EP4332194 - CHIP, METHOD FOR MANUFACTURING CHIP, AND ADHESIVE COMPOSITION [Right-click to bookmark this link] | Status | Request for examination was made Status updated on 02.02.2024 Database last updated on 14.11.2024 | |
Former | The international publication has been made Status updated on 09.12.2022 | Most recent event Tooltip | 08.11.2024 | The date on which the examining division becomes responsible, has been established | Applicant(s) | For all designated states Denka Company Limited 1-1 Nihonbashi-Muromachi 2-chome Chuo-ku Tokyo 103-8338 / JP | [2024/10] | Inventor(s) | 01 /
NAGAOKA, Kota Tokyo 103-8338 / JP | 02 /
KUMAGAI, Yushi Tokyo 103-8338 / JP | [2024/10] | Representative(s) | Gulde & Partner Patent- und Rechtsanwaltskanzlei mbB Wallstraße 58/59 10179 Berlin / DE | [2024/10] | Application number, filing date | 22815907.5 | 24.05.2022 | [2024/10] | WO2022JP21184 | Priority number, date | JP20210091426 | 31.05.2021 Original published format: JP 2021091426 | [2024/10] | Filing language | JA | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | WO2022255157 | Date: | 08.12.2022 | Language: | JA | [2022/49] | Type: | A1 Application with search report | No.: | EP4332194 | Date: | 06.03.2024 | Language: | EN | [2024/10] | Search report(s) | International search report - published on: | JP | 08.12.2022 | (Supplementary) European search report - dispatched on: | EP | 18.10.2024 | Classification | IPC: | C09J111/00 | [2024/10] | CPC: |
C08F36/16 (EP);
C09J111/00 (EP);
C09J111/02 (EP)
| C-Set: |
C08F36/16, C08F2/24 (EP)
| Designated contracting states | AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR [2024/10] | Title | German: | CHIP, VERFAHREN ZUR HERSTELLUNG EINES CHIPS UND KLEBSTOFFZUSAMMENSETZUNG | [2024/10] | English: | CHIP, METHOD FOR MANUFACTURING CHIP, AND ADHESIVE COMPOSITION | [2024/10] | French: | PUCE, PROCÉDÉ DE FABRICATION DE PUCE ET COMPOSITION ADHÉSIVE | [2024/10] | Entry into regional phase | 30.11.2023 | Translation filed | 30.11.2023 | National basic fee paid | 30.11.2023 | Search fee paid | 30.11.2023 | Designation fee(s) paid | 30.11.2023 | Examination fee paid | Examination procedure | 30.11.2023 | Amendment by applicant (claims and/or description) | 30.11.2023 | Examination requested [2024/10] | 08.11.2024 | Date on which the examining division has become responsible | Fees paid | Renewal fee | 04.12.2023 | Renewal fee patent year 03 |
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Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Cited in | International search | [A]JP2009191182 (DENKI KAGAKU KOGYO KK); | [A]JP2012111862 (DENKI KAGAKU KOGYO KK); | [A]JP2012188618 (DENKI KAGAKU KOGYO KK); | [A]JP2013177504 (DENKI KAGAKU KOGYO KK) | by applicant | JP2003226852 | JP2005008713 | JP2007177198 | JP2010275338 | JP2012111862 |