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Extract from the Register of European Patents

EP About this file: EP4332194

EP4332194 - CHIP, METHOD FOR MANUFACTURING CHIP, AND ADHESIVE COMPOSITION [Right-click to bookmark this link]
StatusRequest for examination was made
Status updated on  02.02.2024
Database last updated on 14.11.2024
FormerThe international publication has been made
Status updated on  09.12.2022
Most recent event   Tooltip08.11.2024The date on which the examining division becomes responsible, has been established 
Applicant(s)For all designated states
Denka Company Limited
1-1 Nihonbashi-Muromachi 2-chome
Chuo-ku
Tokyo 103-8338 / JP
[2024/10]
Inventor(s)01 / NAGAOKA, Kota
Tokyo 103-8338 / JP
02 / KUMAGAI, Yushi
Tokyo 103-8338 / JP
 [2024/10]
Representative(s)Gulde & Partner
Patent- und Rechtsanwaltskanzlei mbB
Wallstraße 58/59
10179 Berlin / DE
[2024/10]
Application number, filing date22815907.524.05.2022
[2024/10]
WO2022JP21184
Priority number, dateJP2021009142631.05.2021         Original published format: JP 2021091426
[2024/10]
Filing languageJA
Procedural languageEN
PublicationType: A1 Application with search report
No.:WO2022255157
Date:08.12.2022
Language:JA
[2022/49]
Type: A1 Application with search report 
No.:EP4332194
Date:06.03.2024
Language:EN
[2024/10]
Search report(s)International search report - published on:JP08.12.2022
(Supplementary) European search report - dispatched on:EP18.10.2024
ClassificationIPC:C09J111/00
[2024/10]
CPC:
C08F36/16 (EP); C09J111/00 (EP); C09J111/02 (EP)
C-Set:
C08F36/16, C08F2/24 (EP)
Designated contracting statesAL,   AT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HR,   HU,   IE,   IS,   IT,   LI,   LT,   LU,   LV,   MC,   MK,   MT,   NL,   NO,   PL,   PT,   RO,   RS,   SE,   SI,   SK,   SM,   TR [2024/10]
TitleGerman:CHIP, VERFAHREN ZUR HERSTELLUNG EINES CHIPS UND KLEBSTOFFZUSAMMENSETZUNG[2024/10]
English:CHIP, METHOD FOR MANUFACTURING CHIP, AND ADHESIVE COMPOSITION[2024/10]
French:PUCE, PROCÉDÉ DE FABRICATION DE PUCE ET COMPOSITION ADHÉSIVE[2024/10]
Entry into regional phase30.11.2023Translation filed 
30.11.2023National basic fee paid 
30.11.2023Search fee paid 
30.11.2023Designation fee(s) paid 
30.11.2023Examination fee paid 
Examination procedure30.11.2023Amendment by applicant (claims and/or description)
30.11.2023Examination requested  [2024/10]
08.11.2024Date on which the examining division has become responsible
Fees paidRenewal fee
04.12.2023Renewal fee patent year 03
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Cited inInternational search[A]JP2009191182  (DENKI KAGAKU KOGYO KK);
 [A]JP2012111862  (DENKI KAGAKU KOGYO KK);
 [A]JP2012188618  (DENKI KAGAKU KOGYO KK);
 [A]JP2013177504  (DENKI KAGAKU KOGYO KK)
by applicantJP2003226852
 JP2005008713
 JP2007177198
 JP2010275338
 JP2012111862
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.