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EP4376069
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EP About this file: EP4376069
| EP4376069 - PACKAGING SUBSTRATE AND SEMICONDUCTOR PACKAGE COMPRISING THE SAME [Right-click to bookmark this link] | Status | Request for examination was made Status updated on 27.04.2024 Database last updated on 23.12.2024 | Most recent event Tooltip | 15.11.2024 | Change - designated states | published on 18.12.2024 [2024/51] | Applicant(s) | For all designated states Absolics Inc. 3000 SKC Drive Covington, GA 30014 / US | [2024/22] | Inventor(s) | 01 /
KIM, Sungjin Covington, GA 30014 / US | 02 /
WOO, Yong Ha 18469 Hwaseong-si, Gyeonggi-do / KR | [2024/22] | Representative(s) | BCKIP Part mbB MK1 Landsbergerstraße 98, 3.Stock 80339 München / DE | [N/P] |
| Former [2024/22] | BCKIP Part mbB Siegfriedstraße 8 80803 München / DE | Application number, filing date | 23210326.7 | 16.11.2023 | [2024/22] | Priority number, date | US202263427427P | 22.11.2022 Original published format: US 202263427427 P | [2024/22] | Filing language | EN | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | EP4376069 | Date: | 29.05.2024 | Language: | EN | [2024/22] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 11.04.2024 | Classification | IPC: | H01L23/14, H01L23/498, H01L23/538 | [2024/22] | CPC: |
H01L23/145 (EP);
H01L23/5389 (EP,KR);
H01L23/13 (EP,CN,KR);
H01L23/49816 (EP,KR,US);
H01L23/15 (KR);
H01L23/24 (CN);
H01L23/295 (KR);
H01L23/3128 (KR);
H01L23/315 (US);
H01L23/49894 (EP);
H01L23/562 (KR);
H01L24/02 (KR);
H01L21/4846 (EP);
H01L2224/02381 (KR);
H01L2224/0239 (KR);
H01L2224/18 (EP);
H01L2224/82 (EP);
H01L24/18 (EP);
| Designated contracting states | AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, ME, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR [2024/51] |
| Former [2024/22] | AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, ME, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR | Extension states | BA | Not yet paid | Validation states | KH | Not yet paid | MA | Not yet paid | MD | Not yet paid | TN | Not yet paid | Title | German: | GEHÄUSESUBSTRAT UND HALBLEITERGEHÄUSE DAMIT | [2024/22] | English: | PACKAGING SUBSTRATE AND SEMICONDUCTOR PACKAGE COMPRISING THE SAME | [2024/22] | French: | SUBSTRAT D'ENCAPSULATION ET BOÎTIER DE SEMI-CONDUCTEUR LE COMPRENANT | [2024/22] | Examination procedure | 16.11.2023 | Examination requested [2024/22] | 08.11.2024 | Amendment by applicant (claims and/or description) | 08.11.2024 | Date on which the examining division has become responsible |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [XI]US2012186861 (SHIMIZU KEISUKE [JP], et al); | [XI]US2019131224 (CHOI IK JUN [KR], et al); | [X]US2020161274 (LEE MINWOO [CN]) |