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EP0141467
European procedure
Extract from the Register of European Patents
EP About this file: EP0141467
| EP0141467 - Device for applying a fixing medium to electronic components, more particularly to chip-type components [Right-click to bookmark this link] | Status | No opposition filed within time limit Status updated on 24.11.1988 Database last updated on 24.08.2024 | Most recent event Tooltip | 24.11.1988 | No opposition filed within time limit | published on 11.01.1989 [1989/02] | Applicant(s) | For all designated states Koninklijke Philips Electronics N.V. Groenewoudseweg 1 5621 BA Eindhoven / NL | [N/P] |
| Former [1985/20] | For all designated states Philips Electronics N.V. Groenewoudseweg 1 NL-5621 BA Eindhoven / NL | Inventor(s) | 01 /
van Gastel, Josephus Martinus Maria c/o INT. OCTROOIBUREAU B.V. Prof. Holstlaan 6 NL-5656 AA Eindhoven / NL | 02 /
van Nunen, Hendrikus Theodorus c/o INT. OCTROOIBUREAU B.V. Prof. Holstlaan 6 NL-5656 AA Eindhoven / NL | 03 /
Sanders, Leonardus Cornelis Maria c/o INT. OCTROOIBUREAU B.V. Prof. Holstlaan 6 NL-5656 AA Eindhoven / NL | [1985/20] | Representative(s) | Hartung, Edgar Erwin, et al INTERNATIONAAL OCTROOIBUREAU B.V. Prof. Holstlaan 6 NL-5656 AA Eindhoven / NL | [1985/20] | Application number, filing date | 84201566.1 | 31.10.1984 | [1985/20] | Priority number, date | NL19830003797 | 04.11.1983 Original published format: NL 8303797 | [1985/20] | Filing language | EN | Procedural language | EN | Publication | Type: | A2 Application without search report | No.: | EP0141467 | Date: | 15.05.1985 | Language: | EN | [1985/20] | Type: | A3 Search report | No.: | EP0141467 | Date: | 12.06.1985 | Language: | EN | [1985/24] | Type: | B1 Patent specification | No.: | EP0141467 | Date: | 27.01.1988 | Language: | EN | [1988/04] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 09.04.1985 | Classification | IPC: | H05K13/04 | [1985/20] | CPC: |
H05K3/305 (EP,US);
H05K13/0469 (EP,US);
H05K2201/10636 (EP,US);
H05K2201/10984 (EP,US);
H05K2203/0195 (EP,US);
H05K2203/0537 (EP,US);
Y02P70/50 (EP,US)
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| Designated contracting states | AT, BE, CH, DE, FR, GB, IT, LI, NL, SE [1985/20] | Title | German: | Vorrichtung zum Auftragen eines Befestigungsmediums auf elektronische Bauteile, insbesondere auf Bauteile des Plättchentyps | [1985/20] | English: | Device for applying a fixing medium to electronic components, more particularly to chip-type components | [1985/20] | French: | Dispositif pour appliquer un moyen de fixation à des composants électroniques, en particulier à des composants du type plaquette | [1988/04] |
| Former [1985/20] | Dispositif pour appliquer un milieu de fixation à des composants électroniques, en particulier à des composants du type plaquette | Examination procedure | 10.12.1985 | Examination requested [1986/08] | 16.02.1987 | Despatch of communication of intention to grant (Approval: ) | 26.05.1987 | Communication of intention to grant the patent | 18.08.1987 | Fee for grant paid | 18.08.1987 | Fee for publishing/printing paid | Opposition(s) | 28.10.1988 | No opposition filed within time limit [1989/02] | Fees paid | Renewal fee | 21.10.1986 | Renewal fee patent year 03 | 21.10.1987 | Renewal fee patent year 04 |
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