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EP4318829
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EP About this file: EP4318829
| EP4318829 - ELECTRONIC COMPONENT PACKAGE AND THE MANUFACTURING METHOD THEREOF [Right-click to bookmark this link] | Status | Request for examination was made Status updated on 08.08.2024 Database last updated on 18.11.2024 | |
| Former | The application has been published Status updated on 05.01.2024 | Most recent event Tooltip | 08.08.2024 | The date on which the examining division becomes responsible, has been established | 08.08.2024 | Request for examination filed | published on 11.09.2024 [2024/37] | 08.08.2024 | Change - designated states | published on 11.09.2024 [2024/37] | Applicant(s) | For all designated states Arima Lasers Corp. 9F., No. 458, Sec. Pingzhen Zhongxing Rd. Pingzhen Dist. 324 Taoyuan City / TW | [2024/06] | Inventor(s) | 01 /
MI, CHUN-WEI 333 Taoyuan City / TW | [2024/06] | Representative(s) | Michalski Hüttermann & Partner Patentanwälte mbB Kaistraße 16A 40221 Düsseldorf / DE | [2024/06] | Application number, filing date | 23189991.5 | 07.08.2023 | [2024/06] | Priority number, date | US202263370497P | 05.08.2022 Original published format: US 202263370497 P | [2024/06] | Filing language | EN | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | EP4318829 | Date: | 07.02.2024 | Language: | EN | [2024/06] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 15.12.2023 | Classification | IPC: | H01S5/02212, H01S5/02345, // H01S5/062 | [2024/06] | CPC: |
H01S5/02212 (EP,CN,US);
H01S5/02315 (EP,US);
H01S5/0232 (CN);
H01S5/02345 (EP,CN,US);
H01S5/0239 (CN);
H01S5/0262 (CN);
H01L23/045 (EP);
H01S5/02218 (EP);
H01S5/02255 (EP);
H01S5/06226 (EP)
(-)
| Designated contracting states | AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, ME, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR [2024/37] |
| Former [2024/06] | AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, ME, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR | Extension states | BA | Not yet paid | Validation states | KH | Not yet paid | MA | Not yet paid | MD | Not yet paid | TN | Not yet paid | Title | German: | GEHÄUSE FÜR ELEKTRONISCHE KOMPONENTEN UND HERSTELLUNGSVERFAHREN DAFÜR | [2024/06] | English: | ELECTRONIC COMPONENT PACKAGE AND THE MANUFACTURING METHOD THEREOF | [2024/06] | French: | BOÎTIER DE COMPOSANT ÉLECTRONIQUE ET SON PROCÉDÉ DE FABRICATION | [2024/06] | Examination procedure | 06.08.2024 | Amendment by applicant (claims and/or description) | 06.08.2024 | Examination requested [2024/37] | 06.08.2024 | Date on which the examining division has become responsible |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [Y]US4733067 (OINOUE HIROSHI [JP], et al) [Y] 12 * column 2, lines 15-39; figures 2,9 ** column 3, lines 50-58 *; | [XYI]US2005194601 (SUENAGA RYOMA [JP]) [X] 1-4,6 * paragraphs [0044] - [0124]; figures 1-5 * [Y] 7-15 [I] 5; | [XYI]US2007228405 (TATEIWA YOSHIHIRO [JP], et al) [X] 1-4,6-11,13-15 * paragraphs [0019] - [0025] - [0034] - [0038]; figures 1,4 * [Y] 7-15 [I] 5; | [XYI]JP2014003062 (MITSUBISHI ELECTRIC CORP) [X] 1-4,6 * paragraphs [0011] - [0024]; figure 1 * [Y] 7-15 [I] 5,7-15 |