EP4317529 - METAL SHEET MATERIAL, LAYERED BODY, INSULATED CIRCUIT BOARD, AND METAL SHEET MATERIAL MANUFACTURING METHOD [Right-click to bookmark this link] | Status | Request for examination was made Status updated on 05.01.2024 Database last updated on 27.07.2024 | |
Former | The international publication has been made Status updated on 30.09.2022 | Most recent event Tooltip | 31.05.2024 | Change: Validation states | published on 03.07.2024 [2024/27] | 31.05.2024 | Change - extension states | published on 03.07.2024 [2024/27] | Applicant(s) | For all designated states Mitsubishi Materials Corporation 2-3, Marunouchi 3-chome Chiyoda-ku Tokyo 100-8117 / JP | [2024/06] | Inventor(s) | 01 /
SAKAMAKI, Marina Saitama-shi, Saitama 330-8508 / JP | 02 /
KUBOTA, Kenji Naka-shi, Ibaraki 311-0102 / JP | 03 /
OHASHI, Toyo Saitama-shi, Saitama 330-8508 / JP | [2024/06] | Representative(s) | Hoffmann Eitle Patent- und Rechtsanwälte PartmbB Arabellastraße 30 81925 München / DE | [2024/06] | Application number, filing date | 22775694.7 | 23.03.2022 | [2024/06] | WO2022JP13602 | Priority number, date | JP20210053445 | 26.03.2021 Original published format: JP 2021053445 | [2024/06] | Filing language | JA | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | WO2022202912 | Date: | 29.09.2022 | Language: | JA | [2022/39] | Type: | A1 Application with search report | No.: | EP4317529 | Date: | 07.02.2024 | Language: | EN | [2024/06] | Search report(s) | International search report - published on: | JP | 29.09.2022 | Classification | IPC: | C23C28/00, C25D5/10, C25D5/16, H01L23/12, B32B15/08, B32B15/20, H05K1/09 | [2024/06] | CPC: |
H05K1/09 (EP);
H01L23/49822 (US);
B32B15/08 (EP,US);
B32B15/20 (EP,US);
B32B3/08 (EP);
B32B3/30 (EP,US);
C25D3/38 (EP,US);
C25D5/18 (EP,US);
C25D5/605 (EP,US);
C25D5/617 (US);
C25D7/0614 (EP);
H01L21/4857 (US);
H05K1/056 (EP);
B32B2250/02 (US);
B32B2255/06 (US);
B32B2255/205 (US);
B32B2307/202 (US);
B32B2307/206 (EP,US);
B32B2307/538 (EP);
B32B2307/732 (EP);
B32B2457/08 (EP,US);
H01L2224/29109 (US);
H01L2224/29111 (US);
H01L2224/29139 (US);
H01L2224/29147 (US);
H01L2224/32227 (US);
H01L23/14 (EP);
H01L24/29 (US);
H01L24/32 (US);
H01L2924/014 (US);
| Designated contracting states | AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR [2024/06] | Title | German: | METALLBLECHMATERIAL, SCHICHTKÖRPER, ISOLIERTE LEITERPLATTE UND VERFAHREN ZUR HERSTELLUNG EINES METALLBLECHMATERIALS | [2024/06] | English: | METAL SHEET MATERIAL, LAYERED BODY, INSULATED CIRCUIT BOARD, AND METAL SHEET MATERIAL MANUFACTURING METHOD | [2024/06] | French: | MATÉRIAU EN FEUILLE MÉTALLIQUE, CORPS STRATIFIÉ, CARTE DE CIRCUIT ISOLÉE, ET PROCÉDÉ DE FABRICATION DE MATÉRIAU EN FEUILLE MÉTALLIQUE | [2024/06] | Entry into regional phase | 21.09.2023 | Translation filed | 21.09.2023 | National basic fee paid | 21.09.2023 | Search fee paid | 21.09.2023 | Designation fee(s) paid | 21.09.2023 | Examination fee paid | Examination procedure | 21.09.2023 | Amendment by applicant (claims and/or description) | 21.09.2023 | Examination requested [2024/06] | Fees paid | Renewal fee | 08.03.2024 | Renewal fee patent year 03 |
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Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Cited in | International search | [Y]JPH03202500 (MATSUSHITA ELECTRIC WORKS LTD); | [Y]JP2006351677 (FURUKAWA CIRCUIT FOIL KK); | [YX]JP2020158832 (FURUKAWA ELECTRIC CO LTD); | [A]JP2020163650 (MITSUBISHI MATERIALS CORP) | by applicant | JP2000077850 | JP2015207666 | JP2021053445 |