EP4393634 - SOLDER ALLOY, SOLDER BALL, SOLDER PREFORM, SOLDER PASTE, AND SOLDER JOINT [Right-click to bookmark this link] | Status | Request for examination was made Status updated on 31.05.2024 Database last updated on 02.11.2024 | |
Former | The international publication has been made Status updated on 07.04.2023 | Most recent event Tooltip | 31.05.2024 | Publication in section I.1 EP Bulletin | published on 03.07.2024 [2024/27] | 31.05.2024 | Request for examination filed | published on 03.07.2024 [2024/27] | Applicant(s) | For all designated states Senju Metal Industry Co., Ltd. 23, Senju Hashido-cho Adachi-ku Tokyo 120-8555 / JP | [2024/27] | Inventor(s) | 01 /
YOKOYAMA, Takahiro Tokyo 120-8555 / JP | 02 /
SAITO, Takashi Tokyo 120-8555 / JP | 03 /
YOSHIKAWA, Shunsaku Tokyo 120-8555 / JP | 04 /
SUGISAWA, Kota Tokyo 120-8555 / JP | [2024/27] | Representative(s) | Grünecker Patent- und Rechtsanwälte PartG mbB Leopoldstraße 4 80802 München / DE | [2024/27] | Application number, filing date | 22876492.4 | 29.09.2022 | [2024/27] | WO2022JP36552 | Priority number, date | JP20210161531 | 30.09.2021 Original published format: JP 2021161531 | [2024/27] | Filing language | JA | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | WO2023054629 | Date: | 06.04.2023 | Language: | JA | [2023/14] | Type: | A1 Application with search report | No.: | EP4393634 | Date: | 03.07.2024 | Language: | EN | [2024/27] | Search report(s) | International search report - published on: | JP | 06.04.2023 | Classification | IPC: | B23K35/26, B23K35/22, C22C13/00 | [2024/27] | CPC: |
B23K35/22 (EP);
B23K35/262 (EP,KR);
B23K35/0244 (EP);
B23K35/025 (EP,KR);
B23K35/26 (EP);
C22C13/00 (EP,KR)
| Designated contracting states | AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR [2024/27] | Extension states | BA | Not yet paid | ME | Not yet paid | Validation states | KH | Not yet paid | MA | Not yet paid | MD | Not yet paid | TN | Not yet paid | Title | German: | LÖTLEGIERUNG, LÖTKUGEL, LÖTVORFORM, LÖTPASTE UND LÖTVERBINDUNG | [2024/27] | English: | SOLDER ALLOY, SOLDER BALL, SOLDER PREFORM, SOLDER PASTE, AND SOLDER JOINT | [2024/27] | French: | ALLIAGE DE SOUDAGE, BILLE DE SOUDURE, PRÉFORME DE SOUDURE, PÂTE À SOUDER, ET JOINT À BRASURE TENDRE | [2024/27] | Entry into regional phase | 28.03.2024 | Translation filed | 28.03.2024 | National basic fee paid | 28.03.2024 | Search fee paid | 28.03.2024 | Designation fee(s) paid | 28.03.2024 | Examination fee paid | Examination procedure | 28.03.2024 | Amendment by applicant (claims and/or description) | 28.03.2024 | Examination requested [2024/27] | Fees paid | Renewal fee | 31.03.2024 | Renewal fee patent year 03 |
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Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Cited in | International search | [A]CN103341699 (ZHEJIANG ASIA GENERAL SOLDERING & BRAZING MATERIAL CO LTD); | [A]JP2015020182 (HARIMA CHEMICALS INC); | [A]WO2015198496 (HARIMA CHEMICALS INC [JP]); | [A]JP2018122324 (TAMURA SEISAKUSHO KK); | [A]CN108994480 (YUNNAN TIN MAT CO LTD); | [A]WO2021043437 (ALPHA ASSEMBLY SOLUTIONS INC [US], et al) | by applicant | JPH037005 | JP2019063830 |