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Extract from the Register of European Patents

EP About this file: EP4292743

EP4292743 - CIRCUIT BOARD AND MANUFACTURING METHOD [Right-click to bookmark this link]
StatusRequest for examination was made
Status updated on  17.11.2023
Database last updated on 17.09.2024
FormerThe international publication has been made
Status updated on  19.08.2022
Most recent event   Tooltip11.07.2024Supplementary search reportpublished on 07.08.2024  [2024/32]
Applicant(s)For all designated states
NHK Spring Co., Ltd.
10, Fukuura 3-chome
Kanazawa-ku
Yokohama-shi, Kanagawa 236-0004 / JP
[2023/51]
Inventor(s)01 / TANAKA, Ryo
Yokohama-shi, Kanagawa 236-0004 / JP
02 / YAMAUCHI, Yuichiro
Yokohama-shi, Kanagawa 236-0004 / JP
03 / SUZUKI, Kohei
Yokohama-shi, Kanagawa 236-0004 / JP
 [2023/51]
Representative(s)Oppermann, Frank
OANDO Oppermann & Oppermann
Wilhelminenstrasse 1a
65193 Wiesbaden / DE
[2023/51]
Application number, filing date22752596.127.01.2022
[2023/51]
WO2022JP03154
Priority number, dateJP2021002050412.02.2021         Original published format: JP 2021020504
[2023/51]
Filing languageJA
Procedural languageEN
PublicationType: A1 Application with search report
No.:WO2022172767
Date:18.08.2022
Language:JA
[2022/33]
Type: A1 Application with search report 
No.:EP4292743
Date:20.12.2023
Language:EN
[2023/51]
Search report(s)International search report - published on:JP18.08.2022
(Supplementary) European search report - dispatched on:EP10.07.2024
ClassificationIPC:B23K1/00, B23K20/10, H01L23/13, H01L23/12, H01L23/36, H05K1/02, H05K3/00, H05K3/24, // H05K1/18, H01L23/373, B23K101/42, B23K1/20
[2024/32]
CPC:
B23K1/20 (EP); H01L24/83 (US); B23K1/0016 (EP);
B23K20/10 (EP); H01L23/498 (US); H01L24/32 (US);
H01L24/75 (US); H05K1/0209 (EP); H05K1/183 (US);
H05K1/186 (US); H05K3/0061 (EP); H05K3/24 (EP);
H05K3/3463 (US); B23K2101/42 (EP); H01L2224/05014 (US);
H01L2224/26175 (US); H01L2224/32225 (US); H01L2224/75353 (US);
H01L2224/83205 (US); H01L2224/83385 (US); H01L23/3735 (EP);
H01L23/3737 (EP); H01L2924/3511 (US); H05K1/181 (EP);
H05K1/188 (EP); H05K2201/0373 (EP); H05K2201/066 (EP);
H05K2201/09745 (EP); H05K2201/10553 (EP); H05K2201/10598 (EP);
H05K2201/10969 (EP); H05K2201/2072 (EP); H05K2203/0285 (EP);
H05K2203/0292 (EP); H05K2203/0307 (EP) (-)
Former IPC [2023/51]B23K1/00, B23K20/10, H01L23/13, H01L23/12, H01L23/36
Designated contracting statesAL,   AT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HR,   HU,   IE,   IS,   IT,   LI,   LT,   LU,   LV,   MC,   MK,   MT,   NL,   NO,   PL,   PT,   RO,   RS,   SE,   SI,   SK,   SM,   TR [2023/51]
TitleGerman:LEITERPLATTE UND HERSTELLUNGSVERFAHREN[2023/51]
English:CIRCUIT BOARD AND MANUFACTURING METHOD[2023/51]
French:CARTE DE CIRCUIT IMPRIMÉ ET PROCÉDÉ DE FABRICATION[2023/51]
Entry into regional phase08.08.2023Translation filed 
08.08.2023National basic fee paid 
08.08.2023Search fee paid 
08.08.2023Designation fee(s) paid 
08.08.2023Examination fee paid 
Examination procedure08.08.2023Examination requested  [2023/51]
Fees paidRenewal fee
29.01.2024Renewal fee patent year 03
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Documents cited:Search[Y]JP2006245171  (TOSHIBA CORP);
 [Y]US2019054562  (MIYASHIRO HIROSHI [JP], et al)
International search[AY]JPH05235117  (MATSUSHITA ELECTRIC WORKS LTD);
 [AY]JP2002050730  (DENSHO ENGINEERING KK);
 [AY]JP2006245171  (TOSHIBA CORP);
 [A]JP2007123937  (TOSHIBA CORP);
 [A]JP2010123680  (TOSHIBA CORP);
 [AY]WO2018143410  (MITSUBISHI ELECTRIC CORP [JP]);
 [AY]JP2018142570  (SUMITOMO ELECTRIC INDUSTRIES)
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.