-
EP4478409
European procedure
- EP About this file
- EP Legal status
- EP Federated register
- EP Event history
- EP Citations
- EP Patent family
- EP All documents
Extract from the Register of European Patents
EP About this file: EP4478409
| EP4478409 - DEEP VIA CONNECTIONS FOR TYCHE INTERCONNECTS [Right-click to bookmark this link] | Status | Request for examination was made Status updated on 10.10.2025 Database last updated on 21.03.2026 | |
| Former | The application has been published Status updated on 15.11.2024 | Most recent event Tooltip | 21.03.2026 | New entry: Renewal fee paid | Applicant(s) | For all designated states Intel Corporation 2200 Mission College Boulevard Santa Clara, CA 95054 / US | [2024/51] | Inventor(s) | 01 /
Bohr, Mark Aloha, OR 97007 / US | 02 /
Kobrinsky, Mauro Portland, OR 97229 / US | 03 /
Nabors, Marni Portland, OR 97229 / US | [2024/51] | Representative(s) | Goddar, Heinz J. Boehmert & Boehmert Anwaltspartnerschaft mbB Pettenkoferstrasse 22 80336 München / DE | [2024/51] | Application number, filing date | 24208359.0 | 19.04.2019 | [2024/51] | Priority number, date | US201816003031 | 07.06.2018 Original published format: US201816003031 | [2024/51] | Filing language | EN | Procedural language | EN | Publication | Type: | A2 Application without search report | No.: | EP4478409 | Date: | 18.12.2024 | Language: | EN | [2024/51] | Type: | A3 Search report | No.: | EP4478409 | Date: | 09.04.2025 | Language: | EN | [2025/15] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 12.03.2025 | Classification | IPC: | H10D84/01, H10D84/03, H10D84/83, H10D30/62, H01L23/485, H01L21/768, H10D88/00, H01L23/528, H01L25/065, // H01L23/31, H01L21/56, H01L23/00 | [2025/15] | CPC: |
H10D84/0158 (EP,CN,US);
H10W20/43 (US);
H10D30/6219 (EP,US);
H10D62/115 (US);
H10D84/0149 (EP,CN,US);
H10D84/0151 (US);
H10D84/038 (EP,CN,US);
H10D84/834 (EP,CN,US);
H10W10/014 (US);
H10W10/17 (US);
H10W20/023 (EP);
H10W20/056 (US);
H10W20/069 (EP);
H10W20/081 (US);
H10W20/2134 (EP);
H10W20/40 (EP);
H10W20/427 (EP);
H10W20/481 (EP);
H10W74/117 (EP,US);
H10W90/00 (EP);
H10W20/42 (US);
H10W72/072 (EP);
H10W72/241 (EP);
H10W72/252 (EP);
H10W72/352 (EP);
H10W74/012 (EP);
H10W74/15 (EP,US);
|
| Former IPC [2024/51] | H01L25/065 | Designated contracting states | AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR [2024/51] | Title | German: | TIEFE DURCHKONTAKTIERUNGSVERBINDUNGEN FÜR TYCHE-VERBINDUNGEN | [2024/51] | English: | DEEP VIA CONNECTIONS FOR TYCHE INTERCONNECTS | [2024/51] | French: | CONNEXIONS DE TROU D'INTERCONNEXION PROFONDES POUR INTERCONNEXIONS DE TYCHE | [2024/51] | Examination procedure | 06.10.2025 | Amendment by applicant (claims and/or description) | 06.10.2025 | Examination requested [2025/46] | 06.10.2025 | Date on which the examining division has become responsible | Parent application(s) Tooltip | EP19170433.7 / EP3629368 | Fees paid | Renewal fee | 23.10.2024 | Renewal fee patent year 03 | 23.10.2024 | Renewal fee patent year 04 | 23.10.2024 | Renewal fee patent year 05 | 23.10.2024 | Renewal fee patent year 06 | 26.03.2025 | Renewal fee patent year 07 | 20.03.2026 | Renewal fee patent year 08 |
| Opt-out from the exclusive Tooltip competence of the Unified Patent Court | See the Register of the Unified Patent Court for opt-out data | ||
| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [XI] US2008087932 (SON YANG-SOO et al.) [X] 1,3-9,11-15 * figures 1, 2 *[I] 2,10 | [X] US2007007532 (KANG SUNG-KWAN et al.) [X] 1-15 * figure 7 * | [XI] US9711501 (BASKER VEERARAGHAVAN S et al.) [X] 1,3,5-9,11,13-15 * column 4, line 64 - column 8, line 25; figures 1-13 *[I] 2,10 |