EP0171111 - Process to superpose two positive photoresist layers [Right-click to bookmark this link] | Status | The application is deemed to be withdrawn Status updated on 10.06.1988 Database last updated on 02.11.2024 | Most recent event Tooltip | 07.07.2007 | Change - inventor | published on 08.08.2007 [2007/32] | Applicant(s) | For:BE
LU
NL
BELL TELEPHONE MANUFACTURING COMPANY Naamloze Vennootschap Francis Wellesplein 1 B-2018 Antwerp / BE | For:CH
DE
FR
GB
IT
LI
SE
AT
International Standard Electric Corporation 320 Park Avenue New York New York 10022 / US | [N/P] |
Former [1986/07] | For:BE
LU
NL
BELL TELEPHONE MANUFACTURING COMPANY Naamloze Vennootschap Francis Wellesplein 1 B-2018 Antwerp / BE | ||
For:CH
DE
FR
GB
IT
LI
SE
AT
International Standard Electric Corporation 320 Park Avenue New York New York 10022 / US | Inventor(s) | 01 /
Beernaert, Dirk Maurice Perreveld 97 B-9660 Brakel / BE | 02 /
Horre, Rudy Eddy Batavialaan 61 B-8800 Roeselare / BE | [1986/07] | Representative(s) | Vermeersch, Robert, et al BELL TELEPHONE MANUFACTURING COMPANY Naamloze Vennootschap Patent Department Francis Wellesplein 1 B-2018 Antwerpen / BE | [N/P] |
Former [1986/07] | Vermeersch, Robert, et al BELL TELEPHONE MANUFACTURING COMPANY Naamloze Vennootschap Patent Department Francis Wellesplein 1 B-2018 Antwerpen / BE | Application number, filing date | 85201166.7 | 11.07.1985 | [1986/07] | Priority number, date | BE19842060459 | 13.07.1984 Original published format: BE 2060459 | [1986/07] | Filing language | EN | Procedural language | EN | Publication | Type: | A2 Application without search report | No.: | EP0171111 | Date: | 12.02.1986 | Language: | EN | [1986/07] | Type: | A3 Search report | No.: | EP0171111 | Date: | 22.07.1987 | Language: | EN | [1987/30] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 03.06.1987 | Classification | IPC: | G03F7/02 | [1986/07] | CPC: |
H01L21/0271 (EP)
| Designated contracting states | DE, FR, GB [1986/15] |
Former [1986/07] | AT, BE, CH, DE, FR, GB, IT, LI, LU, NL, SE | Title | German: | Verfahren zur Überlagerung von zwei Photolackschichten | [1986/07] | English: | Process to superpose two positive photoresist layers | [1986/07] | French: | Procédé pour la superposition de deux couches photoréserves | [1986/07] | File destroyed: | 12.08.1994 | Examination procedure | 13.10.1985 | Loss of particular rights, legal effect: designated state(s) | 12.11.1985 | Despatch of communication of loss of particular rights: designated state(s) AT, BE, CH, IT, LU, NL, SE | 01.08.1987 | Application deemed to be withdrawn, date of legal effect [1988/30] | 04.03.1988 | Despatch of communication that the application is deemed to be withdrawn, reason: renewal fee not paid in time [1988/30] | Fees paid | Penalty fee | Penalty fee Rule 85a EPC 1973 | 12.08.1985 | AT   M02   Not yet paid | 12.08.1985 | BE   M02   Not yet paid | 12.08.1985 | CH   M02   Not yet paid | 12.08.1985 | IT   M02   Not yet paid | 12.08.1985 | LU   M02   Not yet paid | 12.08.1985 | NL   M02   Not yet paid | 12.08.1985 | SE   M02   Not yet paid | Penalty fee Rule 85b EPC 1973 | 22.01.1988 | M02   Not yet paid | Additional fee for renewal fee | 31.07.1987 | 03   M06   Not yet paid |
Opt-out from the exclusive Tooltip competence of the Unified Patent Court | See the Register of the Unified Patent Court for opt-out data | ||
Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [X]DE3131031 | [X] - IBM TECHNICAL DISCLOSURE BULLETIN, vol. 26, no. 3B, August 1983, page 1728, New YorkUS; C.T. HORNG et al.: "Superimposition of photoresist patterns" | [X] - INTERNATIONAL ELECTRON DEVICES MEETING TECHNICAL DIGEST, Washington, D.C., 8th-10th December 1980, pages 412-414, Electron Devices Society of IEEE, New YorkUS; C. LI et al.: "A high resolution double layer photoresist structure for lift-off technology" | [X] - IBM TECHNICAL DISCLOSURE BULLETIN, vol. 26, no. 3B, August 1983, page 1729, New YorkUS; C.T. HORNG et al.: "Photoresist structure for lifting off sputtered metal films" | [X] - CHEMICAL ABSTRACTS; vol. 99, no. 24, December 1983, page 537, abstract no. 203487f, Columbus, Ohio, US; B.D. CANTOS et al.: "Lift-off lithography using low-frequency plasma buffer layers", & PROC. ELECTROHEM. SOC. 1983, 83/10(Proc. Symp. Plasma Process.4th) 192-8 | [X] - D.J. ELLIOTT: "Integrated circuit fabrication technology", 1982, pages 1-41, Mc-Graw-Hill, New YorkUS; "IC fabrication processes: An overview" |