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EP4343829
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EP About this file: EP4343829
| EP4343829 - HEAT DISSIPATION APPARATUS, CIRCUIT MODULE, ELECTRONIC DEVICE, AND METHOD FOR ASSEMBLING CIRCUIT MODULE [Right-click to bookmark this link] | Status | Request for examination was made Status updated on 23.02.2024 Database last updated on 06.07.2024 | |
| Former | The international publication has been made Status updated on 30.12.2022 | Most recent event Tooltip | 02.04.2024 | New entry: Renewal fee paid | Applicant(s) | For all designated states Huawei Technologies Co., Ltd. Huawei Administration Building Bantian Longgang Shenzhen, Guangdong 518129 / CN | [2024/13] | Inventor(s) | 01 /
CHEN, Wei Shenzhen, Guangdong 518129 / CN | 02 /
MA, Weice Shenzhen, Guangdong 518129 / CN | 03 /
LIN, Benwei Shenzhen, Guangdong 518129 / CN | 04 /
YING, Xiaoyuan Shenzhen, Guangdong 518129 / CN | [2024/13] | Representative(s) | MERH-IP Matias Erny Reichl Hoffmann Patentanwälte PartG mbB Paul-Heyse-Strasse 29 80336 München / DE | [2024/13] | Application number, filing date | 22827494.0 | 17.06.2022 | [2024/13] | WO2022CN99597 | Priority number, date | CN202110693775 | 22.06.2021 Original published format: CN202110693775 | [2024/13] | Filing language | ZH | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | WO2022267999 | Date: | 29.12.2022 | Language: | ZH | [2022/52] | Type: | A1 Application with search report | No.: | EP4343829 | Date: | 27.03.2024 | Language: | EN | [2024/13] | Search report(s) | International search report - published on: | CN | 29.12.2022 | Classification | IPC: | H01L23/40, H05K7/20, G06F1/20 | [2024/13] | CPC: |
H01L23/4093 (EP);
H05K1/0203 (CN,US);
G06F1/20 (EP);
H01L23/4006 (EP);
H01L23/427 (EP);
H05K1/02 (EP);
H05K7/14 (EP,CN);
H05K7/1401 (US);
H05K7/20 (EP);
| Designated contracting states | AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR [2024/13] | Extension states | BA | Not yet paid | ME | Not yet paid | Validation states | KH | Not yet paid | MA | Not yet paid | MD | Not yet paid | TN | Not yet paid | Title | German: | WÄRMEABLEITUNGSVORRICHTUNG, SCHALTMODUL, ELEKTRONISCHE VORRICHTUNG UND VERFAHREN ZUR MONTAGE DES SCHALTMODULS | [2024/13] | English: | HEAT DISSIPATION APPARATUS, CIRCUIT MODULE, ELECTRONIC DEVICE, AND METHOD FOR ASSEMBLING CIRCUIT MODULE | [2024/13] | French: | APPAREIL DE DISSIPATION DE CHALEUR, MODULE DE CIRCUIT, DISPOSITIF ÉLECTRONIQUE ET PROCÉDÉ D'ASSEMBLAGE DE MODULE DE CIRCUIT | [2024/13] | Entry into regional phase | 22.12.2023 | Translation filed | 22.12.2023 | National basic fee paid | 22.12.2023 | Search fee paid | 22.12.2023 | Designation fee(s) paid | 22.12.2023 | Examination fee paid | Examination procedure | 22.12.2023 | Amendment by applicant (claims and/or description) | 22.12.2023 | Examination requested [2024/13] | Fees paid | Renewal fee | 31.03.2024 | Renewal fee patent year 03 |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Cited in | International search | [A]CN1239238 (FUHUAI SHENZHENG PRECISION IND [CN]); | [A]TWM247880U (DELTA ELECTRONICS INC [TW]); | [X]CN1592967 (INTEL CORP [US]); | [A]US2008000618 (LIANG ROBERT [TW]); | [X]US2011061847 (HSIEH MENG-HSIU [TW]); | [X]CN105684564 (AAVID THERMALLOY LLC); | [X]CN206100764U (AAVID (SHANGHAI) THERMAL SYSTEM CO LTD, et al) |