-
EP0183925
European procedure
Extract from the Register of European Patents
EP About this file: EP0183925
| EP0183925 - Process for etching the walls of through-holes in synthetic-resin boards to be used in the manufacture of printed circuits [Right-click to bookmark this link] | Status | No opposition filed within time limit Status updated on 21.03.1991 Database last updated on 16.11.2024 | Most recent event Tooltip | 21.03.1991 | No opposition filed within time limit | published on 08.05.1991 [1991/19] | Applicant(s) | For all designated states Schering Aktiengesellschaft 13342 Berlin / DE | [N/P] |
| Former [1986/24] | For all designated states SCHERING AKTIENGESELLSCHAFT D-13342 Berlin / DE | Inventor(s) | 01 /
Grapentin, Hans-Joachim Wundstrasse 17 D-1000 Berlin 19 / DE | 02 /
Schaar, Detlef Röntgenstrasse 9 D-1000 Berlin 10 / DE | [1986/24] | Application number, filing date | 85111347.2 | 07.09.1985 | [1986/24] | Priority number, date | DE19843437084 | 05.10.1984 Original published format: DE 3437084 | [1986/24] | Filing language | DE | Procedural language | DE | Publication | Type: | A2 Application without search report | No.: | EP0183925 | Date: | 11.06.1986 | Language: | DE | [1986/24] | Type: | A3 Search report | No.: | EP0183925 | Date: | 23.09.1987 | Language: | DE | [1987/39] | Type: | B1 Patent specification | No.: | EP0183925 | Date: | 23.05.1990 | Language: | DE | [1990/21] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 06.08.1987 | Classification | IPC: | C23C18/24 | [1986/24] | CPC: |
H05K3/0055 (EP);
H05K3/381 (EP);
H05K2203/0789 (EP);
H05K2203/125 (EP);
H05K3/181 (EP)
| Designated contracting states | BE, CH, DE, FR, GB, IT, LI, LU, NL, SE [1986/24] | Title | German: | Verfahren zum An- und Abätzen von Kunststoffschichten in Bohrungen von Basismaterial für Leiterplatten | [1986/24] | English: | Process for etching the walls of through-holes in synthetic-resin boards to be used in the manufacture of printed circuits | [1986/24] | French: | Procédé pour décaper les parois des trous aménagés dans les plaques en résine synthétique destinées à la fabrication des circuits imprimés | [1986/24] | Examination procedure | 07.09.1985 | Examination requested [1986/24] | 06.02.1989 | Despatch of a communication from the examining division (Time limit: M06) | 04.08.1989 | Reply to a communication from the examining division | 22.09.1989 | Despatch of communication of intention to grant (Approval: Yes) | 13.10.1989 | Communication of intention to grant the patent | 13.12.1989 | Fee for grant paid | 13.12.1989 | Fee for publishing/printing paid | Opposition(s) | 26.02.1991 | No opposition filed within time limit [1991/19] | Fees paid | Renewal fee | 19.08.1987 | Renewal fee patent year 03 | 16.08.1988 | Renewal fee patent year 04 | 14.08.1989 | Renewal fee patent year 05 |
| Opt-out from the exclusive Tooltip competence of the Unified Patent Court | See the Register of the Unified Patent Court for opt-out data | ||
| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [X]US3523874 (DEY ARABINDA N); | [X]DE1209844 ; | [X]DE1694724 (PERNIX ENTHONE S A SOC) |