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EP0170022
European procedure
Extract from the Register of European Patents
EP About this file: EP0170022
| EP0170022 - Semiconductor power device package for surface mounting [Right-click to bookmark this link] | Status | No opposition filed within time limit Status updated on 02.08.1990 Database last updated on 14.03.2026 | Most recent event Tooltip | 02.08.1990 | No opposition filed within time limit | published on 19.09.1990 [1990/38] | Applicant(s) | For all designated states International Business Machines Corporation New Orchard Road Armonk, NY 10504 / US | [N/P] |
| Former [1986/06] | For all designated states International Business Machines Corporation Old Orchard Road Armonk, N.Y. 10504 / US | Inventor(s) | 01 /
Schrottke, Gustav 11101 Spicewood Parkway Austin Texas 78750 / US | 02 /
Talkington, Alan Lee 1006 Deet Run Round Rock Texas, 78664 / US | [1986/06] | Representative(s) | Colas, Alain Compagnie IBM France Département de Propriété Intellectuelle 06610 La Gaude / FR | [N/P] |
| Former [1986/06] | Colas, Alain Compagnie IBM France Département de Propriété Intellectuelle F-06610 La Gaude / FR | Application number, filing date | 85107440.1 | 19.06.1985 | [1986/06] | Priority number, date | US19840636189 | 31.07.1984 Original published format: US 636189 | [1986/06] | Filing language | EN | Procedural language | EN | Publication | Type: | A2 Application without search report | No.: | EP0170022 | Date: | 05.02.1986 | Language: | EN | [1986/06] | Type: | A3 Search report | No.: | EP0170022 | Date: | 22.04.1987 | Language: | EN | [1987/17] | Type: | B1 Patent specification | No.: | EP0170022 | Date: | 11.10.1989 | Language: | EN | [1989/41] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 05.03.1987 | Classification | IPC: | H01L21/60, H01L23/48, H01L23/36 | [1986/06] | CPC: |
H10W40/255 (EP);
H10W72/30 (EP);
H10W72/60 (EP);
H10W72/075 (EP);
H10W72/381 (EP);
H10W72/534 (EP);
H10W72/5363 (EP);
H10W72/5366 (EP);
H10W72/884 (EP);
| Designated contracting states | DE, FR, GB [1986/06] | Title | German: | Packung einer Leistungshalbleiteranordnung für die Montage auf einer Oberfläche | [1986/06] | English: | Semiconductor power device package for surface mounting | [1986/06] | French: | Empaquetage de dispositif semi-conducteur à puissance pour le montage sur une surface | [1986/06] | File destroyed: | 15.01.2000 | Examination procedure | 23.05.1986 | Examination requested [1986/30] | 19.12.1988 | Despatch of communication of intention to grant (Approval: Yes) | 10.04.1989 | Communication of intention to grant the patent | 22.04.1989 | Fee for grant paid | 22.04.1989 | Fee for publishing/printing paid | Opposition(s) | 12.07.1990 | No opposition filed within time limit [1990/38] | Fees paid | Renewal fee | 23.06.1987 | Renewal fee patent year 03 | 21.06.1988 | Renewal fee patent year 04 | 27.06.1989 | Renewal fee patent year 05 |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [A] IBM TECHNICAL DISCLOSURE BULLETIN, vol. 22, no. 2, July 1979, page 522, New York, US; S.K. WADHWA: "Low-cost circuit packaging" [A] | [A] IBM TECHNICAL DISCLOSURE BULLETIN, vol. 26, no. 10B, March 1984, pages 5764,5765, New York, US; K.A. VANDERLEE: "Substrate for high power packaging" [A] | [A] ELECTRONIC DESIGN, vol. 28, no. 18, 1st September 1980, page 42, Waseca MN, Denville New Jersey, US; R. SHINN: "Overmold packages firm up TO-220 advantages" [A] |