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EP0004033
European procedure
Extract from the Register of European Patents
EP About this file: EP0004033
| EP0004033 - Process for equalizing the material removal rate of wafers by polishing [Right-click to bookmark this link] | Status | No opposition filed within time limit Status updated on 14.09.2016 Database last updated on 29.07.2024 | Most recent event Tooltip | 14.09.2016 | No opposition filed within time limit | Applicant(s) | For all designated states Wacker-Chemitronic Gesellschaft für Elektronik-Grundstoffe mbH Johannes-Hess-Strasse 24 D-84489 Burghausen / DE | [N/P] | Inventor(s) | 01 /
Krämer, Hans, Chem.-Ing.grad. Immanuel-Kant-Strasse 49c D-8263 Burghausen / DE | 02 /
Kirschner, Helmuth, Chem.-Ing.grad Händel-Strasse 7 D-8263 Burghausen / DE | [N/P] | Application number, filing date | 79100602.6 | 01.03.1979 | Priority number, date | DE19782809274 | 03.03.1978 Original published format: DE 2809274 | Filing language | DE | Procedural language | DE | Publication | Type: | A1 Application with search report | No.: | EP0004033 | Date: | 19.09.1979 | Language: | DE | [N/P] | Type: | B1 Patent specification | No.: | EP0004033 | Date: | 07.01.1981 | Language: | DE | [1981/01] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 04.07.1979 | Classification | IPC: | B24B1/00, B24B37/04, H01L21/302 | [1981/01] | CPC: |
B24B37/042 (EP,US)
| Designated contracting states | BE, DE, FR, GB, IT, NL | Title | German: | Verfahren zur Vergleichmässigung des Polierabtrages von Scheiben beim Polieren | English: | Process for equalizing the material removal rate of wafers by polishing | French: | Procédé pour égaliser l'enlèvement de matière au cours du polissage de plaquettes | Examination procedure | 24.08.1979 | Examination requested | 23.11.1979 | Despatch of a communication from the examining division (Time limit: M06) | 21.02.1980 | Reply to a communication from the examining division | 30.06.1980 | Despatch of communication of intention to grant (Approval: ) | 16.07.1980 | Communication of intention to grant the patent | 18.09.1980 | Fee for grant paid | 18.09.1980 | Fee for publishing/printing paid | Opposition(s) | 02.03.1982 | No opposition filed within time limit [ N /P ] |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | DE1014873 [ ]; | DD29614 [ ]; | US2565590 [ ] (BULLARD EARL J); | US3631634 [ ] (WEBER JOHN L); | US3888053 [ ] (WHITE JOSEPH PAUL, et al); | DE2608427 [ ] (WACKER CHEMITRONIC); | DE2712521 [ ] (WACKER CHEMITRONIC) | [ ] - SOLID STATE TECHNOLOGY, Band 20, Oktober 1977, Long Island N.Y., A.C. BONORA "Flex-Mount Polishing of Silicon Wafers", Seiten 55 bis 58 * Seite 57, rechte Spalte untenSeite 58 * |