EP0197276 - Process to manufacture printed circuit boards (PCB'S) and related new products [Right-click to bookmark this link] | Status | The application is deemed to be withdrawn Status updated on 06.09.1990 Database last updated on 15.07.2024 | Most recent event Tooltip | 07.07.2007 | Change - inventor | published on 08.08.2007 [2007/32] | Applicant(s) | For all designated states TELETTRA Telefonia Elettronica e Radio S.p.A. Corso Buenos Aires 77/A Milano / IT | [1986/42] | Inventor(s) | 01 /
Marengo, Giuseppe Piazza S. Agostino 18 Milan / IT | [1986/42] | Representative(s) | Incollingo, Italo Telettra S.p.A Patent Department Via Trento no. 30 20059 Vimercate (Milano) / IT | [N/P] |
Former [1986/42] | Incollingo, Italo Telettra S.p.A Patent Department Via Trento no. 30 I-20059 Vimercate (Milano) / IT | Application number, filing date | 86102413.1 | 25.02.1986 | [1986/42] | Priority number, date | IT19850020284 | 09.04.1985 Original published format: IT 2028485 | [1986/42] | Filing language | EN | Procedural language | EN | Publication | Type: | A2 Application without search report | No.: | EP0197276 | Date: | 15.10.1986 | Language: | EN | [1986/42] | Type: | A3 Search report | No.: | EP0197276 | Date: | 20.05.1987 | Language: | EN | [1987/21] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 31.03.1987 | Classification | IPC: | H05K3/10, H05K3/00 | [1986/42] | CPC: |
H05K3/207 (EP,US);
H05K3/1266 (EP,US);
H05K2201/0347 (EP,US);
H05K2203/0517 (EP,US)
| Designated contracting states | AT, BE, CH, DE, FR, GB, LI, NL, SE [1986/42] | Title | German: | Verfahren zur Herstellung von gedruckten Leiterplatten und damit hergestellte neue Produkte | [1986/42] | English: | Process to manufacture printed circuit boards (PCB'S) and related new products | [1986/42] | French: | Procédé de fabrication de circuits imprimés et produits ainsi obtenus | [1986/42] | File destroyed: | 02.03.1998 | Examination procedure | 02.10.1987 | Examination requested [1987/50] | 12.12.1989 | Despatch of a communication from the examining division (Time limit: M04) | 24.04.1990 | Application deemed to be withdrawn, date of legal effect [1990/43] | 28.05.1990 | Despatch of communication that the application is deemed to be withdrawn, reason: reply to the communication from the examining division not received in time [1990/43] | Fees paid | Renewal fee | 03.05.1988 | Renewal fee patent year 03 | 18.04.1989 | Renewal fee patent year 04 | 16.02.1990 | Renewal fee patent year 05 | Penalty fee | Additional fee for renewal fee | 29.02.1988 | 03   M06   Fee paid on   03.05.1988 | 28.02.1989 | 04   M06   Fee paid on   18.04.1989 |
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Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [Y]US3352731 (SCHWERTZ FREDERICK A, et al); | [A]DE2006134 ; | [A]US4066453 (LIND ERWIN, et al); | [A]EP0043085 (HOECHST AG [DE]); | [A]EP0054310 (KARNIKOWSKI HERBERT); | [A]WO8304092 (DATA CARD CORP [US]); | [Y]US4439815 (CLOSE ANTHONY D [US], et al) | [A] - TRANSACTIONS OF THE INSTITUTE OF METAL FINISHING, vol. 61, no. 2, 1983, pages 60-63, London, GB; D.R. GABE: "Electroplating for electronic applications: A process reappraisal" |