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WO2025010060
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EP About this file: WO2025010060
| WO2025010060 - INTERCONNECT CIRCUIT FOR PRINT COMPONENT [Right-click to bookmark this link] | Status | The international publication has been made Status updated on 18.01.2025 Database last updated on 08.04.2026 | |
| Former | unknown Status updated on 09.08.2023 | Most recent event Tooltip | 17.03.2026 | PCT data prior to European publication | Applicant(s) | For all designated states Hewlett-Packard Development Company, L.P. 10300 Energy Drive Spring TX 77389 / US | [N/P] | Inventor(s) | 01 /
QUINN, Max Corvallis, Oregon 97330-4241 / US | 02 /
BAHNSEN, Kyle Vancouver, WA 98683 / US | 03 /
SCHWEITZER, Paul Corvallis, Oregon 97330-4241 / US | 04 /
MCCOURT, Zachary T. 14100 Pulau Pinang / MY | 05 /
STUMBO, Samuel Corvallis, Oregon 97330-4241 / US | 06 /
BENSON, David J. Corvallis, Oregon 97330-4241 / US | [N/P] | Representative(s) | Hoffmann Eitle Patent- und Rechtsanwälte PartmbB Arabellastraße 30 81925 München / DE | [N/P] | Application number, filing date | 23748645.1 | 03.07.2023 | WO2023US26873 | Filing language | EN | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | WO2025010060 | Date: | 09.01.2025 | Language: | EN | [2025/02] | Search report(s) | International search report - published on: | EP | 09.01.2025 | Classification | IPC: | B41J2/175 | CPC: |
B41J2/17553 (EP);
B41J2/1753 (EP)
| Designated contracting states | AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, ME, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR | Extension states | BA | Not yet paid | Validation states | KH | Not yet paid | MA | Not yet paid | MD | Not yet paid | TN | Not yet paid | Title | German: | VERBINDUNGSSCHALTUNG FÜR DRUCKKOMPONENTE | English: | INTERCONNECT CIRCUIT FOR PRINT COMPONENT | French: | CIRCUIT D'INTERCONNEXION DESTINÉ À UN COMPOSANT D'IMPRESSION | Entry into regional phase | 02.01.2026 | National basic fee paid | 02.01.2026 | Designation fee(s) paid | 02.01.2026 | Examination fee paid | Fees paid | Renewal fee | 02.01.2026 | Renewal fee patent year 03 | Cited in | International search | [XAYI] US5189787 (REED DOUGLAS J et al.) [X] 1,2,11,32,37,39-43 * column 3 - column 5; figures 1,2,5 *[A] 3-7,12,13 [Y] 9,33,34 [I] 8,10,35,36,38 | [YA] US2003122897 (CHOU CHING-YU et al.) [Y] 9,33,34 * paragraph [0027] - paragraph [0032]; figures 1-4 *[A] 1,12 |