Extract from the Register of European Patents

EP About this file: EP0192093

EP0192093 - Semiconductor device and method of manufacturing the same [Right-click to bookmark this link]
StatusNo opposition filed within time limit
Status updated on  13.04.1991
Database last updated on 28.02.2026
Most recent event   Tooltip13.04.1991No opposition filed within time limitpublished on 05.06.1991 [1991/23]
Applicant(s)For all designated states
Kabushiki Kaisha Toshiba
72, Horikawa-cho
Saiwai-ku
Kawasaki-shi
Kanagawa-ken 210-8572 / JP
[N/P]
Former [1986/35]For all designated states
KABUSHIKI KAISHA TOSHIBA
72, Horikawa-cho, Saiwai-ku
Kawasaki-shi, Kanagawa-ken 210, Tokyo / JP
Inventor(s)01 / Kobayashi, Kiyoshi
Patent Division, K.K. TOSHIBA 1-1 Shibaura 1-ch.
Minato-ku Tokyo 105 / JP
02 / Ochii, Kiyofumi
Patent Division, K.K. TOSHIBA 1-1 Shibaura 1-ch.
Minato-ku Tokyo 105 / JP
03 / Inatsuki, Tatsuya
Patent Division, K.K. TOSHIBA 1-1 Shibaura 1-ch.
Minato-ku Tokyo 105 / JP
[1986/35]
Representative(s)Eitle, Werner, et al
Hoffmann Eitle, Patent- und Rechtsanwälte, Postfach 81 04 20
81904 München / DE
[N/P]
Former [1986/35]Eitle, Werner, Dipl.-Ing., et al
Hoffmann, Eitle & Partner, Patent- und Rechtsanwälte, Postfach 81 04 20
D-81904 München / DE
Application number, filing date86101172.429.01.1986
[1986/35]
Priority number, dateJP1985001613930.01.1985         Original published format: JP 1613985
JP1985001614030.01.1985         Original published format: JP 1614085
[1986/35]
Filing languageEN
Procedural languageEN
PublicationType: A1 Application with search report 
No.:EP0192093
Date:27.08.1986
Language:EN
[1986/35]
Type: B1 Patent specification 
No.:EP0192093
Date:13.06.1990
Language:EN
[1990/24]
Search report(s)(Supplementary) European search report - dispatched on:EP03.07.1986
ClassificationIPC:H01L27/10, H01L27/06
[1986/35]
CPC:
H10D84/406 (EP,US); H10B10/00 (EP,US); H10D88/00 (EP,US);
H10P32/14 (EP,US); H10W20/01 (EP,US); H10W20/4451 (EP,US)
Designated contracting statesDE,   FR,   GB [1986/35]
TitleGerman:Halbleitervorrichtung und Methode zu deren Herstellung[1986/35]
English:Semiconductor device and method of manufacturing the same[1986/35]
French:Dispositif semi-conducteur et procédé pour sa fabrication[1986/35]
MiscellaneousEPB 1990/24: Teilanmeldung 89116769.4 eingereicht am 29/01/86
EPB 1990/24: Divisional application 89116769.4 filed on 29/01/86
EPB 1990/24: Demande divisionnaire 89116769.4 déposée le 29/01/86
Examination procedure29.01.1986Examination requested  [1986/35]
03.02.1988Despatch of a communication from the examining division (Time limit: M06)
03.08.1988Reply to a communication from the examining division
06.10.1988Despatch of a communication from the examining division (Time limit: M04)
07.02.1989Reply to a communication from the examining division
07.07.1989Despatch of communication of intention to grant (Approval: Yes)
17.11.1989Communication of intention to grant the patent
05.02.1990Fee for grant paid
05.02.1990Fee for publishing/printing paid
Divisional application(s)EP89116769.4  / EP0349021
EP89116770.2  / EP0349022
Opposition(s)14.03.1991No opposition filed within time limit [1991/23]
Fees paidRenewal fee
19.01.1988Renewal fee patent year 03
13.01.1989Renewal fee patent year 04
12.12.1989Renewal fee patent year 05
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Documents cited:Search[A]   ELEKTRONIK, vol. 33, no. 26, 28th December 1984, page 26, Franzis Verlag, Mnchen, DE; H. LEMME: "HiBi-CMOS-Technologie der Zukunft?" [A]
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