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Extract from the Register of European Patents

EP About this file: EP0028187

EP0028187 - Pluggable-board support with electrical and thermal connection [Right-click to bookmark this link]
StatusNo opposition filed within time limit
Status updated on  22.03.1985
Database last updated on 13.11.2024
Most recent event   Tooltip22.03.1985No opposition filed within time limitpublished on 22.05.1985 [1985/21]
Applicant(s)For all designated states
SOCAPEX
10 bis, quai Léon Blum
F-92153 Suresnes / FR
[1982/21]
Former [1981/18]For all designated states
SOCAPEX
10 bis, quai Léon Blum
F-92153 Suresnes / FR
Inventor(s)01 / Seytre, Bruno
"THOMSON-CSF" SCPI 173, Bld Hausmann
F-75360 Paris Cedex 08 / FR
02 / Bricaud, Henri
"THOMSON-CSF" SCPI 173, Bld Haussmann
F-75360 Paris Cedex 08 / FR
[1981/18]
Representative(s)Vesin, Jacques, et al
Thomson-CSF Propriété Intellectuelle 173 Boulevard Haussmann
75379 Paris Cedex 08 / FR
[N/P]
Former [1982/21]Vesin, Jacques, et al
THOMSON-CSF SCPI 173, Bld Haussmann
F-75379 Paris Cedex 08 / FR
Former [1981/18]Vesin, Jacques
THOMSON-CSF SCPI 173, bld Haussmann
F-75360 Paris Cedex 08 / FR
Application number, filing date80401490.021.10.1980
[1981/18]
Priority number, dateFR1979002661326.10.1979         Original published format: FR 7926613
[1981/18]
Filing languageFR
Procedural languageFR
PublicationType: A1 Application with search report 
No.:EP0028187
Date:06.05.1981
Language:FR
[1981/18]
Type: B1 Patent specification 
No.:EP0028187
Date:16.05.1984
Language:FR
[1984/20]
Search report(s)(Supplementary) European search report - dispatched on:EP04.02.1981
ClassificationIPC:H01R23/70, H05K7/20
[1981/18]
CPC:
H01R12/7005 (EP,US)
Designated contracting statesDE,   GB,   IT [1984/07]
Former [1981/18]BE,  DE,  GB,  IT,  NL,  SE 
TitleGerman:Halter für einsteckbare Karte mit elektrischer und thermischer Verbindung[1981/18]
English:Pluggable-board support with electrical and thermal connection[1981/18]
French:Support pour carte enfichable à raccordement électrique et thermique[1981/18]
Examination procedure24.06.1981Examination requested  [1981/36]
23.12.1981Despatch of a communication from the examining division (Time limit: M04)
17.04.1982Reply to a communication from the examining division
04.08.1983Despatch of communication of intention to grant (Approval: )
25.10.1983Communication of intention to grant the patent
31.12.1983Fee for grant paid
31.12.1983Fee for publishing/printing paid
Opposition(s)19.02.1985No opposition filed within time limit [1985/21]
Fees paidRenewal fee
20.09.1982Renewal fee patent year 03
17.09.1983Renewal fee patent year 04
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Documents cited:SearchDE1965851  [ ] (GEN MOTORS CORP);
 US4063791  [ ] (CUTCHAW JOHN M)
    [ ] - IBM TECHNICAL DISCLOSURE BULLETIN, Vol. 20, No. 9, Fevrier 1978 New York US K.P. MORAN et al.: "Spring-Loaded module connectors for mounting an array of modules on circuit board", pages 3434-3435 * Pages 3434-3435 *
    [ ] - IBM TECHNICAL DISCLOSURE BULLETIN Vol. 18, Nr. 3, Aout 1975, New York US R.H.A. WATSON: "Full semiconductor wafer package", page 642 * Page 642 *
    [ ] - IBM TECHNICAL DISCLOSURE BULLETIN Vol. 20, Nr. 11A, Avril 1978 New York US P.W. HARDIN: "Integral edge connector", pages 4346-4348. * Page 4348 *
Examination   - IBM TECHNICAL DISCLOSURE BULLETIN, vol. 20, nr. 11A, avril 1978 New York US P.W. HARDIN: "Integral edge connector", pages 4346-4348
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.