blank Quick help
blank Maintenance news

Scheduled maintenance

Regular maintenance outages:
between 05.00 and 05.15 hrs CET (Monday to Sunday).

Other outages
Availability

2022.02.11

More...
blank News flashes

News Flashes

New version of the European Patent Register – SPC proceedings information in the Unitary Patent Register.

2024-07-24

More...
blank Related links

Extract from the Register of European Patents

EP About this file: EP4243079

EP4243079 - SEMICONDUCTOR DEVICE, INTEGRATED CIRCUIT, AND ELECTRONIC DEVICE [Right-click to bookmark this link]
StatusRequest for examination was made
Status updated on  11.08.2023
Database last updated on 01.10.2024
Most recent event   Tooltip10.01.2024The date on which the examining division becomes responsible, has been established 
10.01.2024Amendment by applicant 
Applicant(s)For all designated states
Huawei Digital Power Technologies Co., Ltd.
Office 01, 39th Floor, Block A
Antuoshan Headquarters Towers
33 Antuoshan 6th Road
Futian District
Shenzhen, 518043 / CN
[2023/37]
Inventor(s)01 / JIAO, Chunkun
Shenzhen, 518043 / CN
 [2023/37]
Representative(s)Thun, Clemens
Mitscherlich PartmbB
Patent- und Rechtsanwälte
Karlstraße 7
80333 München / DE
[2023/37]
Application number, filing date23160090.906.03.2023
[2023/37]
Priority number, dateCN20221021661707.03.2022         Original published format: CN202210216617
[2023/37]
Filing languageZH
Procedural languageEN
PublicationType: A1 Application with search report 
No.:EP4243079
Date:13.09.2023
Language:EN
[2023/37]
Search report(s)(Supplementary) European search report - dispatched on:EP03.08.2023
ClassificationIPC:H01L29/06, H01L29/10, H01L29/78
[2023/37]
CPC:
H01L29/7813 (EP); H01L29/0607 (US); H01L29/0692 (EP);
H01L29/1095 (EP); H01L29/4236 (US); H01L29/7827 (US);
H01L29/0623 (EP); H01L29/0696 (EP) (-)
Designated contracting statesAL,   AT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HR,   HU,   IE,   IS,   IT,   LI,   LT,   LU,   LV,   MC,   ME,   MK,   MT,   NL,   NO,   PL,   PT,   RO,   RS,   SE,   SI,   SK,   SM,   TR [2023/37]
Extension statesBANot yet paid
Validation statesKHNot yet paid
MANot yet paid
MDNot yet paid
TNNot yet paid
TitleGerman:HALBLEITERBAUELEMENT, INTEGRIERTE SCHALTUNG UND ELEKTRONISCHE VORRICHTUNG[2023/37]
English:SEMICONDUCTOR DEVICE, INTEGRATED CIRCUIT, AND ELECTRONIC DEVICE[2023/37]
French:DISPOSITIF À SEMI-CONDUCTEUR, CIRCUIT INTÉGRÉ ET DISPOSITIF ÉLECTRONIQUE[2023/37]
Examination procedure06.03.2023Examination requested  [2023/37]
10.01.2024Amendment by applicant (claims and/or description)
10.01.2024Date on which the examining division has become responsible
Opt-out from the exclusive  Tooltip
competence of the Unified
Patent Court
See the Register of the Unified Patent Court for opt-out data
Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Documents cited:Search[Y]US10700182  (AICHINGER THOMAS [AT], et al) [Y] 8* column 15, line 26 - column 16, line 5; figures 4A-4C *;
 [XI]US2020303540  (MIYASHITA HIROYUKI [JP]) [X] 1,2,6,7,13,14,16 * paragraph [0062] - paragraph [0071]; figures 1-5 * [I] 17,18;
 [XI]US2020373292  (HOSHI YASUYUKI [JP]) [X] 1-3,6,7,13,14,16 * column 6, line 1 - column 7, line 23; figure 1 * * column 16, line 61 - column 17, line 42; figures 24, 25 * * column 10, line 14 - line 22 * [I] 4,5,17,18;
 [XAYI]US10937901  (KINOSHITA AKIMASA [JP]) [X] 1,2,6,7,9-14,16 * paragraph [0057] - paragraph [0066]; figures 1-4 * * paragraph [0073] - paragraph [0090] * [A] 15 [Y] 8 [I] 17,18
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.