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EP4156879
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EP About this file: EP4156879
| EP4156879 - HERMETIC SEALED ELECTRONIC ASSEMBLY FOR NON DIELECTRIC IMMERSION COOLING SYSTEM [Right-click to bookmark this link] | Status | Request for examination was made Status updated on 26.05.2023 Database last updated on 19.10.2024 | |
| Former | The application has been published Status updated on 24.02.2023 | Most recent event Tooltip | 12.08.2024 | New entry: Renewal fee paid | Applicant(s) | For all designated states OVH 2, rue Kellermann 59100 Roubaix / FR | [2023/13] | Inventor(s) | 01 /
CHEHADE, Ali 59283 Moncheaux / FR | 02 /
HNAYNO, Mohamad 59100 Roubaix / FR | [2023/13] | Representative(s) | BCF Global Centre d'Entreprise et d'Innovation 17-21, rue Saint-Fiacre 75002 Paris / FR | [N/P] |
| Former [2023/13] | BCF Global Centre d'Entreprise et d'Innovation 56, Bd Niels Bohr CS 52132 69603 Villeurbanne Cedex / FR | Application number, filing date | 22306275.3 | 29.08.2022 | [2023/13] | Filing language | EN | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | EP4156879 | Date: | 29.03.2023 | Language: | EN | [2023/13] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 24.02.2023 | Classification | IPC: | H05K7/20 | [2023/13] | CPC: |
H05K7/20236 (EP);
H05K7/203 (KR,US);
H01L23/3107 (CN);
G06F1/206 (CN);
H01L23/44 (CN);
H05K7/20327 (KR,US);
H05K7/20663 (KR);
H05K7/20772 (EP);
H05K7/208 (KR);
| Designated contracting states | AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR [2023/26] |
| Former [2023/13] | AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR | Extension states | BA | Not yet paid | ME | Not yet paid | Validation states | KH | Not yet paid | MA | Not yet paid | MD | Not yet paid | TN | Not yet paid | Title | German: | HERMETISCH VERSIEGELTE ELEKTRONISCHE ANORDNUNG FÜR EIN NICHTDIELEKTRISCHES TAUCHKÜHLSYSTEM | [2023/13] | English: | HERMETIC SEALED ELECTRONIC ASSEMBLY FOR NON DIELECTRIC IMMERSION COOLING SYSTEM | [2023/13] | French: | ENSEMBLE ÉLECTRONIQUE ÉTANCHE HERMÉTIQUE POUR SYSTÈME DE REFROIDISSEMENT PAR IMMERSION NON DIÉLECTRIQUE | [2023/13] | Examination procedure | 18.05.2023 | Amendment by applicant (claims and/or description) | 18.05.2023 | Examination requested [2023/26] | 18.05.2023 | Date on which the examining division has become responsible | Fees paid | Renewal fee | 09.08.2024 | Renewal fee patent year 03 |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [XAI]US2017265336 (ICHINOSE TAKASHI [JP], et al); | [XAI]US2019223324 (LE MINH [US], et al) |