EP4375798 - ELECTRONIC DEVICE COMPRISING MIC MODULE [Right-click to bookmark this link] | Status | Request for examination was made Status updated on 27.04.2024 Database last updated on 24.08.2024 | |
Former | The international publication has been made Status updated on 20.04.2024 | ||
Former | unknown Status updated on 12.12.2023 | Most recent event Tooltip | 27.04.2024 | Publication in section I.1 EP Bulletin | published on 29.05.2024 [2024/22] | 27.04.2024 | Request for examination filed | published on 29.05.2024 [2024/22] | Applicant(s) | For all designated states Samsung Electronics Co., Ltd. 129, Samsung-ro Yeongtong-gu Suwon-si, Gyeonggi-do 16677 / KR | [2024/22] | Inventor(s) | 01 /
LEE, Youngmin Suwon-si, Gyeonggi-do 16677 / KR | [2024/22] | Representative(s) | Arnold & Siedsma Bezuidenhoutseweg 57 2594 AC The Hague / NL | [2024/22] | Application number, filing date | 23817291.0 | 11.10.2023 | [2024/22] | WO2023KR15642 | Priority number, date | KR20220129956 | 11.10.2022 Original published format: KR 20220129956 | KR20220143633 | 01.11.2022 Original published format: KR 20220143633 | [2024/22] | Filing language | KO | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | WO2024080751 | Date: | 18.04.2024 | Language: | KO | [2024/16] | Type: | A1 Application with search report | No.: | EP4375798 | Date: | 29.05.2024 | Language: | EN | [2024/22] | Search report(s) | International search report - published on: | KR | 18.04.2024 | Classification | IPC: | G06F1/16, H04R1/28, H04R1/08 | [2024/22] | CPC: |
G06F1/1626 (EP);
G06F1/1656 (EP);
G06F1/1684 (EP);
H04M1/02 (EP);
H04M1/03 (EP);
H04M1/035 (EP);
| Designated contracting states | AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, ME, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR [2024/22] | Extension states | BA | Not yet paid | Validation states | KH | Not yet paid | MA | Not yet paid | MD | Not yet paid | TN | Not yet paid | Title | German: | ELEKTRONISCHE VORRICHTUNG MIT MIC-MODUL | [2024/22] | English: | ELECTRONIC DEVICE COMPRISING MIC MODULE | [2024/22] | French: | DISPOSITIF ÉLECTRONIQUE COMPRENANT UN MODULE DE MICROPHONE | [2024/22] | Entry into regional phase | 12.12.2023 | Translation filed | 12.12.2023 | National basic fee paid | 12.12.2023 | Search fee paid | 12.12.2023 | Designation fee(s) paid | 12.12.2023 | Examination fee paid | Examination procedure | 12.12.2023 | Examination requested [2024/22] |
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Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Cited in | International search | [XY]KR20190022094 (SAMSUNG ELECTRONICS CO LTD [KR]); | [X]KR20190057286 (LG ELECTRONICS INC [KR]); | [A]KR20200060751 (GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP LTD [CN]); | [Y]WO2021248929 (GMEMS TECH SHENZHEN LTD [CN]); | [A]KR20220131764 (SAMSUNG ELECTRONICS CO LTD [KR]) |