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EP4036967
European procedure
Extract from the Register of European Patents
EP About this file: EP4036967
| EP4036967 - SEMICONDUCTOR MODULE [Right-click to bookmark this link] | Status | The patent has been granted Status updated on 09.02.2024 Database last updated on 31.08.2024 | |
| Former | Grant of patent is intended Status updated on 22.10.2023 | ||
| Former | Examination is in progress Status updated on 31.03.2023 | ||
| Former | Request for examination was made Status updated on 01.07.2022 | Most recent event Tooltip | 08.08.2024 | Lapse of the patent in a contracting state New state(s): LV, SE | published on 11.09.2024 [2024/37] | Applicant(s) | For all designated states Rohm Co., Ltd. 21, Saiin Mizosaki-cho Ukyo-ku Kyoto-shi, Kyoto 615-8585 / JP | [2022/31] | Inventor(s) | 01 /
HAYASHI, Kenji Kyoto, 615-8585 / JP | 02 /
HAYASHIGUCHI, Masashi Kyoto, 615-8585 / JP | [2022/31] | Representative(s) | Isarpatent Patent- und Rechtsanwälte Barth Charles Hassa Peckmann & Partner mbB Postfach 44 01 51 80750 München / DE | [2022/31] | Application number, filing date | 22162233.5 | 27.06.2012 | [2022/31] | Priority number, date | JP20110142036 | 27.06.2011 Original published format: JP 2011142036 | JP20120033142 | 17.02.2012 Original published format: JP 2012033142 | [2022/31] | Filing language | EN | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | EP4036967 | Date: | 03.08.2022 | Language: | EN | [2022/31] | Type: | B1 Patent specification | No.: | EP4036967 | Date: | 13.03.2024 | Language: | EN | [2024/11] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 30.06.2022 | Classification | IPC: | H01L23/373, H01L25/07, H01L25/18, H01L23/24, H01L23/40, H01L23/00, H01L23/367, // H01L23/36 | [2022/31] | CPC: |
H01L25/18 (EP,US);
H01L23/367 (EP,US);
H01L23/24 (EP,US);
H01L23/3735 (EP,US);
H01L23/4006 (US);
H01L24/49 (EP,US);
H01L25/072 (EP,US);
H01L2224/0603 (EP,US);
H01L2224/291 (EP,US);
H01L2224/32225 (EP,US);
H01L2224/45124 (EP,US);
H01L2224/48137 (EP,US);
H01L2224/48139 (EP,US);
H01L2224/48227 (EP,US);
H01L2224/49111 (EP,US);
H01L2224/49113 (EP,US);
H01L2224/49175 (EP,US);
H01L2224/73265 (EP,US);
H01L23/36 (EP,US);
H01L24/29 (EP,US);
H01L24/32 (EP,US);
H01L24/45 (EP,US);
H01L24/48 (EP,US);
H01L24/73 (EP,US);
H01L2924/01013 (EP,US);
H01L2924/01028 (EP,US);
H01L2924/01029 (EP,US);
H01L2924/10272 (EP,US);
H01L2924/12032 (EP,US);
H01L2924/12036 (EP,US);
H01L2924/12041 (EP,US);
H01L2924/1305 (EP,US);
H01L2924/13055 (EP,US);
H01L2924/1306 (EP,US);
H01L2924/13091 (EP,US);
H01L2924/181 (EP,US);
| C-Set: |
H01L2224/291, H01L2924/014 (US,EP);
H01L2224/45124, H01L2924/00014 (EP);
H01L2224/49175, H01L2224/48137, H01L2924/00 (US,EP);
H01L2224/49175, H01L2224/48227, H01L2924/00 (US,EP);
H01L2224/73265, H01L2224/32225, H01L2224/48227, H01L2924/00012 (US,EP);
H01L2924/12032, H01L2924/00 (EP,US);
H01L2924/12041, H01L2924/00 (EP,US);
H01L2924/1305, H01L2924/00 (EP,US); | Designated contracting states | AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR [2023/11] |
| Former [2022/31] | AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR | Title | German: | HALBLEITERMODUL | [2022/31] | English: | SEMICONDUCTOR MODULE | [2022/31] | French: | MODULE SEMICONDUCTEUR | [2022/31] | Examination procedure | 15.03.2022 | Examination requested [2022/31] | 03.02.2023 | Amendment by applicant (claims and/or description) | 03.02.2023 | Date on which the examining division has become responsible | 30.03.2023 | Despatch of a communication from the examining division (Time limit: M04) | 27.07.2023 | Reply to a communication from the examining division | 23.10.2023 | Communication of intention to grant the patent | 31.01.2024 | Fee for grant paid | 31.01.2024 | Fee for publishing/printing paid | 31.01.2024 | Receipt of the translation of the claim(s) | Parent application(s) Tooltip | EP12803938.5 / EP2725609 | EP15191514.7 / EP2998992 | EP19171674.5 / EP3573096 | Fees paid | Renewal fee | 24.03.2022 | Renewal fee patent year 03 | 24.03.2022 | Renewal fee patent year 04 | 24.03.2022 | Renewal fee patent year 05 | 24.03.2022 | Renewal fee patent year 06 | 24.03.2022 | Renewal fee patent year 07 | 24.03.2022 | Renewal fee patent year 08 | 24.03.2022 | Renewal fee patent year 09 | 24.03.2022 | Renewal fee patent year 10 | 29.06.2022 | Renewal fee patent year 11 | 31.03.2023 | Renewal fee patent year 12 |
| Opt-out from the exclusive Tooltip competence of the Unified Patent Court | See the Register of the Unified Patent Court for opt-out data | ||
| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Lapses during opposition Tooltip | BG | 13.03.2024 | ES | 13.03.2024 | FI | 13.03.2024 | HR | 13.03.2024 | LT | 13.03.2024 | LV | 13.03.2024 | SE | 13.03.2024 | NO | 13.06.2024 | RS | 13.06.2024 | GR | 14.06.2024 | [2024/37] |
| Former [2024/35] | BG | 13.03.2024 | |
| ES | 13.03.2024 | ||
| FI | 13.03.2024 | ||
| HR | 13.03.2024 | ||
| LT | 13.03.2024 | ||
| NO | 13.06.2024 | ||
| RS | 13.06.2024 | ||
| GR | 14.06.2024 | ||
| Former [2024/33] | LT | 13.03.2024 | |
| NO | 13.06.2024 | Documents cited: | Search | [XA]DE19522173 (EUPEC GMBH & CO KG [DE]) [X] 1,4,12,13 * figure - * * column 1, line 50 - column 3, line 66 *[A] 2,3,5-11,14,15 | by applicant | JP2006202884 | JP2011142036 | JP2012033142 |