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Extract from the Register of European Patents

EP About this file: EP4397487

EP4397487 - LCP EXTRUDED FILM, INSULATING MATERIAL FOR CIRCUIT BOARD, AND METAL FOIL CLAD LAMINATE [Right-click to bookmark this link]
StatusRequest for examination was made
Status updated on  07.06.2024
Database last updated on 11.09.2024
FormerThe international publication has been made
Status updated on  11.03.2023
Most recent event   Tooltip22.08.2024New entry: Renewal fee paid 
Applicant(s)For all designated states
Denka Company Limited
1-1 Nihonbashi-Muromachi 2-chome
Chuo-ku
Tokyo 103-8338 / JP
[2024/28]
Inventor(s)01 / ISHIZUKA, Ryota
Tokyo 103-8338 / JP
02 / MASUDA, Yusuke
Tokyo 103-8338 / JP
03 / OGAWA, Naoki
Tokyo 103-8338 / JP
 [2024/28]
Representative(s)Zacco Sweden AB
P.O. Box 5581
Löjtnantsgatan 21
114 85 Stockholm / SE
[2024/28]
Application number, filing date22864684.001.09.2022
[2024/28]
WO2022JP32930
Priority number, dateJP2021014405403.09.2021         Original published format: JP 2021144054
[2024/28]
Filing languageJA
Procedural languageEN
PublicationType: A1 Application with search report
No.:WO2023033102
Date:09.03.2023
Language:JA
[2023/10]
Type: A1 Application with search report 
No.:EP4397487
Date:10.07.2024
Language:EN
[2024/28]
Search report(s)International search report - published on:JP09.03.2023
ClassificationIPC:B32B27/12, C08J5/18, B32B15/08, B29C48/21, B29C48/25, H05K1/03
[2024/28]
CPC:
B29C48/022 (EP); B29C48/21 (EP,KR); B29C48/0021 (KR);
B29C48/23 (EP); B29D7/01 (EP,KR); B32B15/08 (EP,KR);
B32B15/09 (EP); B32B15/20 (EP); B32B27/08 (EP);
B32B27/12 (EP,KR); B32B27/20 (EP); B32B27/281 (EP);
B32B27/285 (EP); B32B27/286 (EP); B32B27/288 (EP);
B32B27/34 (EP); B32B27/36 (EP); B32B27/365 (EP);
B32B37/15 (KR); C08J5/18 (EP,KR); H05K1/03 (EP,KR);
B29C2791/001 (EP); B29C2793/0063 (EP); B29C2793/009 (EP);
B29C48/0011 (EP); B29C48/0022 (EP); B29C48/08 (EP);
B29C48/28 (EP); B29C48/307 (EP); B29C48/35 (EP);
B29C48/914 (EP); B29K2105/0079 (EP); B32B2250/40 (KR);
B32B2264/10 (KR); B32B2457/08 (KR); B32B38/10 (EP) (-)
Designated contracting statesAL,   AT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HR,   HU,   IE,   IS,   IT,   LI,   LT,   LU,   LV,   MC,   MK,   MT,   NL,   NO,   PL,   PT,   RO,   RS,   SE,   SI,   SK,   SM,   TR [2024/28]
Extension statesBANot yet paid
MENot yet paid
Validation statesKHNot yet paid
MANot yet paid
MDNot yet paid
TNNot yet paid
TitleGerman:EXTRUDIERTE LCP-FOLIE, ISOLIERMATERIAL FÜR LEITERPLATTE UND METALLFOLIENKASCHIERTES LAMINAT[2024/28]
English:LCP EXTRUDED FILM, INSULATING MATERIAL FOR CIRCUIT BOARD, AND METAL FOIL CLAD LAMINATE[2024/28]
French:FILM EXTRUDÉ EN PCL, MATÉRIAU ISOLANT POUR CARTE DE CIRCUIT IMPRIMÉ, ET STRATIFIÉ PLAQUÉ DE FEUILLE MÉTALLIQUE[2024/28]
Entry into regional phase12.01.2024Translation filed 
12.01.2024National basic fee paid 
12.01.2024Search fee paid 
12.01.2024Designation fee(s) paid 
12.01.2024Examination fee paid 
Examination procedure12.01.2024Examination requested  [2024/28]
Fees paidRenewal fee
22.08.2024Renewal fee patent year 03
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Cited inInternational search[X]JPH08302208  (UNITIKA CHEM KK);
 [A]JP2017192875  (UNIV FUKUOKA, et al);
 [A]JP2018154409  (TOYO SEIKAN GROUP HOLDINGS LTD);
 [A]JP2019218485  (UNIV OSAKA, et al)
by applicantJPS6331729
 JP2010221694
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.