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Extract from the Register of European Patents

EP About this file: EP0227851

EP0227851 - Process for obtaining photoresist patterns [Right-click to bookmark this link]
StatusNo opposition filed within time limit
Status updated on  28.12.1991
Database last updated on 24.08.2024
Most recent event   Tooltip28.09.2007Lapse of the patent in a contracting statepublished on 31.10.2007  [2007/44]
Applicant(s)For:DE 
IBM DEUTSCHLAND GMBH
Pascalstrasse 100
D-70569 Stuttgart / DE
For:FR  GB  IT 
International Business Machines Corporation
New Orchard Road
Armonk, NY 10504 / US
[N/P]
Former [1987/28]For:DE 
IBM DEUTSCHLAND GMBH
Pascalstrasse 100
D-70569 Stuttgart / DE
For:FR  GB  IT 
International Business Machines Corporation
Old Orchard Road
Armonk, N.Y. 10504 / US
Inventor(s)01 / Moritz, Holger
72 Cherry Blossom Drive
San Jose CA 95123 / US
02 / Pietsch, Dieter
Hermannstrasse 6
D-7037 Magstadt / DE
03 / Wüstenhagen, Jürgen, Dr.
Amsterdamer Strasse 7
D-7030 Böblingen / DE
04 / Ziegler, Johanna
Dresdener Strasse 37
D-7032 Sindelfingen / DE
[1991/09]
Former [1987/28]01 / Moritz, Holger
72 Cherry Blossom Drive
San Jose CA 95123 / US
02 / Pietsch, Peter
Hermannstrasse 6
D-7037 Magstadt / DE
03 / Wüstenhagen, Jürgen, Dr.
Amsterdamer Strasse 7
D-7030 Böblingen / DE
04 / Ziegler, Johanna
Dresdener Strasse 37
D-7032 Sindelfingen / DE
Representative(s)Mönig, Anton
IBM Deutschland Informationssysteme GmbH, Patentwesen und Urheberrecht
70548 Stuttgart / DE
[N/P]
Former [1990/29]Mönig, Anton, Dipl.-Ing.
IBM Deutschland Informationssysteme GmbH, Patentwesen und Urheberrecht
D-70548 Stuttgart / DE
Former [1987/28]Oechssler, Dietrich, Dr. rer. nat.
IBM Deutschland GmbH Patentwesen und Urheberrecht Schönaicher Strasse 220
D-71032 Böblingen / DE
Application number, filing date85116430.121.12.1985
[1987/28]
Filing languageDE
Procedural languageDE
PublicationType: A1 Application with search report 
No.:EP0227851
Date:08.07.1987
Language:DE
[1987/28]
Type: B1 Patent specification 
No.:EP0227851
Date:27.02.1991
Language:DE
[1991/09]
Search report(s)(Supplementary) European search report - dispatched on:EP17.10.1986
ClassificationIPC:G03F7/20, G03F1/00
[1987/28]
CPC:
G03F7/70433 (EP); G03F1/36 (EP); G03F7/2022 (EP)
Designated contracting statesDE,   FR,   GB,   IT [1987/28]
TitleGerman:Verfahren zum Herstellen eines Photolackmusters[1987/28]
English:Process for obtaining photoresist patterns[1987/28]
French:Procédé pour réaliser des modèles dans une couche de photoréserve[1987/28]
File destroyed:15.01.2000
Examination procedure23.10.1987Examination requested  [1987/52]
14.04.1989Despatch of a communication from the examining division (Time limit: M04)
16.08.1989Reply to a communication from the examining division
26.09.1989Despatch of a communication from the examining division (Time limit: M04)
23.12.1989Reply to a communication from the examining division
14.03.1990Despatch of communication of intention to grant (Approval: No)
15.06.1990Despatch of communication of intention to grant (Approval: later approval)
22.06.1990Communication of intention to grant the patent
02.08.1990Fee for grant paid
02.08.1990Fee for publishing/printing paid
Opposition(s)28.11.1991No opposition filed within time limit [1992/08]
Fees paidRenewal fee
11.12.1987Renewal fee patent year 03
30.11.1988Renewal fee patent year 04
14.12.1989Renewal fee patent year 05
10.12.1990Renewal fee patent year 06
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Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Lapses during opposition  TooltipIT27.02.1991
[1999/42]
Documents cited:Search[X]JP60135949  ;
 [X]US4308337  ;
 [X]DE2854045
 [X]  - IBM TECHNICAL DISCLOSURE BULLETIN, Band 21, Nr. 12, Mai 1979, Seite 4787, New York, US; O.R. ABOLAFIA: "Tapered vias in a photosensitive dielectric film"
 [X]  - IBM TECHNICAL DISCLOSURE BULLETIN, Band 25. Nr. 4, September 1982, Seite 2057, New York, US; E. COURTENS: "Enhancement of edge exposure by modified photolithography masks for proximity printing on thick resists"
 [X]  - IBM TECHNICAL DISCLOSURE BULLETIN, Band 23, Nr. 2, Juli 1980, Seiten 826-827, New York, US; J.L. SPEIDELL: " "Trench" elimination from ion etching"
 [X]  - PATENTS ABSTRACTS OF JAPAN, Band 9, Nr. 299 (P-408)[2022], 27. November 1985; & JP-A-60 135 949 (MATSUSHITA DENKO K.K.) 19-07-1985, & JP60135949 A 00000000
 [A]  - XEROX DISCLOSURE JOURNAL, Band 7, Nr. 4, Juli/August 1982, Seiten 293-294, Stamford, Connecticut, US; R.B. RAUCH: "A double exposure technique for positive resist lift-off"
 [A]  - MICROELECTRONIC ENGINEERING, Band 1, Nr. 4, Dezember 1983, Seiten 295-300, Elsevier Publishers B.V., Amsterdam, NL; K. ISMAIL: "A novel method for submicron structurization using optical projection lithography"
 [A]  - IBM TECHNICAL DISCLOSURE BULLETIN, Band 18, Nr. 7, Dezember 1975, Seite 2179, New York, US; J.E. KULAK et al.: "Tool for blanket exposure of photopolymer films"
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.