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Extract from the Register of European Patents

EP About this file: EP4317529

EP4317529 - METAL SHEET MATERIAL, LAYERED BODY, INSULATED CIRCUIT BOARD, AND METAL SHEET MATERIAL MANUFACTURING METHOD [Right-click to bookmark this link]
StatusRequest for examination was made
Status updated on  05.01.2024
Database last updated on 27.07.2024
FormerThe international publication has been made
Status updated on  30.09.2022
Most recent event   Tooltip31.05.2024Change: Validation statespublished on 03.07.2024  [2024/27]
31.05.2024Change - extension statespublished on 03.07.2024  [2024/27]
Applicant(s)For all designated states
Mitsubishi Materials Corporation
2-3, Marunouchi 3-chome
Chiyoda-ku
Tokyo 100-8117 / JP
[2024/06]
Inventor(s)01 / SAKAMAKI, Marina
Saitama-shi, Saitama 330-8508 / JP
02 / KUBOTA, Kenji
Naka-shi, Ibaraki 311-0102 / JP
03 / OHASHI, Toyo
Saitama-shi, Saitama 330-8508 / JP
 [2024/06]
Representative(s)Hoffmann Eitle
Patent- und Rechtsanwälte PartmbB
Arabellastraße 30
81925 München / DE
[2024/06]
Application number, filing date22775694.723.03.2022
[2024/06]
WO2022JP13602
Priority number, dateJP2021005344526.03.2021         Original published format: JP 2021053445
[2024/06]
Filing languageJA
Procedural languageEN
PublicationType: A1 Application with search report
No.:WO2022202912
Date:29.09.2022
Language:JA
[2022/39]
Type: A1 Application with search report 
No.:EP4317529
Date:07.02.2024
Language:EN
[2024/06]
Search report(s)International search report - published on:JP29.09.2022
ClassificationIPC:C23C28/00, C25D5/10, C25D5/16, H01L23/12, B32B15/08, B32B15/20, H05K1/09
[2024/06]
CPC:
H05K1/09 (EP); H01L23/49822 (US); B32B15/08 (EP,US);
B32B15/20 (EP,US); B32B3/08 (EP); B32B3/30 (EP,US);
C25D3/38 (EP,US); C25D5/18 (EP,US); C25D5/605 (EP,US);
C25D5/617 (US); C25D7/0614 (EP); H01L21/4857 (US);
H05K1/056 (EP); B32B2250/02 (US); B32B2255/06 (US);
B32B2255/205 (US); B32B2307/202 (US); B32B2307/206 (EP,US);
B32B2307/538 (EP); B32B2307/732 (EP); B32B2457/08 (EP,US);
H01L2224/29109 (US); H01L2224/29111 (US); H01L2224/29139 (US);
H01L2224/29147 (US); H01L2224/32227 (US); H01L23/14 (EP);
H01L24/29 (US); H01L24/32 (US); H01L2924/014 (US);
H05K1/181 (EP); H05K3/0061 (EP) (-)
Designated contracting statesAL,   AT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HR,   HU,   IE,   IS,   IT,   LI,   LT,   LU,   LV,   MC,   MK,   MT,   NL,   NO,   PL,   PT,   RO,   RS,   SE,   SI,   SK,   SM,   TR [2024/06]
TitleGerman:METALLBLECHMATERIAL, SCHICHTKÖRPER, ISOLIERTE LEITERPLATTE UND VERFAHREN ZUR HERSTELLUNG EINES METALLBLECHMATERIALS[2024/06]
English:METAL SHEET MATERIAL, LAYERED BODY, INSULATED CIRCUIT BOARD, AND METAL SHEET MATERIAL MANUFACTURING METHOD[2024/06]
French:MATÉRIAU EN FEUILLE MÉTALLIQUE, CORPS STRATIFIÉ, CARTE DE CIRCUIT ISOLÉE, ET PROCÉDÉ DE FABRICATION DE MATÉRIAU EN FEUILLE MÉTALLIQUE[2024/06]
Entry into regional phase21.09.2023Translation filed 
21.09.2023National basic fee paid 
21.09.2023Search fee paid 
21.09.2023Designation fee(s) paid 
21.09.2023Examination fee paid 
Examination procedure21.09.2023Amendment by applicant (claims and/or description)
21.09.2023Examination requested  [2024/06]
Fees paidRenewal fee
08.03.2024Renewal fee patent year 03
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Cited inInternational search[Y]JPH03202500  (MATSUSHITA ELECTRIC WORKS LTD);
 [Y]JP2006351677  (FURUKAWA CIRCUIT FOIL KK);
 [YX]JP2020158832  (FURUKAWA ELECTRIC CO LTD);
 [A]JP2020163650  (MITSUBISHI MATERIALS CORP)
by applicantJP2000077850
 JP2015207666
 JP2021053445
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.