EP4302336 - A PROCESS OF FORMING AN ELECTRODE INTERCONNECTION IN AN INTEGRATED MULTILAYER THIN-FILM ELECTRONIC DEVICE [Right-click to bookmark this link] | Status | Request for examination was made Status updated on 08.12.2023 Database last updated on 29.06.2024 | |
Former | The international publication has been made Status updated on 09.09.2022 | Most recent event Tooltip | 10.05.2024 | Change: Validation states | published on 12.06.2024 [2024/24] | 10.05.2024 | Change - extension states | published on 12.06.2024 [2024/24] | Applicant(s) | For all designated states Commonwealth Scientific and Industrial Research Organisation Clunies Ross Street Acton, Australian Capital Territory 2601 / AU | [2024/02] | Inventor(s) | 01 /
VAK, Doojin Clayton South, Victoria 3169 / AU | 02 /
CHANTLER, Regine Clayton South, Victoria 3169 / AU | 03 /
WEERASINGHE, Hasitha Clayton South, Victoria 3169 / AU | [2024/02] | Representative(s) | Dehns St. Bride's House 10 Salisbury Square London EC4Y 8JD / GB | [2024/02] | Application number, filing date | 22762251.1 | 01.03.2022 | [2024/02] | WO2022AU50162 | Priority number, date | AU20210900606 | 04.03.2021 Original published format: AU 2021900606 | [2024/02] | Filing language | EN | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | WO2022183239 | Date: | 09.09.2022 | Language: | EN | [2022/36] | Type: | A1 Application with search report | No.: | EP4302336 | Date: | 10.01.2024 | Language: | EN | The application published by WIPO in one of the EPO official languages on 09.09.2022 takes the place of the publication of the European patent application. | [2024/02] | Search report(s) | International search report - published on: | AU | 09.09.2022 | Classification | IPC: | H01L31/05, H01L31/0224, H01L31/0216, H01L31/0256, H01L31/042, H01L51/00, H02S40/36 | [2024/02] | CPC: |
H10K30/81 (EP,AU);
H01L21/76865 (AU);
H10K71/60 (US);
H01G11/26 (AU);
H01G4/005 (AU);
H01G9/16 (AU);
H01L23/5386 (AU);
H01L31/0224 (AU);
H10K39/12 (EP);
H10K39/18 (US);
H10K39/601 (EP,AU);
H10K71/611 (EP);
H10K85/50 (EP);
H01L2031/0344 (AU);
H01L21/823475 (AU);
| Designated contracting states | AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR [2024/02] | Title | German: | VERFAHREN ZUR HERSTELLUNG EINER ELEKTRODENVERBINDUNG IN EINER INTEGRIERTEN MEHRSCHICHTIGEN ELEKTRONISCHEN DÜNNFILMVORRICHTUNG | [2024/02] | English: | A PROCESS OF FORMING AN ELECTRODE INTERCONNECTION IN AN INTEGRATED MULTILAYER THIN-FILM ELECTRONIC DEVICE | [2024/02] | French: | PROCÉDÉ DE FORMATION D'INTERCONNEXION D'ÉLECTRODE DANS UN DISPOSITIF ÉLECTRONIQUE À FILM MINCE MULTICOUCHE INTÉGRÉ | [2024/02] | Entry into regional phase | 29.09.2023 | National basic fee paid | 29.09.2023 | Search fee paid | 29.09.2023 | Designation fee(s) paid | 29.09.2023 | Examination fee paid | Examination procedure | 29.09.2023 | Amendment by applicant (claims and/or description) | 29.09.2023 | Examination requested [2024/02] | Fees paid | Renewal fee | 21.02.2024 | Renewal fee patent year 03 |
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