   SE,   SI,   SK,   SM,   TR [2022/51]
Former [2022/40]AL,  AT,  BE,  BG,  CH,  CY,  CZ,  DE,  DK,  EE,  ES,  FI,  FR,  GB,  GR,  HR,  HU,  IE,  IS,  IT,  LI,  LT,  LU,  LV,  MC,  MK,  MT,  NL,  NO,  PL,  PT,  RO,  RS,  SE,  SI,  SK,  SM,  TR 
TitleGerman:NEGATIVE LICHTEMPFINDLICHE HARZZUSAMMENSETZUNG, STRUKTURIERUNGSVERFAHREN, VERFAHREN ZUR BILDUNG EINES GEHÄRTETEN FILMS, EINES ZWISCHENSCHICHTISOLIERFILMS, EINES OBERFLÄCHENSCHUTZFILMS UND EINER ELEKTRONISCHEN KOMPONENTE[2022/40]
English:NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATION FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT[2022/40]
French:COMPOSITION DE RÉSINE PHOTOSENSIBLE NÉGATIVE, PROCÉDÉ DE FORMATION DE MOTIFS, PROCÉDÉ DE FORMATION D'UN FILM DURCI, FILM D'ISOLATION INTERCOUCHE, FILM PROTECTEUR DE SURFACE ET COMPOSANT ÉLECTRONIQUE[2022/40]
Examination procedure15.11.2022Amendment by applicant (claims and/or description)
15.11.2022Examination requested  [2022/51]
15.11.2022Date on which the examining division has become responsible
19.05.2023Communication of intention to grant the patent
29.08.2023Fee for grant paid
29.08.2023Fee for publishing/printing paid
29.08.2023Receipt of the translation of the claim(s)
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See the Register of the Unified Patent Court for opt-out data
Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Lapses during opposition  TooltipAT04.10.2023
ES04.10.2023
HR04.10.2023
LT04.10.2023
LV04.10.2023
NL04.10.2023
PL04.10.2023
RS04.10.2023
SE04.10.2023
BG04.01.2024
NO04.01.2024
GR05.01.2024
IS04.02.2024
PT05.02.2024
[2024/27]
Former [2024/23]AT04.10.2023
ES04.10.2023
LT04.10.2023
NL04.10.2023
BG04.01.2024
GR05.01.2024
IS04.02.2024
PT05.02.2024
Former [2024/21]LT04.10.2023
NL04.10.2023
BG04.01.2024
GR05.01.2024
IS04.02.2024
Former [2024/20]NL04.10.2023
GR05.01.2024
IS04.02.2024
Former [2024/17]NL04.10.2023
Documents cited:Search[A]US2003194645  (HARADA YUJI [JP], et al) [A] 1-14 * paragraphs [0001] , [00 2] , [00 8] - [0013] - [0 56] - [0074] - [ 118] - [0122]; claims 1-8 *;
 [A]EP1772468  (ASAHI GLASS CO LTD [JP]) [A] 1-14 * paragraphs [0001] , [0 10] , [0 85]; examples 1-82; claims 1-16 *;
 [A]JP2015102612  (FUJIFILM CORP) [A] 1-14* paragraphs [0001] , [0006] , [ 111] , [ 112] , [ 176]; claims 1-16 *;
 [A]KR101807630B  (FUJIFILM CORP [JP]) [A] 1-14 * paragraphs [0063] - [0212] - [ 306] - [0371] - [ 537] , [ 541]; examples 1-207; claims 1-15 *;
 [A]US2018305552  (MATSUMURA TOKIHIKO [JP], et al) [A] 1-14 * composition 1; paragraphs [0002] , [ 731] , [ 778] - [0779] - [ 787] , [ 863] , [ 869]; examples 1-22; claims 1-20 *;
 [A]WO2019026549  (FUJIFILM CORP [JP]) [A] 1-14 * polymers A-1 to A-20; paragraphs [0001] , [00 2] , [0 93] - [0253]; examples 1-17; claims 1-12 *;
 [A]WO2021006315  (TORAY INDUSTRIES [JP]) [A] 1-14 * paragraphs [0001] - [0003] - [0 10] - [0013] - [ 202] , [ 254]; examples 1-73; claims 1-20 *
by applicantJPS6315204B
 JPH0114060B
 JPH0260941
 JPH0299537
 JPH02115238
 JPH031628B
 JPH11100378
 JP2001310937
 JP2003055362
 JP2003231860
 WO2004074242
 JP2005008847
 JP2005018012
 JP2005146038
 JP2005290052
 JP2006199790
 JP3824286B
 JP2006273748
 JP2006313237
 JP2006348252
 JP2007199653
 JP2008024920
 JP4530284B
 JP2015129791
 JP2015200819
 JP5884837B
 JP5987984B
 WO2016140024
 JP2017044964
 WO2017188153
 JP2019045622
 JP6694230B
 JP2020170103
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