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EP0134166
European procedure
Extract from the Register of European Patents
EP About this file: EP0134166
| EP0134166 - Wafer fabrication by implanting through protective layer [Right-click to bookmark this link] | Status | No opposition filed within time limit Status updated on 25.01.1989 Database last updated on 10.07.2024 | Most recent event Tooltip | 25.01.1989 | No opposition filed within time limit | published on 15.03.1989 [1989/11] | Applicant(s) | For all designated states FAIRCHILD CAMERA & INSTRUMENT CORPORATION 464 Ellis Street Mountain View California 94042 / US | [N/P] |
| Former [1985/11] | For all designated states FAIRCHILD CAMERA & INSTRUMENT CORPORATION 464 Ellis Street Mountain View California 94042 / US | Inventor(s) | 01 /
Howell, Paul J. 6 Fran Circle Gray Maine 04039 / US | 02 /
Currier, Gregory B. 9 Mast Lane Yarmouth Maine 04096 / US | [1985/11] | Representative(s) | Chareyron, Lucien, et al Service Brevets Patent Department Etudes et Productions Schlumberger BP 202 92142 Clamart Cédex / FR | [N/P] |
| Former [1985/11] | Chareyron, Lucien, et al Service Brevets Patent Department Etudes et Productions Schlumberger BP 202 F-92142 Clamart Cédex / FR | Application number, filing date | 84401427.4 | 05.07.1984 | [1985/11] | Priority number, date | US19830510761 | 05.07.1983 Original published format: US 510761 | [1985/11] | Filing language | EN | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | EP0134166 | Date: | 13.03.1985 | Language: | EN | [1985/11] | Type: | B1 Patent specification | No.: | EP0134166 | Date: | 16.03.1988 | Language: | EN | [1988/11] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 15.11.1984 | Classification | IPC: | H01L21/265, H01L21/82 | [1985/11] | CPC: |
H01L29/66272 (EP,US);
H01L21/02263 (EP);
H01L21/033 (EP,US);
H01L21/2652 (EP,US);
H01L21/3145 (US);
H01L21/7621 (EP,US);
| Designated contracting states | DE, FR, GB, IT, NL [1985/11] | Title | German: | Plättchenherstellung mittels Implantation durch Schutzschichten | [1985/11] | English: | Wafer fabrication by implanting through protective layer | [1985/11] | French: | Fabrication de plaquette par implantation à travers les couches de protection | [1985/11] | Examination procedure | 09.08.1985 | Examination requested [1985/43] | 19.06.1986 | Despatch of a communication from the examining division (Time limit: M06) | 12.12.1986 | Reply to a communication from the examining division | 22.05.1987 | Despatch of communication of intention to grant (Approval: ) | 14.09.1987 | Communication of intention to grant the patent | 21.11.1987 | Fee for grant paid | 21.11.1987 | Fee for publishing/printing paid | Opposition(s) | 17.12.1988 | No opposition filed within time limit [1989/11] | Fees paid | Renewal fee | 21.06.1986 | Renewal fee patent year 03 | 24.06.1987 | Renewal fee patent year 04 |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [A]EP0007923 (IBM [US]); | [AD]US4199380 (FARRELL MICHAEL G [US], et al) |