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EP4152062
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EP About this file: EP4152062
| EP4152062 - DOUBLE-SIDED GLASS SUBSTRATE WITH A HYBRID BONDED PHOTONIC INTEGRATED CIRCUIT [Right-click to bookmark this link] | Status | Examination is in progress Status updated on 08.08.2025 Database last updated on 26.03.2026 | |
| Former | Request for examination was made Status updated on 22.09.2023 | ||
| Former | The application has been published Status updated on 17.02.2023 | Most recent event Tooltip | 10.12.2025 | New entry: Reply to examination report | Applicant(s) | For all designated states INTEL Corporation 2200 Mission College Blvd. Santa Clara, CA 95054 / US | [2023/12] | Inventor(s) | 01 /
BRYKS, Whitney Tempe 85284 / US | 02 /
KONG, Jieying Chandler 85248 / US | 03 /
ANGOUA, Bainye Phoenix 85045 / US | 04 /
WANG, Junxin Gilbert 85295 / US | 05 /
BLYTHE, Sarah Phoenix 85044 / US | 06 /
OMER, Ala Phoenix 85008 / US | 07 /
SENEVIRATNE, Dilan Chandler 85226 / US | [2023/12] | Representative(s) | Goddar, Heinz J. Boehmert & Boehmert Anwaltspartnerschaft mbB Pettenkoferstrasse 22 80336 München / DE | [2023/12] | Application number, filing date | 22183230.6 | 06.07.2022 | [2023/12] | Priority number, date | US202117481247 | 21.09.2021 Original published format: US202117481247 | [2023/12] | Filing language | EN | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | EP4152062 | Date: | 22.03.2023 | Language: | EN | [2023/12] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 23.01.2023 | Classification | IPC: | G02B6/42 | [2023/12] | CPC: |
G02B6/4201 (EP);
G02B6/43 (US);
G02B6/422 (US);
G02B6/4274 (EP,US)
| Designated contracting states | AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR [2023/43] |
| Former [2023/12] | AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR | Extension states | BA | Not yet paid | ME | Not yet paid | Validation states | KH | Not yet paid | MA | Not yet paid | MD | Not yet paid | TN | Not yet paid | Title | German: | DOPPELSEITIGES GLASSUBSTRAT MIT EINER HYBRIDEN GEBONDETEN PHOTONISCHEN INTEGRIERTEN SCHALTUNG | [2023/12] | English: | DOUBLE-SIDED GLASS SUBSTRATE WITH A HYBRID BONDED PHOTONIC INTEGRATED CIRCUIT | [2023/12] | French: | SUBSTRAT DE VERRE DOUBLE FACE DOTÉ D'UN CIRCUIT INTÉGRÉ PHOTONIQUE HYBRIDE COLLÉ | [2023/12] | Examination procedure | 20.09.2023 | Amendment by applicant (claims and/or description) | 20.09.2023 | Examination requested [2023/43] | 20.09.2023 | Date on which the examining division has become responsible | 12.08.2025 | Despatch of a communication from the examining division (Time limit: M04) | 09.12.2025 | Reply to a communication from the examining division | Fees paid | Renewal fee | 26.06.2024 | Renewal fee patent year 03 | 27.06.2025 | Renewal fee patent year 04 |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [I] US2018180808 (ZHANG CHAOQI et al.) | [I] US2017330855 (TUNG CHIH-HANG et al.) | [A] US8971676 (THACKER HIREN D et al.) [A] 1-15 * paragraph [0024] - paragraph [0027]; figure 2 * * paragraph [0036] - paragraph [0046]; figure 3 * | [I] BRUSBERG LARS ET AL: "Glass Substrate With Integrated Waveguides for Surface Mount Photonic Packaging", JOURNAL OF LIGHTWAVE TECHNOLOGY, IEEE, USA, vol. 39, no. 4, 23 October 2020 (2020-10-23), pages 912 - 919, XP011836166, ISSN: 0733-8724, [retrieved on 20210204], DOI: 10.1109/JLT.2020.3033295 DOI: http://dx.doi.org/10.1109/JLT.2020.3033295 | [I] SCHRDER H ET AL: "Demonstration of glass-based photonic interposer for mid-board-optical engines and electrical-optical circuit board (EOCB) integration strategy", PROCEEDINGS OF SPIE; [PROCEEDINGS OF SPIE ISSN 0277-786X VOLUME 10524], SPIE, US, vol. 10538, 22 February 2018 (2018-02-22), pages 105380D - 105380D, XP060101116, ISBN: 978-1-5106-1533-5, DOI: 10.1117/12.2297363 [I] 1,9-14 * page 912 - page 913; figures 1,2 * * page 917 - page 918; figure 15 * DOI: http://dx.doi.org/10.1117/12.2297363 | [A] LARS BRUSBERG ET AL: "Single-mode glass waveguide platform for DWDM chip-to-chip interconnects", ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2012 IEEE 62ND, IEEE, 29 May 2012 (2012-05-29), pages 1532 - 1539, XP032210792, ISBN: 978-1-4673-1966-9, DOI: 10.1109/ECTC.2012.6249039 DOI: http://dx.doi.org/10.1109/ECTC.2012.6249039 | Examination | WO2019066869 |