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Extract from the Register of European Patents

EP About this file: EP0171111

EP0171111 - Process to superpose two positive photoresist layers [Right-click to bookmark this link]
StatusThe application is deemed to be withdrawn
Status updated on  10.06.1988
Database last updated on 02.11.2024
Most recent event   Tooltip07.07.2007Change - inventorpublished on 08.08.2007  [2007/32]
Applicant(s)For:BE  LU  NL 
BELL TELEPHONE MANUFACTURING COMPANY Naamloze Vennootschap
Francis Wellesplein 1
B-2018 Antwerp / BE
For:CH  DE  FR  GB  IT  LI  SE  AT 
International Standard Electric Corporation
320 Park Avenue New York
New York 10022 / US
[N/P]
Former [1986/07]For:BE  LU  NL 
BELL TELEPHONE MANUFACTURING COMPANY Naamloze Vennootschap
Francis Wellesplein 1
B-2018 Antwerp / BE
For:CH  DE  FR  GB  IT  LI  SE  AT 
International Standard Electric Corporation
320 Park Avenue
New York New York 10022 / US
Inventor(s)01 / Beernaert, Dirk Maurice
Perreveld 97
B-9660 Brakel / BE
02 / Horre, Rudy Eddy
Batavialaan 61
B-8800 Roeselare / BE
[1986/07]
Representative(s)Vermeersch, Robert, et al
BELL TELEPHONE MANUFACTURING COMPANY Naamloze Vennootschap Patent Department Francis Wellesplein 1
B-2018 Antwerpen / BE
[N/P]
Former [1986/07]Vermeersch, Robert, et al
BELL TELEPHONE MANUFACTURING COMPANY Naamloze Vennootschap Patent Department Francis Wellesplein 1
B-2018 Antwerpen / BE
Application number, filing date85201166.711.07.1985
[1986/07]
Priority number, dateBE1984206045913.07.1984         Original published format: BE 2060459
[1986/07]
Filing languageEN
Procedural languageEN
PublicationType: A2 Application without search report 
No.:EP0171111
Date:12.02.1986
Language:EN
[1986/07]
Type: A3 Search report 
No.:EP0171111
Date:22.07.1987
Language:EN
[1987/30]
Search report(s)(Supplementary) European search report - dispatched on:EP03.06.1987
ClassificationIPC:G03F7/02
[1986/07]
CPC:
H01L21/0271 (EP)
Designated contracting statesDE,   FR,   GB [1986/15]
Former [1986/07]AT,  BE,  CH,  DE,  FR,  GB,  IT,  LI,  LU,  NL,  SE 
TitleGerman:Verfahren zur Überlagerung von zwei Photolackschichten[1986/07]
English:Process to superpose two positive photoresist layers[1986/07]
French:Procédé pour la superposition de deux couches photoréserves[1986/07]
File destroyed:12.08.1994
Examination procedure13.10.1985Loss of particular rights, legal effect: designated state(s)
12.11.1985Despatch of communication of loss of particular rights: designated state(s) AT, BE, CH, IT, LU, NL, SE
01.08.1987Application deemed to be withdrawn, date of legal effect  [1988/30]
04.03.1988Despatch of communication that the application is deemed to be withdrawn, reason: renewal fee not paid in time  [1988/30]
Fees paidPenalty fee
Penalty fee Rule 85a EPC 1973
12.08.1985AT   M02   Not yet paid
12.08.1985BE   M02   Not yet paid
12.08.1985CH   M02   Not yet paid
12.08.1985IT   M02   Not yet paid
12.08.1985LU   M02   Not yet paid
12.08.1985NL   M02   Not yet paid
12.08.1985SE   M02   Not yet paid
Penalty fee Rule 85b EPC 1973
22.01.1988M02   Not yet paid
Additional fee for renewal fee
31.07.198703   M06   Not yet paid
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Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Documents cited:Search[X]DE3131031
 [X]  - IBM TECHNICAL DISCLOSURE BULLETIN, vol. 26, no. 3B, August 1983, page 1728, New YorkUS; C.T. HORNG et al.: "Superimposition of photoresist patterns"
 [X]  - INTERNATIONAL ELECTRON DEVICES MEETING TECHNICAL DIGEST, Washington, D.C., 8th-10th December 1980, pages 412-414, Electron Devices Society of IEEE, New YorkUS; C. LI et al.: "A high resolution double layer photoresist structure for lift-off technology"
 [X]  - IBM TECHNICAL DISCLOSURE BULLETIN, vol. 26, no. 3B, August 1983, page 1729, New YorkUS; C.T. HORNG et al.: "Photoresist structure for lifting off sputtered metal films"
 [X]  - CHEMICAL ABSTRACTS; vol. 99, no. 24, December 1983, page 537, abstract no. 203487f, Columbus, Ohio, US; B.D. CANTOS et al.: "Lift-off lithography using low-frequency plasma buffer layers", & PROC. ELECTROHEM. SOC. 1983, 83/10(Proc. Symp. Plasma Process.4th) 192-8
 [X]  - D.J. ELLIOTT: "Integrated circuit fabrication technology", 1982, pages 1-41, Mc-Graw-Hill, New YorkUS; "IC fabrication processes: An overview"
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.