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EP4366094
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EP About this file: EP4366094
| EP4366094 - METHOD OF ASSEMBLING A CIRCUIT CARD ASSEMBLY [Right-click to bookmark this link] | Status | The application has been published Status updated on 05.04.2024 Database last updated on 02.11.2024 | Most recent event Tooltip | 14.06.2024 | Publication of search report | published on 17.07.2024 [2024/29] | 14.06.2024 | Change - classification | published on 17.07.2024 [2024/29] | 14.06.2024 | Change - classification | published on 17.07.2024 [2024/29] | Applicant(s) | For all designated states Rosemount Aerospace Inc. 14300 Judicial Road Burnsville, MN 55306-4898 / US | [2024/19] | Inventor(s) | 01 /
DEANGELO, Tim Edina / US | [2024/19] | Representative(s) | Dehns 10 Old Bailey London EC4M 7NG / GB | [N/P] |
| Former [2024/19] | Dehns St. Bride's House 10 Salisbury Square London EC4Y 8JD / GB | Application number, filing date | 24160288.7 | 11.05.2018 | [2024/19] | Priority number, date | US201715601362 | 22.05.2017 Original published format: US201715601362 | [2024/19] | Filing language | EN | Procedural language | EN | Publication | Type: | A2 Application without search report | No.: | EP4366094 | Date: | 08.05.2024 | Language: | EN | [2024/19] | Type: | A3 Search report | No.: | EP4366094 | Date: | 17.07.2024 | Language: | EN | [2024/29] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 19.06.2024 | Classification | IPC: | H05K1/11, H01R12/52, H05K3/36, H01R12/58, B33Y80/00, // H05K1/14 | [2024/29] | CPC: |
H01R12/58 (EP,US);
B33Y80/00 (EP,US);
H01R12/52 (EP,US);
H01R43/205 (US);
H05K1/11 (EP,US);
H05K1/144 (EP,US);
H05K3/007 (US);
H05K3/366 (EP,US);
H05K3/368 (EP,US);
H05K3/4644 (US);
H05K1/145 (EP,US);
H05K2201/042 (EP,US);
H05K2201/10189 (EP,US);
H05K2201/10295 (EP,US);
H05K2201/10318 (US);
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| Former IPC [2024/19] | H01R12/58 | Designated contracting states | AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR [2024/19] | Title | German: | VERBINDER VON PLATTE ZU PLATTE UND MONTAGESTRUKTUR | [2024/19] | English: | METHOD OF ASSEMBLING A CIRCUIT CARD ASSEMBLY | [2024/19] | French: | CONNECTEURS CARTE À CARTE ET STRUCTURE DE MONTAGE | [2024/19] | Parent application(s) Tooltip | EP18171913.9 / EP3407688 | Fees paid | Renewal fee | 20.03.2024 | Renewal fee patent year 03 | 20.03.2024 | Renewal fee patent year 04 | 20.03.2024 | Renewal fee patent year 05 | 20.03.2024 | Renewal fee patent year 06 | 20.03.2024 | Renewal fee patent year 07 |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [XY]DE10107630 (CONTINENTAL TEVES AG & CO OHG [DE]); | [A]WO2008009505 (SIEMENS AG [DE], et al); | [Y]US2016120040 (ELMIEH BABACK [US], et al); | [XY]DE102014224696 (ZAHNRADFABRIK FRIEDRICHSHAFEN [DE]) |