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EP4148775
European procedure
Extract from the Register of European Patents
EP About this file: EP4148775
| EP4148775 - INTEGRATED CIRCUIT DEVICES INCLUDING A VIA AND METHODS OF FORMING THE SAME [Right-click to bookmark this link] | Status | The patent has been granted Status updated on 29.03.2024 Database last updated on 24.01.2025 | |
| Former | Grant of patent is intended Status updated on 08.01.2024 | ||
| Former | Request for examination was made Status updated on 10.02.2023 | Most recent event Tooltip | 24.01.2025 | Lapse of the patent in a contracting state New state(s): EE | published on 26.02.2025 [2025/09] | Applicant(s) | For all designated states Samsung Electronics Co., Ltd. 129, Samsung-ro Yeongtong-gu Suwon-si, Gyeonggi-do 16677 / KR | [N/P] |
| Former [2023/11] | For all designated states Samsung Electronics Co., Ltd. 129, Samsung-ro Yeongtong-gu, Suwon-si Gyeonggi-do, 16677 / KR | Inventor(s) | 01 /
LEE, Anthony Dongick San Jose, CA 95134 / US | 02 /
SIMKA, Harsono San Jose, CA 95134 / US | 03 /
HE, Ming San Jose, CA 95134 / US | 04 /
NAM, Seowoo San Jose, CA 95134 / US | 05 /
AHN, Sang Hoon San Jose, CA 95134 / US | [2023/11] | Representative(s) | Kuhnen & Wacker Patent- und Rechtsanwaltsbüro PartG mbB Prinz-Ludwig-Straße 40A 85354 Freising / DE | [2023/11] | Application number, filing date | 22178086.9 | 09.06.2022 | [2023/11] | Priority number, date | US202163242193P | 09.09.2021 Original published format: US 202163242193 P | US202117546470 | 09.12.2021 Original published format: US202117546470 | [2023/11] | Filing language | EN | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | EP4148775 | Date: | 15.03.2023 | Language: | EN | [2023/11] | Type: | B1 Patent specification | No.: | EP4148775 | Date: | 01.05.2024 | Language: | EN | [2024/18] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 01.12.2022 | Classification | IPC: | H01L21/768, H01L23/522 | [2023/11] | CPC: |
H01L21/76885 (EP);
H01L21/76895 (US);
H01L21/31053 (US);
H01L21/31111 (US);
H01L21/31144 (US);
H01L21/76805 (US);
H01L21/76819 (US);
H01L21/76829 (US);
H01L21/76834 (EP);
H01L21/76897 (EP);
H01L23/5226 (EP);
H01L23/53242 (US);
| Designated contracting states | AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR [2023/11] | Title | German: | INTEGRIERTE SCHALTUNGSVORRICHTUNGEN MIT EINER DURCHKONTAKTIERUNG UND VERFAHREN ZU DEREN HERSTELLUNG | [2023/11] | English: | INTEGRATED CIRCUIT DEVICES INCLUDING A VIA AND METHODS OF FORMING THE SAME | [2023/11] | French: | DISPOSITIFS DE CIRCUIT INTÉGRÉS COMPRENANT UN TROU D'INTERCONNEXION ET LEURS PROCÉDÉS DE FORMATION | [2023/11] | Examination procedure | 11.01.2023 | Amendment by applicant (claims and/or description) | 11.01.2023 | Examination requested [2023/11] | 11.01.2023 | Date on which the examining division has become responsible | 09.01.2024 | Communication of intention to grant the patent | 25.03.2024 | Fee for grant paid | 25.03.2024 | Fee for publishing/printing paid | 25.03.2024 | Receipt of the translation of the claim(s) |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Lapses during opposition Tooltip | AT | 01.05.2024 | BG | 01.05.2024 | DK | 01.05.2024 | EE | 01.05.2024 | ES | 01.05.2024 | FI | 01.05.2024 | HR | 01.05.2024 | LV | 01.05.2024 | PL | 01.05.2024 | NO | 01.08.2024 | RS | 01.08.2024 | GR | 02.08.2024 | IS | 01.09.2024 | PT | 02.09.2024 | [2025/09] |
| Former [2025/08] | AT | 01.05.2024 | |
| BG | 01.05.2024 | ||
| DK | 01.05.2024 | ||
| ES | 01.05.2024 | ||
| FI | 01.05.2024 | ||
| HR | 01.05.2024 | ||
| LV | 01.05.2024 | ||
| PL | 01.05.2024 | ||
| NO | 01.08.2024 | ||
| RS | 01.08.2024 | ||
| GR | 02.08.2024 | ||
| IS | 01.09.2024 | ||
| PT | 02.09.2024 | ||
| Former [2024/50] | AT | 01.05.2024 | |
| BG | 01.05.2024 | ||
| ES | 01.05.2024 | ||
| FI | 01.05.2024 | ||
| HR | 01.05.2024 | ||
| LV | 01.05.2024 | ||
| PL | 01.05.2024 | ||
| NO | 01.08.2024 | ||
| RS | 01.08.2024 | ||
| GR | 02.08.2024 | ||
| IS | 01.09.2024 | ||
| PT | 02.09.2024 | ||
| Former [2024/48] | AT | 01.05.2024 | |
| BG | 01.05.2024 | ||
| ES | 01.05.2024 | ||
| FI | 01.05.2024 | ||
| HR | 01.05.2024 | ||
| NO | 01.08.2024 | ||
| GR | 02.08.2024 | ||
| IS | 01.09.2024 | ||
| PT | 02.09.2024 | Documents cited: | Search | [X]US2014117558 (BOYANOV BOYAN [US]) [X] 16 * figure 3G *; | [X]US2015130073 (SUNG SU-JENG [TW]) [X] 16 * figure 1 *; | [X]US2019363048 (ZHAO LIE [US], et al) [X] 16 * figure 4 *; | [X]US2020135560 (CLEVENGER LAWRENCE A [US], et al) [X] 16 * figure 7 *; | [XI]US2021098264 (HUANG CHIEN-HUA [TW], et al) [X] 16,17 * paragraph [0028]; figure 1I * [I] 18; | [XP]US2021375751 (DAI YU-TENG [TW], et al) [XP] 1-14,16 * figures 1,2,4-16 ** paragraph [0031]; figures 1, 2, 4-21 * |