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Extract from the Register of European Patents

EP About this file: EP4393634

EP4393634 - SOLDER ALLOY, SOLDER BALL, SOLDER PREFORM, SOLDER PASTE, AND SOLDER JOINT [Right-click to bookmark this link]
StatusRequest for examination was made
Status updated on  31.05.2024
Database last updated on 02.11.2024
FormerThe international publication has been made
Status updated on  07.04.2023
Most recent event   Tooltip31.05.2024Publication in section I.1 EP Bulletinpublished on 03.07.2024  [2024/27]
31.05.2024Request for examination filedpublished on 03.07.2024  [2024/27]
Applicant(s)For all designated states
Senju Metal Industry Co., Ltd.
23, Senju Hashido-cho
Adachi-ku
Tokyo 120-8555 / JP
[2024/27]
Inventor(s)01 / YOKOYAMA, Takahiro
Tokyo 120-8555 / JP
02 / SAITO, Takashi
Tokyo 120-8555 / JP
03 / YOSHIKAWA, Shunsaku
Tokyo 120-8555 / JP
04 / SUGISAWA, Kota
Tokyo 120-8555 / JP
 [2024/27]
Representative(s)Grünecker Patent- und Rechtsanwälte PartG mbB
Leopoldstraße 4
80802 München / DE
[2024/27]
Application number, filing date22876492.429.09.2022
[2024/27]
WO2022JP36552
Priority number, dateJP2021016153130.09.2021         Original published format: JP 2021161531
[2024/27]
Filing languageJA
Procedural languageEN
PublicationType: A1 Application with search report
No.:WO2023054629
Date:06.04.2023
Language:JA
[2023/14]
Type: A1 Application with search report 
No.:EP4393634
Date:03.07.2024
Language:EN
[2024/27]
Search report(s)International search report - published on:JP06.04.2023
ClassificationIPC:B23K35/26, B23K35/22, C22C13/00
[2024/27]
CPC:
B23K35/22 (EP); B23K35/262 (EP,KR); B23K35/0244 (EP);
B23K35/025 (EP,KR); B23K35/26 (EP); C22C13/00 (EP,KR)
Designated contracting statesAL,   AT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HR,   HU,   IE,   IS,   IT,   LI,   LT,   LU,   LV,   MC,   MK,   MT,   NL,   NO,   PL,   PT,   RO,   RS,   SE,   SI,   SK,   SM,   TR [2024/27]
Extension statesBANot yet paid
MENot yet paid
Validation statesKHNot yet paid
MANot yet paid
MDNot yet paid
TNNot yet paid
TitleGerman:LÖTLEGIERUNG, LÖTKUGEL, LÖTVORFORM, LÖTPASTE UND LÖTVERBINDUNG[2024/27]
English:SOLDER ALLOY, SOLDER BALL, SOLDER PREFORM, SOLDER PASTE, AND SOLDER JOINT[2024/27]
French:ALLIAGE DE SOUDAGE, BILLE DE SOUDURE, PRÉFORME DE SOUDURE, PÂTE À SOUDER, ET JOINT À BRASURE TENDRE[2024/27]
Entry into regional phase28.03.2024Translation filed 
28.03.2024National basic fee paid 
28.03.2024Search fee paid 
28.03.2024Designation fee(s) paid 
28.03.2024Examination fee paid 
Examination procedure28.03.2024Amendment by applicant (claims and/or description)
28.03.2024Examination requested  [2024/27]
Fees paidRenewal fee
31.03.2024Renewal fee patent year 03
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Cited inInternational search[A]CN103341699  (ZHEJIANG ASIA GENERAL SOLDERING & BRAZING MATERIAL CO LTD);
 [A]JP2015020182  (HARIMA CHEMICALS INC);
 [A]WO2015198496  (HARIMA CHEMICALS INC [JP]);
 [A]JP2018122324  (TAMURA SEISAKUSHO KK);
 [A]CN108994480  (YUNNAN TIN MAT CO LTD);
 [A]WO2021043437  (ALPHA ASSEMBLY SOLUTIONS INC [US], et al)
by applicantJPH037005
 JP2019063830
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.