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Extract from the Register of European Patents

EP About this file: EP0098318

EP0098318 - Process for the formation of grooves having essentially vertical lateral silicium walls by reactive ion etching [Right-click to bookmark this link]
StatusNo opposition filed within time limit
Status updated on  10.12.1987
Database last updated on 31.08.2024
Most recent event   Tooltip10.12.1987No opposition filed within time limitpublished on 27.01.1988 [1988/04]
Applicant(s)For all designated states
IBM DEUTSCHLAND GMBH
Pascalstrasse 100
D-70569 Stuttgart / DE
For all designated states
International Business Machines Corporation
New Orchard Road
Armonk, NY 10504 / US
[N/P]
Former [1984/03]For all designated states
IBM DEUTSCHLAND GMBH
Pascalstrasse 100
D-70569 Stuttgart / DE
For all designated states
International Business Machines Corporation
Old Orchard Road
Armonk, N.Y. 10504 / US
Inventor(s)01 / Behringer, Uwe, Dr. Dipl.-Phys.
Wolfsbergstrasse 27
D-7403 Ammerbuch / DE
02 / Greschner, Johann, Dr.
Zollernstrasse 14
D-7401 Pliezhausen / DE
03 / Trumpp, Hans-Joachim, Dr.
Pfeilstrasse 26
D-7000 Stuttgart 80 / DE
[1984/03]
Representative(s)Kreidler, Eva-Maria
Schönaicher Strasse 220
D-7030 Böblingen / DE
[N/P]
Former [1984/03]Kreidler, Eva-Maria, Dr. rer. nat.
Schönaicher Strasse 220
D-7030 Böblingen / DE
Application number, filing date82105957.303.07.1982
[1984/03]
Filing languageDE
Procedural languageDE
PublicationType: A1 Application with search report 
No.:EP0098318
Date:18.01.1984
Language:DE
[1984/03]
Type: B1 Patent specification 
No.:EP0098318
Date:11.02.1987
Language:DE
[1987/07]
Search report(s)(Supplementary) European search report - dispatched on:EP25.04.1983
ClassificationIPC:H01L21/308, H01L21/306, G03F1/00, G03F7/02
[1984/03]
CPC:
G03F1/20 (EP,US); G03F7/094 (EP,US); H01L21/0271 (EP,US);
H01L21/3065 (EP,US); H01L21/3081 (EP,US); H01L21/31138 (EP,US)
Designated contracting statesDE,   FR,   GB,   IT [1984/03]
TitleGerman:Verfahren zum Herstellen von Gräben mit im wesentlichen vertikalen Seitenwänden in Silicium durch reaktives Ionenätzen[1984/03]
English:Process for the formation of grooves having essentially vertical lateral silicium walls by reactive ion etching[1984/03]
French:Procédé pour la formation de rainures à parois latérales principalement verticales dans du silicium utilisant une attaque par ions réactifs[1984/03]
Examination procedure23.05.1984Examination requested  [1984/31]
30.05.1985Despatch of a communication from the examining division (Time limit: M04)
28.09.1985Reply to a communication from the examining division
26.03.1986Despatch of communication of intention to grant (Approval: )
05.08.1986Communication of intention to grant the patent
03.09.1986Fee for grant paid
03.09.1986Fee for publishing/printing paid
Opposition(s)12.11.1987No opposition filed within time limit [1988/04]
Fees paidRenewal fee
24.07.1984Renewal fee patent year 03
12.07.1985Renewal fee patent year 04
04.07.1986Renewal fee patent year 05
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Documents cited:Search[AD]WO8000639  (WESTERN ELECTRIC CO [US]);
 [A]EP0012859  (IBM [US]);
 [A]EP0048291  (IBM DEUTSCHLAND [DE], et al)
 [A]  - IEEE TRANSACTIONS ON ELECTRON DEVICES. Band ED-28, Nr. 11, November 1981, Seiten 1405-1410, New York, USA
 [A]  - JOURNAL OF THE ELECTROCHEMICAL SOCIETY, Band 126, Nr. 6, Juni 1979, Seiten 1024-1028, Princeton, USA
 [A]  - EXTENDED ABSTRACTS, Band 79-2, 14.-19. Oktober 1979, Seiten 1521-1523, Princeton, N.J., USA
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.