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EP4351008
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EP About this file: EP4351008
| EP4351008 - RF CHIP TO IMPROVE TRANSMIT CHANNEL FLATNESS [Right-click to bookmark this link] | Status | Request for examination was made Status updated on 08.03.2024 Database last updated on 04.11.2024 | Most recent event Tooltip | 08.10.2024 | The date on which the examining division becomes responsible, has been established | 08.10.2024 | Amendment by applicant | Applicant(s) | For all designated states Samsung Electronics Co., Ltd. 129, Samsung-ro Yeongtong-gu Suwon-si, Gyeonggi-do 16677 / KR | [2024/15] | Inventor(s) | 01 /
LEE, Joonggeun 16677 Suwon-si / KR | 02 /
JEONG, Daechul 16677 Suwon-si / KR | 03 /
BAE, Jeongyeol 16677 Suwon-si / KR | 04 /
LEE, Jongsoo 16677 Suwon-si / KR | 05 /
YOO, Sangmin 16677 Suwon-si / KR | [2024/15] | Representative(s) | Marks & Clerk LLP 15 Fetter Lane London EC4A 1BW / GB | [2024/15] | Application number, filing date | 23192031.5 | 17.08.2023 | [2024/15] | Priority number, date | KR20220128659 | 07.10.2022 Original published format: KR 20220128659 | KR20220180454 | 21.12.2022 Original published format: KR 20220180454 | [2024/15] | Filing language | EN | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | EP4351008 | Date: | 10.04.2024 | Language: | EN | [2024/15] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 13.02.2024 | Classification | IPC: | H04B1/04 | [2024/15] | CPC: |
H04B1/0458 (EP,US);
H03F3/195 (US);
H03F3/245 (US);
H04B2001/0408 (EP);
H04B2001/0416 (US)
| Designated contracting states | AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, ME, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR [2024/18] |
| Former [2024/15] | AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, ME, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR | Extension states | BA | Not yet paid | Validation states | KH | Not yet paid | MA | Not yet paid | MD | Not yet paid | TN | Not yet paid | Title | German: | RF-CHIP ZUR VERBESSERUNG DER FLACHHEIT DES SENDEKANALS | [2024/15] | English: | RF CHIP TO IMPROVE TRANSMIT CHANNEL FLATNESS | [2024/15] | French: | PUCE RF POUR AMÉLIORER LA PLANÉITÉ DE CANAL DE TRANSMISSION | [2024/15] | Examination procedure | 17.08.2023 | Examination requested [2024/15] | 08.10.2024 | Amendment by applicant (claims and/or description) | 08.10.2024 | Date on which the examining division has become responsible |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [A]US5758269 (WU HOWARD X [US]); | [I]US7151411 (MARTIN JAMES [US], et al); | [XI]US2015280651 (UZUNKOL MEHMET [US], et al) |