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EP4346233

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Extract from the Register of European Patents

EP About this file: EP4346233

EP4346233 - SEMICONDUCTOR DEVICE AND ELECTRONIC APPARATUS [Right-click to bookmark this link]
Status	The patent has been granted Status updated on 16.05.2025 Database last updated on 26.03.2026
Former	Grant of patent is intended Status updated on 22.01.2025
Former	Request for examination was made Status updated on 30.08.2024
Former	The application has been published Status updated on 01.03.2024
Most recent event Tooltip	20.03.2026	Lapse of the patent in a contracting state New state(s): RO	published on 22.04.2026 [2026/17]
Applicant(s)	For all designated states Seiko Epson Corporation 1-6, Shinjuku 4-chome Shinjuku-ku Tokyo 160-8801 / JP
	[2024/14]
Inventor(s)	01 / KATAYAMA, Takao Suwa-shi, 392-8502 / JP
	02 / FUKUZAWA, Akihiro Suwa-shi, 392-8502 / JP
	03 / BAISHO, Fumihito Suwa-shi, 392-8502 / JP
	04 / NONAKA, Tsutomu Suwa-shi, 392-8502 / JP
	[2024/14]
Representative(s)	Lewis Silkin LLP Arbor 255 Blackfriars Road London SE1 9AX / GB
	[2024/14]
Application number, filing date	23199921.0	26.09.2023
	[2024/14]
Priority number, date	JP20220153602	27.09.2022 Original published format: JP 2022153602
	[2024/14]
Filing language	EN
Procedural language	EN
Publication	Type:	A1 Application with search report
	No.:	EP4346233
	Date:	03.04.2024
	Language:	EN
	[2024/14]
	Type:	B1 Patent specification
	No.:	EP4346233
	Date:	18.06.2025
	Language:	EN
	[2025/25]
Search report(s)	(Supplementary) European search report - dispatched on:	EP	12.02.2024
Classification	IPC:	H04R29/00, H03F3/185, H03F3/217	[2025/07]
	CPC:	H04R29/001 (EP); H03F3/45475 (US); H03F3/185 (EP); H03F3/2173 (EP); H03H11/0466 (US); H03F2200/03 (EP); (+) H03F2200/331 (EP); H03F2200/336 (US); H03F2200/387 (US); H04R2499/13 (EP) (-)
	Former IPC [2024/14]	H04R29/00, H03F3/185
Designated contracting states	AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, ME, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR [2024/40]
Former [2024/14]	AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, ME, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR
Title	German:	HALBLEITERBAUELEMENT UND ELEKTRONISCHE VORRICHTUNG	[2024/14]
	English:	SEMICONDUCTOR DEVICE AND ELECTRONIC APPARATUS	[2024/14]
	French:	DISPOSITIF À SEMI-CONDUCTEUR ET APPAREIL ÉLECTRONIQUE	[2024/14]
Examination procedure	27.08.2024	Examination requested [2024/40]
	27.08.2024	Date on which the examining division has become responsible
	23.01.2025	Communication of intention to grant the patent
	13.05.2025	Fee for grant paid
	13.05.2025	Fee for publishing/printing paid
	13.05.2025	Receipt of the translation of the claim(s)
Opt-out from the exclusive Tooltip competence of the Unified Patent Court	See the Register of the Unified Patent Court for opt-out data
	Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Lapses during opposition Tooltip	AT	18.06.2025
	BG	18.06.2025
	CZ	18.06.2025
	EE	18.06.2025
	ES	18.06.2025
	FI	18.06.2025
	HR	18.06.2025
	LV	18.06.2025
	NL	18.06.2025
	PL	18.06.2025
	RO	18.06.2025
	SK	18.06.2025
	SM	18.06.2025
	NO	18.09.2025
	RS	18.09.2025
	GR	19.09.2025
	IS	18.10.2025
	PT	20.10.2025
	[2026/17]
Former [2026/11]	AT	18.06.2025
	BG	18.06.2025
	CZ	18.06.2025
	EE	18.06.2025
	ES	18.06.2025
	FI	18.06.2025
	HR	18.06.2025
	LV	18.06.2025
	NL	18.06.2025
	PL	18.06.2025
	SK	18.06.2025
	SM	18.06.2025
	NO	18.09.2025
	RS	18.09.2025
	GR	19.09.2025
	IS	18.10.2025
	PT	20.10.2025
Former [2026/07]	BG	18.06.2025
	FI	18.06.2025
	HR	18.06.2025
	LV	18.06.2025
	NL	18.06.2025
	NO	18.09.2025
	RS	18.09.2025
	GR	19.09.2025
	IS	18.10.2025
	PT	20.10.2025
Former [2026/03]	BG	18.06.2025
	FI	18.06.2025
	HR	18.06.2025
	LV	18.06.2025
	NL	18.06.2025
	NO	18.09.2025
	RS	18.09.2025
	GR	19.09.2025
	PT	20.10.2025
Former [2025/52]	BG	18.06.2025
	FI	18.06.2025
	HR	18.06.2025
	LV	18.06.2025
	NL	18.06.2025
	NO	18.09.2025
	RS	18.09.2025
	GR	19.09.2025
Former [2025/49]	BG	18.06.2025
	FI	18.06.2025
	HR	18.06.2025
	LV	18.06.2025
	NO	18.09.2025
	RS	18.09.2025
	GR	19.09.2025
Former [2025/48]	BG	18.06.2025
	FI	18.06.2025
	HR	18.06.2025
	NO	18.09.2025
	RS	18.09.2025
	GR	19.09.2025
Former [2025/46]	FI	18.06.2025
Documents cited:	Search	[A] US2015030167 (PAN YANG et al.)
		[A] US2012294450 (OZCAN KORAY et al.)
		[A] US2011241774 (NUSSBAUM MICHAEL et al.) [A] 1-8 * paragraphs [0022] - [0023] - [0 45] - [0051]; figure 2 *
		[A] US2022086577 (RAMAMURTHY VENKATA RAMANAN et al.) [A] 1-8 * paragraph [0087] - paragraph [0102]; figures 2, 6 *
	by applicant	JP2022153602
		JP2012199854

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